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Colored photosensitive resin composition and light shielding spacer prepared therefrom

A technology of photosensitive resin and composition, applied in photosensitive materials, optomechanical equipment, optics and other directions for optomechanical equipment, can solve problems such as pinholes and uneven coating, and achieve the improvement of resolution limit and illumination limit Effect

Pending Publication Date: 2016-05-25
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these conventional compositions are aimed at improving the liquid-repellent properties when these compositions are developed into films; therefore, it may involve, for example, uneven coating (in areas where a coating solution has not been applied) of polyimide and When a polyimide-based alignment solution is applied to a film formed from the composition in subsequent steps of the method, the problem of pinholes caused by the liquid-repellent properties of the solution

Method used

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  • Colored photosensitive resin composition and light shielding spacer prepared therefrom
  • Colored photosensitive resin composition and light shielding spacer prepared therefrom
  • Colored photosensitive resin composition and light shielding spacer prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0109] Preparation Example 1: Copolymer

[0110] 100 g of the monomer mixture shown in Table 1 below, 300 g of PGMEA as a solvent, and 2 g of 2,2′-azobis(2,4-dimethylvaleronitrile) as a radical polymerization initiator were placed in a 500 mL circle bottom flask equipped with a reflux condenser and a stirrer. The temperature was raised to 70°C, and the mixture was stirred for 5 hours for polymerization, resulting in a copolymer with a solids content of 31% by weight. The copolymer thus produced had an acid value of 100 mgKOH / g, and a polystyrene reference weight average molecular weight (Mw) of 20,000 as measured by gel permeation chromatography.

[0111] [Table 1]

[0112]

preparation example 2

[0113] Preparation Example 2: Compound Derived from Epoxy Resin Having Dibenzopyran Main Chain Structure

[0114] 160 g of PGMEA as a solvent was placed in a flask equipped with a stirrer, a thermometer, a nitrogen replacement device, and a reflux condenser. Subsequently, 100 g of (3,3'-(spiro[fluorene-9,9'-dibenzopyran]-3',6'-diylbis(oxyl))bis((2- Hydroxypropane-3,1-diyl)diacrylate) and 0.1g hexachloroplatinum, then the mixture was heated to 80°C. 47.6g1,2,4,5-cyclohexanetetracarboxylic dianhydride were dissolved in 80 g of PGMEA, then slowly added dropwise to the above mixture. The mixture was then heated to 100° C. and reacted for 2 hours. The mixture was cooled to room temperature (25° C.) and added together with 0.3 g of pyridinium p-toluenesulfonate. , a copolymer compound having a solid content of 50% by weight, an acid value of 107 mgKOH / g, and a Mw of 6,000 was obtained.

preparation example 3

[0115] Preparation Example 3: Colored Dispersion

[0116] With the copolymer obtained in the above-mentioned preparation example 1 of 8g, 8g polymer dispersant (Dispic-2000, Bi Ke), 12g carbon black, 53g as the lactam black of organic black (Black582, BASF), 16gC.I . Pigment Blue 15:6 and 384 g of PGMEA as a solvent were placed in a paintershaker, and the mixture was dispersed at 25°C to 60°C for 6 hours. This dispersion step was performed with 0.3 mm zirconia beads. When the dispersion step is completed, the beads and the dispersion are separated, thereby producing a colored dispersion.

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Abstract

The invention provides a colored photosensitive resin composition. The colored photosensitive resin composition includes a copolymer, a polymer compounds, a photopolymerization initiator, colorants, and surfactants including an olefinic unsaturated group, and chlorine and silicon components. When the colored photosensitive resin composition forms a curing film. The film is lyophilic with the oriental solution based on polyimide and satisfies characteristics, such as elastic recovery, resolution, chemical resistance and optical density. Therefore the colored photosensitive resin composition can be used for manufacturing various electronic components, such as panels for LCD and OLED displays.

Description

technical field [0001] The present invention relates to a colored photosensitive resin composition suitable for forming a passivation layer, an interlayer dielectric, a spacer, a light shielding member used in a panel of a liquid crystal display (LCD) or an organic light emitting diode (OLED) display, and A light-shielding spacer prepared from the composition. Background technique [0002] Recently, a spacer formed of a photosensitive resin composition is used to maintain a distance between an upper transparent substrate and a lower transparent substrate in a liquid crystal cell of an LCD. An LCD is an electro-optical device driven by applying a voltage to a liquid crystal material injected into a constant gap between two transparent substrates, where it is critical to maintain a constant gap between the two substrates. If the gap between the transparent substrates is not constant, the voltage applied to it and the light transmittance through this area may vary, leading to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/0007G03F7/004G03F7/0045G03F7/027G03F7/033G03F7/0388G02B5/223C09B11/24C09B67/0033
Inventor 金莲玉崔庆植朴锡凤
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC