Preparation method of zinc oxide piezoresistor ceramic chip

A varistor, zinc oxide technology, applied in the direction of varistor core, varistor, and resistors with lead-out terminals, etc., can solve the problem of affecting product quality and work efficiency, slow manual swinging, manual spreading Powder separation and other problems, to overcome human error, high quality, reduce production and processing costs.

Active Publication Date: 2016-10-12
CHENSHUO ELECTRONICS JIUJIANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Zinc oxide varistor materials in the prior art are prepared by batching, grinding, granulating, forming (tabletting), and manually pressing the green sheet into the burning pot. If the area / thickness ratio of the green sheet (thin sheet) When it is larger, the breakage rate is higher, and in order to prevent adhesion, it is necessary to sprinkle spacer powder between the blanks, and then go through the processes of debinding and high-temperature sintering to form zinc oxide varistor ceramics, and its hardness is at Luodi 7. About grade, similar to ceramics, due to high temperature firing at about 1200 ℃, zinc oxide ceramic pieces will be somewhat deformed, especially when firing products with a large area / thickness ratio (thin slices), the performance is more obvious. Manually remove the powder and remove the severely deformed ones. The non-seriously deformed ones are packaged in the post-process, and the appearance is not easy to be noticed. In the conventional technology, the tablet pressing method and the manual laying process have always been the automation of the production of zinc oxide varistor tiles. Difficulties, especially in the forming (tabletting) step of the prior art, it is necessary to control the thickness of the tablet, but also to control the pressing density, high precision requirements, and cumbersome operations. Steps such as spreading powder and other steps, the speed of manual setting is slow, and it is easy to fatigue. In the process, it is easy to have large deformation and lead to large waste, which seriously affects the quality and work efficiency of the product. Moreover, due to the variety of specifications of the ceramic tiles, the minimum diameter is 15mm, the thickness is only 1.2mm, the maximum diameter is 50mm, and the thickness is only 1.2mm. It is more than ten millimeters and hundreds of varieties and specifications, so these processes are the difficulty of production automation, and the production and processing costs are quite high, which needs further improvement

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  • Preparation method of zinc oxide piezoresistor ceramic chip
  • Preparation method of zinc oxide piezoresistor ceramic chip
  • Preparation method of zinc oxide piezoresistor ceramic chip

Examples

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Effect test

Embodiment 1

[0033] The invention provides a method for preparing zinc oxide varistor tiles, comprising the following steps:

[0034] (1) Carrying out batching, mixing, grinding and granulating the zinc oxide varistor raw materials to form porcelain powder, which also includes the following steps:

[0035] (2) The porcelain powder in step (1) is sent into a press, and the porcelain powder is pressed into green bodies of different shapes by the press. In this embodiment, the green body is 38mm in diameter and 150mm in length. A cylindrical green body with a density of 3.2;

[0036] (3) Put the green body into a firing bowl, and obtain a zinc oxide varistor ceramic body after debinding and sintering. The debinding temperature is 700°C, and then it is sent to a kiln at 1200°C for sintering to become Left and right zinc oxide piezoresistor cylindrical ceramic bodies; the step of putting the green body into the firing pot is as follows: the green body is rolled down through the track, and sen...

Embodiment 2

[0046] The difference between this embodiment and embodiment 1 is that the way of taking materials is different

[0047] Such as Figure 6 As shown, the reclaiming device in this embodiment includes a first conveyor 1 and a second conveyor 2, and the first conveyor 1 is also provided with a baffle plate 11 to prevent the cylindrical blank from being caused by two conveyors. The drop caused by asynchrony, the first conveyor 1 is driven by the main conveyor 12, the first conveyor 1 is used to transport the cylinder blank 4 from the forming end to the bowl loading area, and the second conveyor 2 transports the empty sagger to the In the charging area, the loaded blanks are transported into the debinding furnace. The second conveyor 2 is also equipped with a sagger 3 for loading the cylinder blanks into the furnace for debinding and firing. The sagger 3 is equipped with The first loading space 31 and the second loading space 32, an isolation belt 33 is arranged between the first ...

Embodiment 3

[0051] Such as Figure 7 and Figure 8 As shown, the production process of this embodiment is the same as that of Example 1, the difference is that the shape of the pressed blank and the cutting thickness are different, and the present embodiment uses a high-pressure formula, such as Figure 7 and Figure 8 As shown, the size of the pressed blank is 30×26×280mm rectangular body, and the thickness of the ceramic body is 2.6mm. This kind of product is used for the protection of communication power system.

[0052] The preparation method of a zinc oxide varistor tile provided by the present invention greatly improves the degree of production automation. At the same time, since the thickness of the pressing cylinder is not high, the number of times of pressing in the same batch is small, and the leakage of material is also small. The material utilization rate is high, eliminating the need to adjust the pressure and density of labor and time when pressing tablets with the same di...

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Abstract

The invention provides a preparation method of a zinc oxide piezoresistor ceramic chip. The method comprises the following steps of: carrying out burdening, mixing, grinding and granulating treatment on a zinc oxide piezoresistor raw material to form ceramic powder; pressing the ceramic powder into green bodies with different shapes through a press, arranging the green bodies into a burning pot, carrying out rubber discharging and sintering to obtain a zinc oxide piezoresistor ceramic body; carrying out cutting through a cutting device to form the zinc oxide piezoresistor ceramic chip; and carrying out surface electrode coating, pin pressing, welding and surface packaging treatment on the cut zinc oxide piezoresistor ceramic chip. By the preparation method of the zinc oxide piezoresistor ceramic chip provided by the invention, the work efficiency is greatly improved; and the product quality is improved.

Description

technical field [0001] The invention relates to the field of zinc oxide varistor manufacture, in particular to a method for preparing zinc oxide varistor tiles. Background technique [0002] Zinc oxide varistors have special nonlinear current-voltage characteristics. Once abnormal conditions occur during use, such as lightning strikes on the power line, strong electromagnetic field interference, frequent power switch actions, and power system failures, the voltage on the line will suddenly increase. The conduction voltage of the arrester will enter the conduction region. At this time, the current (I) and the voltage (V) have a nonlinear relationship, which is generally called a nonlinearity parameter (NonlinearityParameter), and its value can reach tens or hundreds. At this time, the impedance of the arrester will drop sharply, only a few ohms, so that the overvoltage will form a surge current to flow out, and the energy of the overvoltage will be released, so as to protect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/112H01C17/04H01C17/28
CPCH01C7/112H01C17/04H01C17/28
Inventor 陈泽同曾清隆
Owner CHENSHUO ELECTRONICS JIUJIANG CO LTD
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