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A production device for diamond wire suitable for generating an axially rotating magnetic field

A production device and diamond wire technology, applied in the field of diamond wire, can solve the problems of affecting the cutting effect, slow speed, uneven distribution, etc., and achieve the effects of saving electroplating time, high efficiency, and low internal stress

Active Publication Date: 2017-12-05
东海县太阳光新能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of these two methods are that the speed is slow, and the diamond particles are affected by their own weight and resistance during movement, so they cannot be evenly distributed on the steel wire, thus affecting the cutting effect

Method used

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  • A production device for diamond wire suitable for generating an axially rotating magnetic field

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] See figure 1 , the production device of the diamond wire of the present embodiment includes an upper sand cylinder 1, a nickel block located in the upper sand cylinder 1 and a steel wire 2 suitable for passing through the central axis of the upper sand cylinder 1, and the steel wire 2 is in the form of Negative pole, the bottom of the upper sand drum 1 is provided with a rotating magnetic field generating device, which is suitable for generating a magnetic field that rotates around the central axis of the upper sand drum, and the magnetic field lines are suitable for cutting the plating in the upper sand drum 1 when the magnetic field rotates. solution, so that a radial current is generated in the plating solution and the diamond particles treated with cations are combined with nickel ions on the steel wire 2.

[0026] The rotating magnetic field generating device includes: 2 to 8 pairs of magnetic blocks 4 arranged radially and symmetrically on the same circumference o...

Embodiment 2

[0032] The production method of the diamond wire of the present embodiment comprises the following steps:

[0033] The first step: surface treatment of steel wire

[0034] The first is to clean the grease and oxide layer on the surface of the steel wire. The cleaning method is to wash with lye and then wash with water, then wash with weak acid and then wash with water.

[0035] Step 2: Choose the right diamond particles

[0036] The size of the diamond particles is determined according to the diameter of the steel wire. The size of the diamond particles is preferably 10-50um. At the same time, the selected diamond particles should be treated with cations, because the quality of the diamond particles will determine the quality of the diamond particles. The quality of the line is good or bad.

[0037] Step 3: Prepare diamond electroplating solution

[0038] The quality of the diamond electroplating solution determines the bonding strength and the bonding time of the diamond p...

Embodiment 3

[0046] Choose 0.11mm steel wire and thread it into the equipment;

[0047] Preparation of diamond electroplating solution: take by weighing nickel sulfamate 60000g, nickel chloride 3000g, boric acid 4500g, these chemical raw materials are put into electroplating solution preparation tank, add pure water and constantly stir in the tank of preparation electroplating solution, final plating solution When it reaches 150 liters, extract 70 liters of electroplating solution and add it to the electroplating tank, then add 2100 g of cation-treated diamond micropowder into the electroplating tank, stir the electroplating solution and heat it to 50 degrees, and the preparation of the electroplating solution is completed.

[0048] Start the wire take-up machine, adjust the speed to 3 meters per minute, and apply 0.5 ampere direct current to the steel wire. At this time, the 0.11mm steel wire will pass through the upper sand cylinder under the traction of the guide wheel, and the diamond p...

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Abstract

The invention relates to a production device of a diamond wire suitable for generation of an axially-rotating magnetic field. The production device comprises a sanding cylinder and a steel wire penetrating through a central shaft of the sanding cylinder, wherein the steel wire serves as a cathode, and a rotating magnetic field generating device is arranged at the lower end of the sanding cylinder. A production method comprises the steps that (A) surface treatment of the steel wire is performed; (B) a plating solution is prepared; (C) the plating solution is put in a sanding trough and is input into the sanding cylinder from the sanding trough, and then a direct-current anode is connected to a nickel block in the sanding cylinder; (D) the steel wire penetrates into the center of the lower end of the sanding cylinder and then penetrates out of the center of the upper end, a direct-current cathode is connected to the steel wire in a passing-through state, meanwhile the rotating magnetic field generating device generates the magnetic field rotating around the central shaft of the sanding cylinder, and a magnetic line of force cuts the plating solution in the sanding cylinder, so that radial current is produced in the plating solution and diamond particles subjected to positive ion treatment are integrated on the steel wire together with nickel ions.

Description

technical field [0001] The invention relates to the technical field of diamond wires, in particular to a method for producing diamond wires using a diamond wire production device. Background technique [0002] Hard and brittle materials such as silicon crystals, sapphire, and quartz crystal materials have developed rapidly in recent years, and the cutting processes for these materials mainly include inner and outer circle cutting and wire saw cutting. Due to the advantages of wire saw cutting: high efficiency and low cost , narrow slit, and little pollution have basically replaced other cutting methods. In wire saw cutting, diamond wire cutting is much better than sand wire cutting. The cutting efficiency of diamond wire is 3 times that of sand wire cutting, and the kerf is smaller, especially for silicon wafer cutting. The silicon wafer light energy conversion of diamond wire cutting The rate is higher than that of silicon wafers cut by sand wire. [0003] At present, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D7/06C25D5/00
CPCC25D5/00C25D7/06C25D15/00
Inventor 吕金虎
Owner 东海县太阳光新能源有限公司