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Dressing-metallurgy combined treatment method for waste printed circuit board multi-metal powder

A combined technology of waste circuit boards and dressing and smelting, which is applied in the field of mineral processing and metallurgical processes, can solve problems such as the difficulty in eliminating the odor of smelting flue gas, the difficulty in normal operation of electrolytic refining, and the unqualified cathode copper quality, so as to eliminate dispersion loss and eliminate Effects of environmental pollution and low production cost

Active Publication Date: 2017-02-08
CENT SOUTH UNIV
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Problems solved by technology

[0006] According to production experience and literature reports, the pyro-smelting process of polymetallic powder for circuit boards will bring the following problems: on the one hand, the tin in the polymetallic powder will be dispersed in the three products of blister copper, smelting slag and smoke during the reduction smelting process , not only makes it difficult to effectively recycle tin, but also makes it difficult for the subsequent electrolytic refining to operate normally, making the quality of cathode copper unqualified; on the other hand, the solder mask oil in the multi-metal powder and the remaining substrate will produce toxic and harmful Gas, which brings serious environmental pollution risk, and the smell of smelting flue gas is difficult to eliminate

Method used

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  • Dressing-metallurgy combined treatment method for waste printed circuit board multi-metal powder

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Embodiment 1

[0023] The main components of the polymetallic powder produced during the crushing and sorting process of waste circuit boards in a domestic company are (%): Cu65.0, Sn8.2, Pb9.4, Au50g / t and Ag2500g / t . Both sodium hydroxide and sodium nitrate are industrial-grade reagents, and their mass percentage content is not less than 98.0%.

[0024]Prepare a sodium hydroxide solution with a molar concentration of 2.5mol / L, add polymetallic powder according to the liquid-solid ratio (ratio of liquid volume to solid weight) 4:1, and add 0.4% sodium nitrate by weight of polymetallic powder as a catalyst at the same time. The mixed slurry is added to the stainless steel high-pressure reaction kettle, and the reaction temperature is controlled at 175°C and the oxygen partial pressure is 1.0MPa to react for 3.0h. After the reaction is completed, the temperature is lowered to 75°C and the liquid and solid are separated. The leaching rate of tin is more than 98.0%. ; Control the strength of t...

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Abstract

The invention provides a dressing-metallurgy combined treatment method for waste printed circuit board multi-metal powder. According to the dressing-metallurgy combined treatment method for the waste printed circuit board multi-metal powder, oxidizing leaching of the multi-metal powder is conducted in an alkaline system containing a catalyst through feeding of oxygen, tin is dissolved into a leaching solution in a sodium stannate form, and meanwhile copper is separated from a residual plastic matrix; a copper-enriched object and waste plastic are generated from the leaching solution in a shaking table separation manner, and the copper-enriched object generates crude copper through reduction smelting after material blending. The essence of the dressing-metallurgy combined treatment method for the waste printed circuit board multi-metal powder is that the waste printed circuit board multi-metal powder is treated in a chemical dressing and thermometallurgy combined manner. It is effectively avoided that the tin is reduced and mixed with the crude copper, the environmental pollution problem caused in the smelting process of the waste plastic is eliminated, and the environmental pollution caused in the process of recycling the copper from the multi-metal powder is completely eradicated through the source treatment measure.

Description

technical field [0001] The invention relates to ore dressing and metallurgical processes in the field of nonferrous metallurgy, in particular to a metallurgical method for treating waste circuit board polymetallic powder in a combined manner of chemical beneficiation and pyromelting. Background technique [0002] In recent years, the electrical and electronic industry has developed rapidly, and corresponding waste electric and electronic equipment or e-wate (WEEE) has become the fastest growing urban mineral resource in the world. According to reports, the global e-waste production in 2013 was 39.8 million tons, which rose to 41.8 million tons in 2014, and is expected to reach 50 million tons in 2018, and will maintain a high growth rate of about 2 million tons per year. UN estimates that the global annual The output is 20-50 million tons. According to estimates, 5 million computers were scrapped in the United States between 1997 and 2007, and 6.1 million computers were scra...

Claims

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Application Information

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IPC IPC(8): C22B7/00C22B25/06C22B15/00
CPCC22B7/001C22B7/008C22B15/0052C22B25/04C22B25/06Y02P10/20
Inventor 刘伟锋傅新欣邓循博杨天足张杜超陈霖
Owner CENT SOUTH UNIV
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