Composite board adhesive capable of purifying air and restraining formaldehyde

A composite board and air-purifying technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve the problems of corn-based adhesives such as limited water resistance and bonding strength, and achieve safe and non-toxic raw materials, suitable viscosity, The effect of good adsorption effect

Inactive Publication Date: 2016-11-23
阜阳大可新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the water resistance and bonding strength of corn-based adhesives are limited, which requires further modification.

Method used

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Comparison scheme
Effect test

Embodiment Construction

[0014] A composite board adhesive capable of purifying air and suppressing formaldehyde, prepared from the following raw materials in parts by weight (kg): zein 100, acrylamide 8, maleic anhydride 2, ammonium persulfate 8, and a concentration of 40wt% Appropriate amount of sodium hydroxide, appropriate amount of distilled water, water glass with a modulus of 2.8 50, polyvinyl alcohol 9, tetraethyl orthosilicate 2, sulfamic acid 1.7, silane coupling agent kh550 1, microcrystalline cellulose 3, attapulgite 9. Urea 2, glycine 3, diphenyldimethoxysilane 0.8.

[0015] Described a kind of composite plate adhesive that can purify air and suppress formaldehyde is made by the following specific steps:

[0016] (1) Add polyvinyl alcohol to 10 times the amount of distilled water, heat to 80°C, stir until completely dissolved, and form a solution for use; put water glass with a modulus of 2.8 into the reaction kettle, slowly add the above solution, and heat in a water bath To 60°C, add s...

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PUM

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Abstract

The invention discloses a composite board adhesive capable of purifying air and restraining formaldehyde. The composite board adhesive is prepared from, by weight, 100-110 parts of corn protein, 8-9 parts of acrylamide, 2-2.5 parts of maleic anhydride, 8-9 parts of ammonium persulfate, an appropriate amount of sodium hydroxide with the concentration of 40wt%, an appropriate amount of distilled water, 50-55 parts of water glass of the modulus of 2.8, 9-10.5 parts of polyvinyl alcohol, 2-3 parts of ethyl orthosilicate, 1.7-2 parts of sulfamic acid, 1-1.2 parts of silane coupling agent kh550, 3-4 parts of microcrystalline cellulose, 9-10 parts of attapulgite, 2-3 parts of urea, 3-4 parts of glycine and 0.8-1 part of diphenyl dimethoxy silane. The adhesive is excellent in stability and high in binding strength, raw materials are safe and nontoxic, formaldehyde and other ingredients in air can be adsorbed, the effect of purifying air is achieved, and the using range of the adhesive is further enlarged.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a composite board adhesive capable of purifying air and suppressing formaldehyde. Background technique [0002] Adhesives are materials that bond wood to the surface of wood or other objects. At present, the most commonly used board adhesives on the market are "trialdehyde glues" represented by urea-formaldehyde resins, phenolic resins, and melamine-formaldehyde resins. However, these three adhesives use formaldehyde as the main raw material, and there is free formaldehyde, and The pollution cycle is long and has certain harm to the indoor environment. At home and abroad, the requirements on the free aldehyde content of wood adhesives or the limit of formaldehyde emission from wood-based panels are becoming more and more stringent. Therefore, wood-based panel companies have a huge demand for environmentally friendly formaldehyde-free adhesives that can replace "trialdehyde" gl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J151/00C09J129/04C09J11/08C09J11/06C09J11/04
CPCC08K2201/014C08L2201/08C08L2205/03C08L2205/04C09J11/04C09J11/06C09J11/08C09J151/00C08L29/04C08L1/04C08K13/06C08K9/06C08K3/34C08K5/42C08K5/175
Inventor 胡杨州邵树兵郭海涛陆昌余方祖鸿邵跃骅
Owner 阜阳大可新材料股份有限公司
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