Preparation method for micro-piezoelectric actuator array structure
An array structure and driver technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve the complex preparation method, compactness and piezoelectricity Poor performance and other problems, to achieve the effect of simple and easy process flow, guaranteed compactness and piezoelectric performance, suitable for batch preparation
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[0037] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.
[0038] combine Figure 1-Figure 7 , the preparation method of the micro piezoelectric actuator array structure of the present invention is described in detail, and its flow chart is as follows figure 1 As shown, it includes the following steps:
[0039] S11: Take a 20mm*20mm, 300um thick double-sided polished silicon wafer 1, wash and dry it, put it into a thermal oxidation furnace for thermal oxidation treatment, so that the upper and lower surfaces of the silicon wafer are formed A silicon dioxide film 2 with a preset thickness, the schematic diagram of the silicon wafer structure after this step is as follows ...
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