Phenol formaldehyde amine epoxy curing agent and preparation method thereof

An epoxy curing agent, phenalkamine technology, applied in chemical instruments and methods, preparation of organic compounds, preparation of amino hydroxyl compounds, etc., can solve the problem that phenalkamine products cannot fully meet the needs and other problems, and achieve high hardness and high temperature resistance. Sexual, high-intensity effects

Active Publication Date: 2016-06-08
雅安市弘利展化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

None of the current phenalkamine

Method used

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  • Phenol formaldehyde amine epoxy curing agent and preparation method thereof
  • Phenol formaldehyde amine epoxy curing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Formulation of phenalkamine epoxy curing agent:

[0035] N,N-di(3-aminopropyl)ethylenediamine 1740g;

[0036] Styrenated phenol 2200g;

[0037] 37% formaldehyde solution 810g.

[0038] Shaw (Shore) hardness test method:

[0039] The Shore D-type hardness tester in GB-T2411-2008 "Plastic Shore Hardness Test Method" is used for testing.

[0040] Put 1740g of N,N-bis(3-aminopropyl)ethylenediamine and 2200g of styrenated phenol into a 5L three-necked flask equipped with a stirring and dropping reflux device, raise the temperature to 80°C, and slowly add 37% of The formaldehyde solution was 810g in total, and the temperature was kept at 95°C for 1 hour to complete the dropwise addition. After the dropwise addition was completed, the temperature was kept at 95°C for 3 hours. Then start the vacuum distillation and keep the temperature at 100°C. When there is no distillate, increase the temperature and continue distillation until the vacuum degree reaches -0.09MPa, the temp...

Embodiment 2

[0043] Formulation of phenalkamine epoxy curing agent:

[0044] N,N-bis(3-aminopropyl)ethylenediamine 2088g;

[0045] Styrenated phenol 1760g;

[0046] Paraformaldehyde 360g.

[0047] 2088 g of N,N-bis(3-aminopropyl)ethylenediamine and 1760 g of styrenated phenol were put into a 5 L three-neck flask equipped with a stirring and dropping reflux device, and the temperature was raised to 80°C. Then keep the temperature at 90° C. and add 360 g of paraformaldehyde in 10 batches within 2 hours. After the addition was complete, the temperature was maintained at 95°C for 3 hours. Then start the vacuum distillation and keep the temperature at 100°C. When there is no distillate, increase the temperature and continue distillation until the vacuum degree reaches -0.09MPa, the temperature reaches 120°C, and when there is no distillate, complete the distillation. 208 g of low boilers were distilled off. Cool the material in the reaction bottle to 60°C and discharge at room temperature....

Embodiment 3

[0085] Formulation of phenalkamine epoxy curing agent:

[0086] N,N-di(3-aminopropyl)ethylenediamine 1740g;

[0087] Styrenated phenol 2200g;

[0088] 37% formaldehyde solution 810g.

[0089] Put 1740g of N,N-bis(3-aminopropyl)ethylenediamine and 2200g of styrenated phenol into a 5L three-necked flask equipped with a stirring and dropping reflux device, raise the temperature to 80°C, and slowly add 37% of A total of 810g of formaldehyde solution was added dropwise at 95°C for 1 hour. After the dropwise addition, 200g of diethyl malonate and 150g of p-hydroxybenzoic acid were added, and the temperature was kept at 95°C for 3 hours. Then start the vacuum distillation and keep the temperature at 100°C. When there is no distillate, increase the temperature and continue distillation until the vacuum degree reaches -0.09MPa, the temperature reaches 120°C, and when there is no distillate, complete the distillation. About 680 g of low boilers were distilled off. Cool the material ...

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Abstract

The invention discloses a phenol formaldehyde amine epoxy curing agent which is prepared from the following raw materials in parts by weight: 30-60 parts of N,N-di(3-aminopropyl)ethylenediamine, 5-30 parts of formyl compound and 20-60 parts of phenolic group compound. The combination of the curing agent and the epoxy resin has the advantages of very high scratch resistance, high wear resistance and high temperature resistance.

Description

technical field [0001] The invention relates to the technical field of epoxy resin curing agents, in particular to a phenalkamine epoxy curing agent and a preparation method thereof. Background technique [0002] The floor refers to the ground that uses specific materials and techniques to carry out construction treatment on the original ground and presents a certain degree of decoration and functionality. Such as epoxy self-leveling floor, emery wear-resistant floor, epoxy terrazzo floor, cement-based terrazzo, epoxy colored sand floor, epoxy anti-static floor, epoxy anti-slip floor, polyurea anti-corrosion floor, polyurethane floor Floor, silicon PU floor, concrete seal curing agent floor, etc. [0003] Epoxy resin is an important class of thermosetting plastics. It is widely used in adhesives, coatings, etc. It is also called artificial resin, artificial resin, resin glue, etc. Artificial resin is a thermosetting epoxy polymer. Chloropropane and bisphenol A (2,2-bis(4-h...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08L63/00C09J163/00C09D163/00C07C213/02C07C215/50
CPCC07C213/02C08G59/5033C08L63/00C09D163/00C09J163/00C07C215/50
Inventor 徐庆鑫吴洪斌杨旭明闵峻
Owner 雅安市弘利展化工有限公司
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