High-thermal-conduction adhesive

A high thermal conductivity and adhesive technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of poor insulation performance of adhesives and damage to electronic components, etc., to achieve good thermal conductivity and improve thermal conductivity The effect of high stability and simple preparation process

Inactive Publication Date: 2016-06-22
FOSHAN BAIRUI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN201010155479.8 discloses a high-performance thermally conductive adhesive filled with carbon nanotubes. The average thermal conductivity of the thermally conductive adhesive reaches 25.5W / mK. Poor, this type of thermal conductive adhesive will cause the risk of damage to electronic components, and it is difficult to apply to fields with high insulation performance requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh 10 parts of AlN whiskers as thermal conductive filler, and carry out surface treatment: add 2% KH560 silane coupling agent and dissolve in alcohol, heat the alcohol to 70°C in a water bath, and stir to dissolve it evenly. Then put the AlN whisker filler to be treated into the solution, stir at 70° C. for 15 minutes, filter and dry in an oven at 80° C. for later use.

[0024] Weigh 55 parts of α,ω-dicarboxypolydimethylsiloxane, add 6 parts of dimethyl silicone oil for dilution and stir evenly, add surface-treated fillers, mix well, and then add 5 parts of February silicon Dibutyl tin acid, 12 parts of ethyl orthosilicate, 12 parts of dibutyl phthalate, and stirred for 2 hours to obtain a high thermal conductivity adhesive.

Embodiment 2

[0026] Weigh 15 parts of Si 3 N 4 Whiskers and 5 parts Si 3 N 4 The powder is used as a thermally conductive filler, and its surface treatment is carried out: add 3% KH560 silane coupling agent and dissolve it in alcohol, heat the alcohol to 70°C in a water bath, and stir to dissolve it evenly. Si will then need to be processed 3 N 4 Whiskers and Si 3 N 4 Put the powder filler into the solution, stir at 70°C for 15 minutes, then put it in an oven at 80°C for drying, and set it aside.

[0027] Weigh 50 parts of epoxy resin, add 6 parts of ethylene glycol diglycidyl ether to dilute and stir evenly, add surface-treated fillers, mix well, then add 4 parts of dibutyltin silicate, 10 parts of silicon Ethyl phthalate, 10 parts of dibutyl phthalate, stirred for 2 hours to obtain a high thermal conductivity adhesive.

Embodiment 3

[0029] Weigh 20 parts of BN whiskers and 10 parts of AlN powder as thermal conductive fillers, and perform surface treatment: add 5% KH560 silane coupling agent and dissolve in alcohol, heat the alcohol to 70°C in a water bath, and stir to dissolve it evenly. Then put the BN whiskers and AlN powder to be treated into the solution, stir at 70°C for 15 minutes, and then dry them in an oven at 80°C for later use.

[0030] Weigh 45 parts of epoxy resin, add 5 parts of polypropylene glycol diglycidyl ether to dilute and stir evenly, add surface-treated fillers, mix well, then add 3 parts of dibutyltin dilaurate, 8 parts of orthosilicic acid Ethyl ester and 9 parts of tributyl phosphate were stirred for 2.5 hours to obtain a high thermal conductivity adhesive.

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Abstract

A high-thermal-conduction adhesive includes a matrix, a thermal-conduction filler, a crosslinking agent, a plasticizer and the like, and is characterized in that the thermal-conduction filler contains a one-dimensional high-thermal-conduction insulation material; the one-dimensional material is overlapped mutually in the matrix to form a thermal-conductive network structure by using structure advantages, and the thermal conduction performance of the adhesive is greatly improved. The adhesive has good insulation performance and thermal conduction performance, and can be used in microelectronic packaging or LED illuminating industries.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an insulating adhesive with high thermal conductivity. Background technique [0002] With the development of integrated circuits and packaging technologies, electronic components are becoming smaller, lighter, and thinner. However, due to the high assembly density of electronic components, heat dissipation has become a prominent problem. If the heat generated during work cannot be dissipated in time, it will cause the working temperature of components to rise, or even fail, which will directly affect the life and reliability of the equipment used. Although traditional heat dissipation materials, such as metals and ceramics, have high thermal conductivity, they have problems in electrical insulation, processability, and adaptability to different shapes of interfaces, which limit their application fields. Adhesives can be well satisfied in terms of insulation, processability and shape ada...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J183/06C09J11/04C09J11/06
Inventor 张丹王双喜王文君
Owner FOSHAN BAIRUI NEW MATERIAL TECH CO LTD
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