Cyanide-free sulfite Au-Cu alloy electroplating solution and application

A cyanide-free sulfite and alloy electroplating solution technology, which is applied in the field of special processing, can solve problems such as different process ranges and no coating test results, and achieve good stability, good flatness, and no cracks in the plating solution. Effect

Inactive Publication Date: 2016-06-15
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In patent CN105112953A gold plating, the main complexing agent is sulfite, and the stabilizer is carboxylic acid or organic polyphosphoric acid, but the organic polyphosphoric acid does not include HEDP in the present invention, and the process range is also different, and no detailed coating is given. Test results

Method used

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  • Cyanide-free sulfite Au-Cu alloy electroplating solution and application
  • Cyanide-free sulfite Au-Cu alloy electroplating solution and application
  • Cyanide-free sulfite Au-Cu alloy electroplating solution and application

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Embodiment 1

[0018] The technical scheme of the present invention is: a cyanide-free pulse electroplating gold-copper alloy plating solution and its process using sodium sulfite-HEDP as a complexing agent, selecting sodium sulfite and HEDP as a complexing agent, and adopting the method of pulse electroplating, specific production steps as follows:

[0019] 1) The composition ratio of the plating solution: gold (added in the form of sodium gold sulfite, sodium gold sulfite 21.6g / L) 10g / L, copper sulfate 1g / L, sodium sulfite 170g / L, hydroxyethylidene diphosphonic acid HEDP60g / L, potassium sulfate 80g / L.

[0020] 2) According to the formula, weigh the required amount of sodium sulfite powder and potassium sulfate powder and place them in a beaker, add an appropriate amount of distilled water into the beaker, and stir the mixture into a paste; weigh the required amount of HEDP into the beaker, and stir evenly ; Pipette the calculated amount of sodium gold sulfite solution, add it to the beak...

Embodiment 2

[0025] 1) The composition ratio of the plating solution: gold (added in the form of sodium gold sulfite, sodium gold sulfite 25.9g / L) 12g / L, copper sulfate 0.5g / L, sodium sulfite 140g / L, HEDP60g / L, potassium sulfate 60g / L.

[0026] 2) The electroplating process parameters are: current density 0.3A / dm 2 , Duty ratio 10%, pulse frequency 1000Hz, plating solution pH value 9, electroplating temperature 60°C. The hardness of the obtained coating is 192.88Hv, the surface is fine and uniform, the porosity is low, and the flatness is good.

Embodiment 3

[0028] 1) The composition ratio of the plating solution: gold (added in the form of sodium gold sulfite, sodium gold sulfite 17.3g / L) 8g / L, copper sulfate 1.5g / L, sodium sulfite 170g / L, HEDP80g / L, potassium sulfate 80g / L.

[0029] 2) The electroplating process parameters are: current density 0.4A / dm 2 , Duty ratio 10%, pulse frequency 1000Hz, plating solution pH value 9.5, electroplating temperature 40°C. The hardness of the obtained coating is 203.89Hv, the surface is fine and uniform, the porosity is low, and the flatness is good.

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Abstract

The invention provide cyanide-free sulfite Au-Cu alloy electroplating solution. The Au-Cu alloy electroplating solution comprises sulfite gold salt, copper sulfate, sulfite, HEDP and potassium sulfate; sulfite is a main coordination agent of Au; HEDP is an auxiliary coordination agent of Au and a main coordination agent of Cu; and the adding of HEDP can improve the electrochemical polarization so as to improve the plating layer quality and to improve the stability of sulfite gold salt. The Au-Cu alloy electroplating solution is applied to plate an Au-Cu alloy on a metal surface by using a pulse electroplating method. The plating solution is excellent in stability; an obtained plating layer only contains gold and copper elements; the surface of the plating layer is fine and uniform, low in porosity, excellent in levelness and free of cracks; and the plating layer is high in hardness and excellent in bonding force and corrosion resistance.

Description

technical field [0001] The invention belongs to the technical field of special processing, and in particular relates to a cyanosulfite-free Au-Cu alloy electroplating solution and a process thereof. Background technique [0002] Compared with pure gold coating, the gold-copper alloy coating greatly improves the hardness and wear resistance of the coating while ensuring the physical and chemical properties of gold such as good electrical conductivity and corrosion resistance. Because of its good physical and chemical properties, gold-copper alloy plating is widely used in the manufacture of electronic components such as electrical appliances and printed circuit boards, as well as in the field of fine decoration. In the traditional cyanide gold plating process, the stability of the plating solution is good, and the surface quality of the obtained coating is excellent. However, because cyanide is used as a gold complex, the plating solution is highly toxic, which is harmful to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/62
CPCC25D3/62
Inventor 金洙吉孙博宇王宇戴恒震
Owner DALIAN UNIV OF TECH
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