High-temperature-resistant packing material and preparation method thereof

Abstract

The invention discloses a high-temperature-resistant packing material and a preparation method thereof. The high-temperature-resistant packing material is prepared from, by weight, 15-36 parts of epoxy resin, 10-24 parts of polyurethane, 7-18 parts of isocyanate, 3-9 parts of methyl trichlorosilane, 3-9 parts of silicon dioxide, 8-18 parts of carbon tetrachloride, 2-5 parts of titanate coupling agent, 6-11 parts of talcum powder, 5-13 parts of butylated hydroxyanisole, 3-7 parts of dibasic lead stearate, 3-7 parts of organic fatty acid, 6-13 parts of dicumyl peroxide, 6-11 parts of aluminum silicate fibers, 6-12 parts of glass fiber powder, 5-12 parts of phenyl silane, 4-9 parts of polyphenylene sulfide, 5-10 parts of polyprenol and 6-12 parts of poly(butylene succinate). The packing material has the advantages that the high temperature resistance is high, the preparation technology is simple, and few pollutants are discharged in the production process.

Description

technical field [0001] The invention relates to a packaging material, in particular to a high-temperature resistant packaging material and a preparation method thereof. Background technique [0002] Packaging materials refer to the materials used to make packaging containers, packaging decoration, packaging printing, packaging and transportation to meet product packaging requirements, including metal, plastic, glass, ceramics, paper, bamboo, wild mushrooms, natural fibers, Main packaging materials such as chemical fibers and composite materials, and auxiliary materials such as coatings, adhesives, strapping tapes, decorations, and printing materials. However, with the development of social industrialization, all walks of life need to involve a wide variety of packaging materials, and at the same time, the demand for corresponding packaging materials has risen sharply. Especially for some special purposes, the gaps in the packaging materials required in special environments ...

AI Technical Summary

Problems solved by technology

Especially for some special purposes, the gaps in the packaging materials required in special environments are quite obvious, such as packaging materials required for the storage and transportation of items in high temperature and low temperature resistant environments. Therefore, it is necessary to develop a packaging material with better High-temperature resistant packaging materials with high performance and no harm to the environment are particularly necessary