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Flexible circuit board gum inhibition release paper release layer hot-melt resin composition, gum inhibition release paper and production method of gum inhibition release paper

A resin composition, flexible circuit board technology, applied in coating, paper, papermaking and other directions, can solve the problems of difficult control, poor release and glue resistance, secondary pollution of circuit boards, etc., to improve the melting point and increase resistance. Glue function, the effect of easy process control

Active Publication Date: 2016-09-07
ZHEJIANG KAREN SPECIALTY MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The above-mentioned composite structure of polyethylene and polystyrene or film layer for fast pressing of flexible boards has poor release and adhesive resistance and is difficult to control.
Moreover, the composite layer is easy to delaminate, and the surface contains silicon, which will cause secondary pollution to the circuit board, and the release and glue resistance performance is poor and difficult to control

Method used

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  • Flexible circuit board gum inhibition release paper release layer hot-melt resin composition, gum inhibition release paper and production method of gum inhibition release paper
  • Flexible circuit board gum inhibition release paper release layer hot-melt resin composition, gum inhibition release paper and production method of gum inhibition release paper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] The modified resin coating formula is 30 parts by mass of polypropylene (PP) material, 60 parts of poly-4-methylpentene (TPX), 5 parts of polyethylene (PE) material, and 5 parts of polybutylene terephthalate Diester (PBT), 0.1 part by mass of 2,2′-methylene-bis-(4,6-di-tert-butylphenoxy)sodium phosphate, 0.2 part of tetrakis[β-(3,5-di-tert Butyl-4-hydroxyl base) propionate] pentaerythritol ester, 0.1 part of zinc glycerate, the resin mixing sequence is: first add polypropylene, poly-4-methylpentene, polyethylene, zinc glycerate and stir with a high-speed mixer After 4 minutes, add 2,2′-methylene-bis-(4,6-di-tert-butylphenoxy)sodium phosphate, tetrakis[β-(3,5-di-tert-butyl-4-hydroxy basic) propionate] pentaerythritol ester. Blend on high speed for 5 minutes. Stir evenly and enter the hot melt extruder to extrude and coat on the fiber base paper in a molten state at 280°C, with a coating weight of 20g / m 2 . Surface micropores are formed by high-frequency corona, the s...

Embodiment 2

[0062] The modified resin coating formula is 25 parts by mass of polypropylene (PP) material, 60 parts of poly-4-methylpentene (TPX), 3 parts of polyethylene (PE) material, 12 parts of polybutylene terephthalate Diester (PBT), 0.2 parts by mass of 2,2′-methylene-bis-(4,6-di-tert-butylphenoxy) sodium phosphate, 0.3 tetrakis[β-(3,5-di-tert-butyl Base-4-hydroxy base) propionate] pentaerythritol ester, 0.2 parts of zinc glycerate, and the resin mixing sequence is as in Example 1. After stirring evenly, enter the hot melt extruder to extrude and coat on the fiber base paper in a molten state at 300°C, and the coating amount is 30g / m 2 . Surface micropores are formed by high-frequency corona, the surface peeling strength is 4.96N / m, the melting point temperature is 203°C, the bending strength is 33.2MPa, and the resistance to glue (overflow) is 0.075-0.094mm.

Embodiment 3

[0064] The modified resin coating formula is 15 parts by mass of polypropylene (PP) material, 68 parts of poly-4-methylpentene (TPX), 2 parts of polyethylene (PE) material, 15 parts of polybutylene terephthalate Diester, 0.3 parts by mass of 2,2′-methylene-bis-(4,6-di-tert-butylphenoxy)sodium phosphate, 0.3 parts of tetrakis[β-(3,5-di-tert-butyl- 4-Hydroxy-based) propionate] pentaerythritol ester, 0.3 parts of zinc glycerate, the resin mixing sequence according to Example 1, stir evenly, enter the hot-melt extruder, extrude and coat on the fiber-based paper in a molten state at 300 ° C, coat The cloth weight is 40g / m 2 . Surface micropores are formed by high-frequency corona, the surface peeling strength is 4.61N / m, the melting point temperature is 213°C, the bending strength is 31.8MPa, and the resistance to glue (adhesive overflow) is 0.056-0.073mm.

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Abstract

The invention discloses a flexible circuit board gum inhibition release paper release layer hot-melt resin composition, a gum inhibition release paper and a production method of the gum inhibition release paper. The hot-melt resin composition comprises, by mass, 5-30 parts of polypropylene, 60-85 parts of poly(4-methyl-1-pentene), 0-5 parts of polyethylene and 5-20 parts of polybutylene terephthalate; and the flexible circuit board gum inhibition release paper is formed through coating the surface of paper with the hot-melt resin composition in a hot melt manner and through carrying out high frequency corona to form surface micro-pores. Combination of hot-melt coating and high frequency corona micro-pore technologies changes the overflow amount of an adhesive in the hot pressing process of a flexible circuit board in order to improve the gum inhibition function, and modified resin is added to improve the melting point, the surface peeling strength and the bending strength of a release layer, so the yield is improved; the production method has the advantages of simplicity, easy process control and low cost; and the gum inhibition release paper has the advantages of excellent gum inhibition release performance, very low peeling strength, high temperature resistance and high bending strength.

Description

technical field [0001] The invention relates to the field of production of flexible circuit board (FPC) glue-resistance release paper, in particular to a hot-melt resin composition for a release paper release layer of a flexible circuit board (FPC) glue-resistance release layer and a release paper using the release layer and a preparation method thereof . technical field [0002] The invention relates to the field of production of flexible circuit board (FPC) glue-resistance release paper, in particular to a hot-melt resin composition for a release paper release layer of a flexible circuit board (FPC) glue-resistance release layer and a release paper using the release layer and a preparation method thereof . Background technique [0003] The invention relates to a glue-resisting release paper used in the pressing process of a flexible circuit board, which is used for pressing and protecting printed circuit boards and polyimide films (PI) or polyester films (PET). [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H27/00D21H19/22D21H19/28D21H21/14
CPCD21H19/22D21H19/28D21H21/14D21H27/001
Inventor 叶慧仁
Owner ZHEJIANG KAREN SPECIALTY MATERIALS
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