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Hot-pressing technology for preparing boride sputtering target material

A technology of sputtering targets and hot-pressing technology, which is applied in the field of preparing boride sputtering targets by hot-pressing technology, can solve the problems of high raw material cost of boride powder, unstable target performance, difficult sintering and densification, etc., and achieves Good sputtering performance, simple preparation method, high relative density effect

Active Publication Date: 2016-06-22
GEMCH MATERIAL TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the deficiencies based on the existing technology are still difficult to overcome, including: the cost of boride powder raw materials is high, and it is difficult to sinter and densify, and the relative density of the prepared target is low; at the same time, it is impossible to prepare relatively large targets , the large-area target is easy to crack during the preparation process, and the performance of the target is unstable, and the thermal shock resistance in the thermal shock environment is poor

Method used

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  • Hot-pressing technology for preparing boride sputtering target material

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preparation example Construction

[0021] The process steps of the preparation method of the boride sputtering target material prepared by the hot pressing process in the present invention are as follows: granulation, mold loading, loading into a hot pressing furnace, heating and pressing, blank, machining, and finished product; specifically, the following steps are included:

[0022] ⑦ Granulation: After the boride powder with purity ≥ 99.9% and particle size ≤ 5 μm has passed the quality inspection, use granulation equipment to make the powder into boride particles with a diameter of 1-3 mm;

[0023] ⑧Mould loading: install the high temperature resistant graphite mold on the mechanical equipment, fill the boride particles into the graphite mold, and use the mechanical device to vibrate;

[0024] ⑨ Furnace loading: Remove the graphite mold filled with boride particles and vibrated from the mechanical equipment and put it into a vacuum hot-press furnace;

[0025] ⑩Heating and pressurization: heat up and pressur...

Embodiment 1

[0029] Embodiment 1: as attached figure 1 As shown, TiB with a purity of 99.95% and a particle size of 4 μm 2 powder, after passing the quality inspection, use granulation equipment to granulate TiB 2 Powder made of TiB with a diameter of 2mm 2 Particles; the high temperature resistant graphite mold is installed on the mechanical equipment, and the TiB 2 Fill the particles into the graphite mold, the size of the graphite mold is 106×96×220mm, the size of the mold pressure head is 104×94×220mm, and use mechanical device to vibrate; the TiB will be filled 2 The particle and vibrated graphite mold is removed from the mechanical equipment and put into the vacuum hot-press furnace; the vacuum hot-press furnace is heated and pressurized, and the maximum temperature is set to 2000°C. When the temperature is 0-1500°C, the heating rate 5°C / min, when the temperature is 1500°C-2000°C, the heating rate is 2°C / min, and the pressure is 50MPa; after 5 hours of heat preservation, the cooli...

Embodiment 2

[0030]Embodiment 2: the purity is 99.9%, the ZrB particle size is 3 μm 2 After passing the quality inspection of the powder, the granulation equipment is used to make particles with a diameter of 3mm; the high temperature resistant graphite mold is installed on the mechanical equipment, and the ZrB 2 The particles are filled into the graphite mold and vibrated using a mechanical device; the ZrB 2 The particle and vibrated graphite mold is removed from the mechanical equipment and put into the vacuum hot-press furnace; the vacuum hot-press furnace is heated and pressurized, and the maximum temperature is set to 1800°C. When the temperature is 0-1500°C, the heating rate 6°C / min, when the temperature is 1500°C-1800°C, the heating rate is 1°C / min, and the pressure is 60MPa; after 6 hours of heat preservation, the cooling rate is 1°C / min for another 15 hours, and when it drops to 200°C, the The graphite mold was taken out from the vacuum hot-press furnace, allowed to stand and coo...

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Abstract

The invention relates to a hot-pressing technology for preparing a boride sputtering target material. A preparation method sequentially comprises the following process steps of pulverizing boride with the purity being larger than or equal to 99.9 percent and the particle size being less than or equal to 5mum to be boride particles with the diameter being 1 to 3mm; filling in a graphite jig; loading in a hot-pressing furnace; warming and pressurizing; after keeping warm for 5 to 10h, cooling to form a workblank; obtaining a finished product through machining, wherein the relative density is 85 percent to 90 percent, and the electrical resistivity is 1.0 to 3.5 ohm.cm; the boride powder forms compact blocks at high temperature and high pressure, so that the compact blocks are high in relative density, low in electrical resistivity, good in uniformity, high in stability and favorable in sputtering performance, and meets the usage requirements of the target material. The preparation method is simple and easy to implement, the complicated mold design required by adopting a traditional powder metallurgy pressing method is avoided, the molding efficiency is greatly improved, and the obtained target material is excellent in sputtering performance, less in impurities, and suitable for sputtering coatings.

Description

technical field [0001] The invention relates to C04B ceramic or C23C sputtering method coating technology in IPC classification, especially the preparation of boride sputtering target material by hot pressing process. Background technique [0002] In the field of new materials, borides and corresponding carbides have received attention and are trying to use these materials to prepare tungsten carbide carbide tool coatings to achieve wear resistance. So far, the results obtained are still very limited. [0003] Due to the covalent bond formation of boron atoms in the boride to form a network, the electrons of the boron atoms are transferred to the metal lattice, which makes the boride very inert and stable in chemical properties, and therefore exhibits high hardness, high melting point, and low corrosion resistance in protective coatings. Excellent application effects such as resistivity. Most boride coatings are prepared by CVD, but boride films can also be prepared by dire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/58C04B35/645C23C14/34
CPCC04B35/58071C04B35/58078C04B35/645C04B2235/656C04B2235/77C04B2235/96C23C14/3414
Inventor 贾泽夏庄志杰顾宗慧
Owner GEMCH MATERIAL TECH SUZHOU
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