Manufacturing method of TFT backboard and TFT backboard
A manufacturing method and backplane technology, which are used in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of uneven brightness, poor electron mobility, uneven distribution, etc., so as to improve the uniformity of light emission, Effects of low leakage current, improved electron mobility, and uniformity of current output
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[0047] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0048] see figure 1 , the present invention at first provides a kind of manufacture method of TFT backplane, comprises the steps:
[0049] Step 1, such as figure 2 As shown, a base substrate 10 is provided, and a first gate 21 and a second gate 22 are formed at intervals on the base substrate 10, and the first gate 21, the second gate 22, and the A gate insulating layer 30 is deposited on the substrate 10 , and an amorphous silicon thin film 31 is deposited on the gate insulating layer 30 .
[0050] Specifically, the base substrate 10 is a glass substrate.
[0051] Specifically, the step 1 further includes: cleaning and baking the base substrate 10 before depositing other structural layers on the base substrate 10 .
[0052] Preferably, t...
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