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Flame-retardant and heat-resistant epoxy resin for self-adhesive prepreg

A technology of epoxy resin and phenolic epoxy resin, applied in the field of prepreg manufacturing, can solve problems such as reducing heat resistance, and achieve the effects of reducing production cost, simplifying process and short curing cycle

Inactive Publication Date: 2016-10-26
AVIC COMPOSITES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to prepare self-adhesive prepreg resin, the resin is toughened and modified, but the toughened modification often reduces the heat resistance. Generally, the glass transition temperature of the self-adhesive prepreg composite material cured at medium temperature is lower than 150 ° C

Method used

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  • Flame-retardant and heat-resistant epoxy resin for self-adhesive prepreg

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0041] The above-mentioned preparation method of flame-retardant and heat-resistant epoxy resin for self-adhesive prepreg comprises the following steps:

[0042] (1) Prepare the raw materials respectively according to the formula amounts of the epoxy resin mixture A component and the curing agent mixture B component; prepare the mixing equipment;

[0043] (2) prepare epoxy resin mixture A component and curing agent mixture B component respectively;

[0044] ① Epoxy resin mixture A component

[0045] a. Add the component A of the epoxy resin mixture into the mixing equipment and mix thoroughly until it is uniform;

[0046] b. Pour the mixed epoxy resin mixture component A into the product barrel, seal it, protect it from light, and store it at room temperature;

[0047] ②The curing agent mixture B component

[0048] Mix the B component of the curing agent mixture, and pulverize it to a particle size of 50-100 meshes with a pulverizing equipment;

[0049](3) Preparation of f...

Embodiment 1

[0052] Raw materials of component A of epoxy resin mixture: bisphenol A epoxy resin E-54---60 parts; glycidylamine tetrafunctional epoxy resin AG-80---10 parts; polyethersulfone (PES) ---10 parts; Bromobisphenol S---15 parts

[0053] Raw materials of component B of curing agent mixture: modified dicyandiamide---10 parts; modified urea---2 parts; aluminum oxide---2 parts

[0054] Preparation method: Add component A of epoxy resin mixture to mixing equipment and mix evenly. Mix the B component of the curing agent mixture, and pulverize it to a particle size of 50-100 meshes with a pulverizing equipment;

[0055] Add the component A of the epoxy resin mixture to the mixing equipment, heat it to 60-90 ° C, keep the temperature for 0.5-1 hour, add the component B of the curing agent mixture to the component A of the epoxy resin mixture, and mix well.

[0056] Self-adhesive glass cloth prepreg can be prepared by impregnating EW250F glass cloth with a hot melt prepreg machine. The...

Embodiment 2

[0059] Raw materials of component A of epoxy resin mixture: bisphenol A epoxy resin E-51---50 parts; glycidyl ester trifunctional epoxy resin TDE-85---10 parts; polysulfone (PS)- --10 parts; Tetrabromobisphenol A---10 parts;

[0060] Raw materials of component B of curing agent mixture: dicyandiamide---10 parts; modified urea---2 parts; flame retardant auxiliary aluminum hydroxide---10 parts

[0061] The preparation methods of epoxy resin, prepreg and composite material are the same as those in Example 1.

[0062] The test results of the composite materials are shown in Table 1.

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Abstract

The invention belongs to the technical field of preparation of prepreg, and particularly relates to a flame-retardant and heat-resistant epoxy resin for self-adhesive prepreg. The resin for the prepreg consists of an epoxy resin mixture component A and a curing agent mixture component B. The epoxy resin mixture component A accounts for 50-80 parts by weight of the resin, and the curing agent mixture component B accounts for 10-40 parts by weight of the resin. The prepreg is prepared by a hot melt adhesive dipping reinforcing material of a composition; a composite material is formed by the prepreg. The viscosity of the prepreg is moderate, and the processability is good; the storage time at the normal temperature is 3 months. The prepreg can be cured completely within 2 hours at the temperature of 135 DEG C. The glass-transition temperature of the cured composite material is 180-210 DEG C; heat resistance and flame retardance of the composite material are good. The resin for the hot melting prepreg provided by the invention has been toughened and modified, the self-adhesive property of the prepreg is good, honeycombs can be adhered directly, adhesive films are not required, the process can be simplified, and the weight can be reduced.

Description

technical field [0001] The invention belongs to the technical field of prepreg manufacturing, in particular to a flame-retardant and heat-resistant epoxy resin used for self-adhesive prepreg. Background technique [0002] Commonly used resin systems for advanced composite materials include phenolic, epoxy, bis-horse and cyanate resins, among which epoxy resin is the most widely used. Epoxy resin has excellent adhesive properties, wear resistance, mechanical properties, electrical insulation properties, chemical stability properties, high and low temperature resistance. Due to its advantages of low shrinkage, easy processing and low cost, etc., it has been widely used in the fields of adhesives, coatings, electrical and electronic insulating materials, and advanced composite materials. [0003] The curing temperature of epoxy resin system can be divided into high temperature curing, medium temperature curing and room temperature curing system. Epoxy resins for advanced comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L81/06C08L61/16C08L9/02C08K13/04C08K3/22C08K5/41C08K5/136C08K7/14C08K3/26C08J5/24
CPCC08L63/00C08J5/24C08J2363/00C08J2463/00C08L2201/02C08L2201/08C08L2205/025C08L2205/03C08L2205/035C08L81/06C08K13/04C08K2003/2227C08K5/41C08K7/14C08K5/136C08L61/16C08K3/2279C08L9/02C08K2003/2224C08K2003/265
Inventor 乌云其其格杜宇雷娜张宝艳
Owner AVIC COMPOSITES
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