Method for enhancing bonding performance of crop straw through water vapor dielectric barrier discharge plasma

A technology of dielectric barrier discharge and crop straw, which is applied in household components, electric wood treatment, pretreatment of molding materials, etc., can solve the problems of straw glueing difficulty, high production cost, complicated production process, etc., and achieve simple and controllable operation, Enhanced bonding performance and high processing efficiency

Inactive Publication Date: 2016-11-09
NANJING FORESTRY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the surface of most crop straws is rich in cuticle and other substances that are not conducive to gluing, a weak interface layer is formed, which seriously affects the gluing performance of the product, and has become one of the main technical problems restricting the development of the crop straw wood-based panel industry.
At present, in industrial production, the problem of difficult glueing of straws is mainly solved by using expensive high-strength adhesives (such as isocyanate glue), but at the same time it brings high production costs and complicated production processes (requires supporting demoulding technology, sizing protection technology) etc.) and other issues, resulting in weak product market competitiveness and difficulty in opening up sales, resulting in slow progress in the industrialization of crop straw wood-based panels

Method used

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  • Method for enhancing bonding performance of crop straw through water vapor dielectric barrier discharge plasma
  • Method for enhancing bonding performance of crop straw through water vapor dielectric barrier discharge plasma
  • Method for enhancing bonding performance of crop straw through water vapor dielectric barrier discharge plasma

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] After removing the leaves, sheaths and joints of the current year's wheat straw, select the smooth and flat part and cut it into 5cm long, cut it from the middle with a knife, soak it in distilled water for 5 hours, and after it is fully softened, spread it evenly on the glass and place it in a ventilated place. Press it with a heavy object for a week, then take it off, place it in a screen, and dry it in a blast drying oven at 60 degrees Celsius for 1 hour until the moisture content reaches about 8%, then seal the bag and store it in a drying dish for later use.

[0027] Cut the wheat straw flattened and dried in the early stage into 10 cm long, and measure 2 cm at the flat end of the straw as the glued and glued part, measure the width, and calculate the glued area.

[0028] Open the quartz cover plate 8, place the trimmed straw in the quartz reaction chamber between the two electrode plates of the dielectric barrier discharge plasma discharge device, and cover the cover...

Embodiment 2

[0030] After removing the leaves, sheaths and joints of the current year's wheat straw, select the smooth and flat part and cut it into 5cm long, cut it from the middle with a knife, soak it in distilled water for 5 hours, and after it is fully softened, spread it evenly on the glass and place it in a ventilated place. Press it with a heavy object for a week, then take it off, place it in a screen, and dry it in a blast drying oven at 60 degrees Celsius for 1 hour until the moisture content reaches about 8%, then seal the bag and store it in a drying dish for later use.

[0031] Cut the wheat straw flattened and dried in the early stage into 10 cm long, and measure 2 cm at the flat end of the straw as the glued and glued part, measure the width, and calculate the glued area. It is placed between two insulating media of a dielectric barrier discharge plasma discharge device for modification treatment. Using the steps described in Example 1, ammonia water was used as the modifyi...

Embodiment 3

[0033] After removing leaves, sheaths and joints, select the smooth and flat part and cut it into 5cm long, cut it open from the middle with a knife, soak it in distilled water for 3 hours, fully soften it, spread it evenly on the glass, and place it in a ventilated place. Press it with a heavy object for a week, then take it off, place it in a screen, and dry it in a blast drying oven at 60 degrees Celsius for 2 hours until the moisture content reaches about 6%, and then store it in a sealed bag in a drying dish for later use.

[0034] Cut the wheat straw flattened and dried in the early stage into 10 cm long, and measure 2 cm at the flat end of the straw as the glued and glued part, measure the width, and calculate the glued area. It is placed between two insulating media of a dielectric barrier discharge plasma discharge device for modification treatment. Using the steps described in Example 1, 10% NaCl aqueous solution was used as the modifying reagent. By heating 10% NaC...

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Abstract

The invention relates to a method for enhancing the bonding performance of crop straw through water vapor dielectric barrier discharge plasma and belongs to the technical field of artificial board manufacturing. The process comprises the steps that leaves, sheaths and branch knots of the straw are removed, the straw is cut to be 2-30 cm long and subjected to softening and drying treatment, the moisture content is adjusted to be 6%-10%, and the straw is put into a quartz reaction cavity of special water vapor dielectric barrier discharge plasma for processing the straw; gas containing water vapor is introduced into the reaction cavity, the pressure inside the cavity is controlled to be 5-100 kPa through a vacuum pump, a plasma power source is started, the discharge power is adjusted to be 20-500 W, and the electrode interval is adjusted to be 5-12 mm, so that water vapor among electrodes is triggered and discharges electricity to generate the low-temperature plasma, and the surface of the straw is processed for 10-600 s continuously; and adhesives are applied to the surface of the processed crop straw and are curved after being subjected to hot pressing to reach the bonding strength. The method can remarkably improve the bonding performance between the inner surface and the inner surface of the straw, between the inner surface and the outer surface of the straw as well as between the outer surface and the outer surface of the straw and improve the quality of straw board products, and the equipment is simple, easy to operate, capable of saving energy, efficient, environmentally friendly and free of pollution.

Description

technical field [0001] The invention relates to a method for improving the surface wettability and interface bonding strength of wheat straw by using dielectric barrier discharge plasma. It belongs to the technical field of wood-based panel manufacturing. Background technique [0002] my country is a country with relatively poor forest resources. For a long time, there has been a tension between the supply and demand of timber. After the implementation of the natural forest protection project, logging bans have been implemented in many parts of the country. Many wood-based panel manufacturers are facing the crisis of suspending or changing production due to insufficient supply of raw materials. There is an urgent need to find ideal alternative raw materials. At the same time, my country is a traditional agricultural country with rich crop straw resources. According to statistics, the national average annual crop straw production reaches 820 million tons, of which 75.6% are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N1/00B27K9/00B27K5/00
CPCB27N1/00B27K5/002B27K5/0075B27K9/005B27K9/007B27K2200/15
Inventor 陈敏智周晓燕徐义诚张孝涛凌溪阮氏凤
Owner NANJING FORESTRY UNIV
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