Composite 3D printing method of buried circuit board

Abstract

The invention belongs to the technical field of 3D printing, and particularly discloses a composite 3D printing method of a buried circuit board. Two 3D printing modes of selective laser melting (SLM) and selective laser sintering (SLS) are combined, an SLS / SLM forming device is used, selective distribution of insulation nonmetal powder and conductive metal powder in all layers in an insulation substrate area and a conducting circuit area is achieved through powder feeding spray heads and powder suction spray heads, and the groove-machining-free buried circuit board is manufactured through the main forming steps of modeling, slicing, powder spreading, powder suction, powder feeding and laser scanning forming. The advantages of being capable of forming complex shapes and micro structures of the 3D printing technology are utilized, integral manufacturing of the buried circuit board is achieved, the manufacturing process of a traditional buried circuit board is greatly simplified, the manufacturing cost is reduced, the manufacturing period is shortened, and the space utilization rate of the circuit board is remarkably increased.

Description

technical field [0001] The present invention relates to the technical field of 3D printing, more specifically, to a composite 3D printing method for embedded circuit boards, which can avoid groove processing and is suitable for integrated manufacturing, and is especially suitable for processing applications of embedded circuit boards or similar products occasion. Background technique [0002] Due to the gradual development of electronic products towards miniaturization and integration, the volume of circuit boards is constantly shrinking, and the number of electronic components is constantly increasing. The traditional method of manufacturing circuit boards is to arrange electronic components on the surface of the substrate, which cannot solve the contradiction between the reduction of the size of the circuit board and the increase of electronic components. Therefore, some researchers have proposed the idea of ​​embedding electronic components into the packaging substrate. ...

AI Technical Summary

Problems solved by technology

[0005] However, further studies have shown that although the above-mentioned prior art proposes to use 3D printing technology to print circuit boards, it still has the following defects or deficiencies: First, the above-mentioned 3D printing technology uses layer-by-layer printing to print, and the prepared The multi-layer circuit board does not have a groove structure, and does not consider the assembly and arrangement of subsequent electronic components. If electronic components need to be assembled later, the grooves still need to be processed in other ways; secondly, the powder feeding device only delivers One kind of material cannot realize the distribution of different materials on the same printing layer, so the heat-resistant insulating layer and the conductive circuit need to be printed separately, which has low efficiency and is not suitable for mass production

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