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Anti-aging expanded perlite and phenolic resin composite insulation board and preparation method thereof

A technology of expanded perlite and phenolic resin, which is applied in the field of thermal insulation wall panels, can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, and affect the thermal insulation performance of wall panels, so as to improve compatibility and binding force , Improve the effect of heat preservation and increase the strength

Inactive Publication Date: 2016-09-28
DANGTU COUNTY KEHUI TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, expanded perlite has a high water absorption rate and poor water resistance, which leads to large volume shrinkage and deformation of the thermal insulation mortar during mixing, and the thermal insulation performance of the product is reduced in the later stage, and the bonding strength with the matrix is ​​low, which affects the thermal insulation performance of the wallboard in the later stage.

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0015] An anti-aging expanded perlite phenolic resin composite insulation board, made of the following raw materials in parts by weight (kg): methyl methacrylate 0.8, silica-alumina sol 2, hydroxyapatite 6, silicon tetrachloride 1.3, expansion Perlite 55, phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, 85wt% ammonia water, anhydrous ethanol, deionized water 160, n-hexane, nanometer polytetrafluoroethylene 4, over Cumene oxide 0.1, trifluoroethyl acrylate 3.

[0016] The preparation method of the anti-aging expanded perlite phenolic resin composite insulation board comprises the following steps:

[0017] (1) Crush hydroxyapatite, pass through a 300-mesh sieve, mix with 3 times the weight of absolute ethanol, stir evenly, heat to 85°C, keep stirring for 20 minutes, add methyl methacrylate, tetrachloride Silicon, stir evenly, continue to keep warm and stir until dry, and get powder;

[0018] (2) Mix expanded perlite with 55 parts by weight of ...

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PUM

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Abstract

The invention discloses an anti-aging expanded perlite and phenolic resin composite insulation board, which is prepared from the following raw materials (by weight): 0.8-1 part of methyl methacrylate, 2-2.4 parts of silicon-aluminum sol, 6-7 parts of hydroxyapatite, 1.3-1.6 parts of silicon tetrachloride, 55-57 parts of expanded perlite, 40-42 parts of phenolic resin, 4-4.1 parts of a curing agent HMTA, 2-2.3 parts of steel fiber, 10-11 parts of tetraethyl orthosilicate, a proper amount of 85wt% ammonia water, a proper amount of anhydrous ethanol, 160-180 parts of deionized water, a proper amount of n-hexane, 4-4.5 parts of nano-polytetrafluoroethylene, 0.1-0.2 part of dicumyl peroxide and 3-3.5 parts of 2,2,2-trifluoroethyl acrylate. By using methyl methacrylate and silicon tetrachloride for modification of hydroxyapatite, compatibility of hydroxyapatite and resin is raised, and aging resistance and heat resistance of the insulation board can be boosted. By the use of silicon-aluminum sol, heat insulating property and aging resistance of the insulation board are improved.

Description

technical field [0001] The invention relates to the technical field of thermal insulation wallboards, in particular to an anti-aging expanded perlite phenolic resin composite thermal insulation board and a preparation method thereof. Background technique [0002] Composite insulation materials (CompositeInsulationMaterials) are new materials that are uniformly composited by two or more insulation materials, usually referring to the composite of organic insulation materials and inorganic insulation materials, which have better performance than the original organic or inorganic materials. This paper makes full use of the advantages of abundant perlite mineral resources in Xinyang, uses expanded perlite (Expended Perlite, EP) and phenolic resin (Phenol-formaldchyde Resin, PF) as the main raw materials, and adds an appropriate amount of curing agent, toughening agent and hydrophobic agent. agent, hot-pressed under certain conditions, prepared into expanded perlite / phenolic resin...

Claims

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Application Information

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IPC IPC(8): C04B26/10C04B14/18C04B111/20
CPCC04B14/185C04B26/122C04B2111/00008C04B2111/20C04B24/045C04B22/06C04B14/366C04B22/00C04B24/128C04B14/48C04B24/42C04B24/2682C04B24/00
Inventor 董良清
Owner DANGTU COUNTY KEHUI TRADING
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