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Oxazolidone ring-containing epoxy resin, method for producing the thereof, epoxy resin composition, cured product and application thereof

An oxazolidone ring, epoxy resin technology, applied in the application, other household appliances, chemical instruments and methods, etc., can solve the deterioration of adhesion, insufficient adhesion, deterioration of dielectric constant phosphorus content, etc. problems, to achieve the effects of excellent dielectric properties, good flame retardancy, and low dielectric constant

Active Publication Date: 2016-09-28
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of the epoxy resins disclosed in any of the documents sufficiently satisfies the requirements of dielectric properties due to the recent high functionalization, and the adhesiveness is not sufficient.
[0007] Furthermore, the cured product of an epoxy resin composition containing a phosphorus-containing epoxy resin, a phosphorus-containing curing agent, and a phosphorus-based flame retardant in order to impart flame retardancy has the following problems: the dielectric constant after moisture absorption and the cured The phosphorus content of the material deteriorates proportionally
In addition, in order to achieve low thermal expansion, studies have been made on the formulation of fillers such as alumina, but there is a problem of poor adhesion

Method used

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  • Oxazolidone ring-containing epoxy resin, method for producing the thereof, epoxy resin composition, cured product and application thereof
  • Oxazolidone ring-containing epoxy resin, method for producing the thereof, epoxy resin composition, cured product and application thereof
  • Oxazolidone ring-containing epoxy resin, method for producing the thereof, epoxy resin composition, cured product and application thereof

Examples

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Embodiment

[0227] Hereinafter, although an Example and a comparative example are given and this invention is demonstrated concretely, this invention is not limited to these examples. Unless otherwise specified, "part" means a mass part, and "%" means a mass %. In addition, the measuring method can be measured according to the following methods, respectively. The unit of equivalent is g / eq.

[0228] ・Epoxy equivalent: According to JIS K7236 standard.

[0229] · Viscosity: According to JIS K7233 standard, single cylinder rotational viscometer method.

[0230] · Softening point: Measured according to the JIS K7234 standard and the ring and ball method. Specifically, an automatic softening point device (manufactured by Mindac Co., Ltd., ASP-MG4) was used.

[0231] ·Solvent solubility: The state when it diluted with methyl ethyl ketone to 50% of non-volatile content was judged visually. The case of being completely dissolved and transparent was rated as "◯", the case of cloudy or separat...

Synthetic example 1

[0243] 100 parts of 4,4'-(3,3,5-trimethylcyclohexylene)diphenol (BisP-TMC), 358 parts of epichlorohydrin, 4 parts of Ion-exchanged water was heated up to 50°C while stirring. After uniform dissolution, 5.3 parts of 49% sodium hydroxide aqueous solution was charged and reacted for 3 hours. Next, after raising the temperature to 64°C, reduce the pressure to such an extent that reflux of water occurs, and add 48 parts of 49% sodium hydroxide aqueous solution dropwise over 3 hours. Alcohol, epichlorohydrin was returned to the reaction vessel, and water was removed from the system to perform the reaction. After completion of the reaction, the temperature was increased to 70° C. to perform dehydration, and the temperature was set to 135° C. to collect remaining epichlorohydrin. It returned to normal pressure, and 204 parts of methyl isobutyl ketones (MIBK) were added and dissolved. 127 parts of ion-exchanged water was added, stirred and left still to dissolve and remove the commo...

Synthetic example 2

[0245] Except having changed epichlorohydrin into 179 parts, the same operation was performed using the apparatus similar to the synthesis example 1, and the epoxy resin (a-2) represented by the said formula (7) was obtained. The epoxy equivalent of the obtained epoxy resin (a-2) was 227, the alcoholic hydroxyl equivalent was 3800, and m was 0.09.

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Abstract

The invention provides an oazolidone ring-containing epoxy resin, a method for producing the thereof, an epoxy resin composition, a cured product and an application thereof. The oazolidone ring-containing epoxy resin is obtained by epoxy resin (a) of epoxy resin (a1) and an isocyanate compound represented by the following formula (3), the epoxide equivalent is 200-550g / eq.. The oazolidone ring-containing epoxy resin has good performances of heat resisting property, dielectric property, adhere property and the like and can be applied to purposes of stacking, moulding, casting, adhering and the like. The formula is as shown in the description. (X represents at least one selected from an alkyl group with carbon number of 1-4, an aryl group with carbon number of 6-10 and a cycloalkylene base with ring member number of 5-8 of substituent group of an aralkyl group with carbon number of 6-10. R represents a hydrogen atom, the alkyl group, a naphthene base, the aryl group or the aralkyl group, G represents a glycidyl group, and the average value of m is 0-5.).

Description

technical field [0001] The present invention relates to an epoxy resin containing an oxazolidone ring that provides a cured product excellent in low dielectric properties, high heat resistance, and high adhesiveness, a method for producing the epoxy resin, and the epoxy resin An epoxy resin composition as an essential component, and a cured epoxy resin obtained from the epoxy resin composition, a prepreg, an insulating sheet, an adhesive sheet, a laminate, a sealing material, and a casting material. Background technique [0002] Epoxy resins are used in various fields such as coatings, civil engineering bonding, casting, electrical and electronic materials, and film materials because of their excellent adhesiveness, flexibility, heat resistance, chemical resistance, insulation, and curing reactivity. In particular, in the use of printed wiring boards, one of electrical and electronic materials, epoxy resins are widely used by imparting flame retardancy. [0003] As one of t...

Claims

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Application Information

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IPC IPC(8): C08G59/14C08L63/00B32B15/092B32B15/20B32B27/04B32B27/18B32B27/26B32B27/38
CPCC08G59/1477C08L63/00B32B15/092B32B15/20B32B2307/206B32B2307/306B32B2307/3065B32B2262/101B32B2262/02B32B2262/0246B32B2262/0269B32B2260/021B32B2260/046B32B2262/0292B32B2262/0276B32B2250/40B32B2457/00B32B2457/08C08L2201/02C08L2205/025C08L2201/08
Inventor 冈崎有起高岛智行石原一男宗正浩
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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