Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A composite 3D printing method for embedded circuit boards

A 3D printing and circuit board technology, applied in the field of 3D printing, can solve the problems of not considering the assembly and arrangement of electronic components, the multilayer circuit board does not have a groove structure, and is not suitable for mass production, so as to facilitate component assembly, The effect of removing restrictions and simplifying structure

Active Publication Date: 2018-08-03
HUAZHONG UNIV OF SCI & TECH
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, further studies have shown that although the above-mentioned prior art proposes to use 3D printing technology to print circuit boards, it still has the following defects or deficiencies: First, the above-mentioned 3D printing technology uses layer-by-layer printing to print, and the prepared The multi-layer circuit board does not have a groove structure, and does not consider the assembly and arrangement of subsequent electronic components. If electronic components need to be assembled later, the grooves still need to be processed in other ways; secondly, the powder feeding device is only on the same printing layer. Transmission of one material cannot achieve the distribution of different materials on the same printing layer, and the heat-resistant insulating layer and conductive lines need to be printed separately, which has low efficiency and is not suitable for mass production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A composite 3D printing method for embedded circuit boards
  • A composite 3D printing method for embedded circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] (1) Using 3D modeling software to design such as figure 1 The structural model of the embedded double-sided circuit board shown, in which 1 is the conductive circuit, 2 is the insulating substrate, 3 is the outer insulating board, and 4 is the electronic component; import the model file into the SLS / SLM forming device, and use the system slice The software slices the model in layers, each layer thickness is 0.03mm, and obtains the data information about the insulating substrate area, conductive line area and groove area in each layered slice;

[0049] (2) Place the nylon 6 powder in the powder feeding cylinder, and place the copper powder in the powder feeding nozzle of the coaxial suction / powder feeding mechanism with dual nozzles, wherein the nylon 6 powder is prepared by solvent precipitation method, and the particle size range is 10-30 μm , Copper powder is produced by gas atomization, the particle size range is 20-40μm, and both powders maintain good sphericity. T...

Embodiment 2

[0055] (1) Using 3D modeling software to design such as figure 1 The structural model of the embedded double-sided circuit board shown, in which 1 is the conductive circuit, 2 is the insulating substrate, 3 is the outer insulating board, and 4 is the electronic component; import the model file into the SLS / SLM forming device, and use the system slice The software slices the model in layers, each layer thickness is 0.01mm, and obtains the data information about the insulating substrate area, conductive line area and groove area in each layered slice;

[0056] (2) Place the nylon 12 powder in the powder feeding cylinder, and place the copper powder in the powder feeding nozzle of the coaxial suction powder feeding mechanism with dual nozzles, wherein the nylon 12 powder is prepared by solvent precipitation method, and the particle size range is 10-30 μm. Copper powder is produced by gas atomization, the particle size range is 20-40μm, and both powders maintain good sphericity. ...

Embodiment 3

[0062] (1) Using 3D modeling software to design such as figure 2 The structural model of the embedded four-sided circuit board is shown, in which 1 is the conductive circuit, 2 is the insulating substrate, 3 is the outer insulating board, and 4 is the electronic component. Import the model file into the SLS / SLM forming device, and use the system slicing software Carry out layered slices of the model, each layer thickness is 0.03mm, and obtain data information about the insulating substrate area, conductive line area and groove area in each layered slice;

[0063] (2) Nylon 12 powder is placed in the powder delivery tank, and copper-tin alloy powder is placed in the powder delivery nozzle of the coaxial suction powder delivery mechanism with dual nozzles. Nylon 12 powder is prepared by solvent precipitation method, and the particle size range is 15-35 μm , Copper powder is produced by gas atomization, the particle size range is 20-40μm, and both powders maintain good sphericity....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of 3D printing, and specifically discloses a composite 3D printing method of an embedded circuit board, which combines two 3D printing methods of selected laser melting (SLM) and selected laser sintering (SLS), and utilizes an SLS / SLM forming device, Depending on the powder feeding nozzle and powder suction nozzle, the selective distribution of insulating non-metallic powder and conductive metal powder in the insulating substrate area and conductive line area in each layer can be achieved, after modeling, slicing, powder spreading, powder suction, powder feeding, and laser scanning Forming and other main forming steps to manufacture embedded circuit boards without groove processing. The present invention utilizes the feature that 3D printing technology can form complex shapes and tiny structures, realizes the integrated manufacturing of embedded circuit boards, greatly simplifies the traditional embedded circuit board manufacturing process, reduces manufacturing costs, and shortens the manufacturing cycle , significantly improving the space utilization of the circuit board.

Description

technical field [0001] The present invention relates to the technical field of 3D printing, more specifically, to a composite 3D printing method for embedded circuit boards, which can avoid groove processing and is suitable for integrated manufacturing, and is especially suitable for processing applications of embedded circuit boards or similar products occasion. Background technique [0002] Due to the gradual development of electronic products towards miniaturization and integration, the volume of circuit boards is constantly shrinking, and the number of electronic components is constantly increasing. The traditional method of manufacturing circuit boards is to arrange electronic components on the surface of the substrate, which cannot solve the contradiction between the reduction of the size of the circuit board and the increase of electronic components. Therefore, some researchers have proposed the idea of ​​embedding electronic components into the packaging substrate. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30H05K3/00H05K1/18H05K1/02B29C64/153B29C64/386B29C64/321B33Y10/00B33Y50/00B22F3/105
CPCH05K1/0284H05K1/183H05K3/0014H05K3/30B33Y10/00B33Y40/00B22F10/00B22F10/362B22F12/55B22F12/53B22F10/28Y02P10/25
Inventor 史玉升王倩韩昌骏马高魏青松文世峰闫春泽宋波
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com