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A nano-welding method of electron microscope in-situ heating device combined with solder

A heating device and welding method technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of lack of accuracy, poor controllability, damage to nano units, etc., and achieve the effect of strong diffusion and reliable welding points

Inactive Publication Date: 2018-08-14
LANZHOU UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the means of melting the solder through voltage, laser beam irradiation, etc. lack accuracy. If the experimental parameters are too small, the complete melting of the solder cannot be achieved, and if the experimental parameters are too large, the nano-units in the welding area may be damaged. The welding process requires a certain amount of experience. poor control

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  • A nano-welding method of electron microscope in-situ heating device combined with solder
  • A nano-welding method of electron microscope in-situ heating device combined with solder
  • A nano-welding method of electron microscope in-situ heating device combined with solder

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Embodiment Construction

[0009] This embodiment case is based on the welding method of scanning electron microscope in-situ heating device combined with one-dimensional tin-copper alloy nano-solder to weld an important high-melting point oxide semiconductor nanomaterial tungsten trioxide, but the scope of protection of the present invention is not limited to the following cases .

[0010] Such as figure 1 As shown, the in-situ heating device of the electron microscope is used to directly heat the silicon wafer to completely melt the nano-solder in the welding area, and the solder and the matrix material are continuously and strongly diffused by holding the heat for a certain period of time, so that the matrix material is absorbed by the medium-solder. welded together. The welding process is all carried out in SEM-FIB, the welding area is the micro-nano scale space in the silicon chip, and the silicon chip is in close contact with the heating plate in the in-situ heating device for better heat transfe...

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Abstract

The invention discloses a nano-welding method based on combination of an electron microscope in-situ heating device and a welding flux. According to the nano-welding method disclosed by the invention, the overall welding process is performed in SEM-FIB; an in-situ heating device positioned in a chamber of a scanning electron microscope is used for heating a welding position; meanwhile, ion beams are used for washing a welding region in order to remove impurities (such as oxides, carbon type compounds and organisms on the surface of the welding flux) on the surface layer of a nanometer material, the welding flux is in a molten state and a parent material is prevented from damages; by maintaining the temperature for a certain time, the molten welding flux and the similarly-heated parent material play a continuous and strong diffusion effect, and finally the aim of welding nano-patterns is realized. According to the nano-welding method disclosed by the invention, the heating temperature can be precisely controlled, only a low-melting-point welding flux is molten, and the parent material is prevented from damages, so the nano-welding method has a remarkable advantage for welding a high-melting-point oxide semiconductor nanometer material. The welding method is capable of realizing real-time observation of the overall welding process, extremely high in controllability, convenient, rapid, capable of simultaneously realizing welding of nano-patterns at a plurality of places, and high in efficiency.

Description

technical field [0001] The invention belongs to the field of micro-nano material processing, relates to a nano-welding method using a scanning electron microscope in-situ heating device combined with solder, and can be widely used for welding nano-materials whose melting point is higher than that of the solder. Background technique [0002] With the development of nanotechnology, the assembly of prepared nanomaterials into functional nanodevices depends on the development of micro-nano-scale processing technology, and the welding method of nanomaterials is an urgent problem to be solved in micro-nano processing. At present, the nano-soldering technology based on sacrificial solder has been widely developed and utilized due to its small damage to the welding parent material, no pollution, high precision, fast and simple. One of the welding techniques is to closely contact two nanoprobes with the two ends of the solder to form a conductive path, and then apply a certain voltag...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/005
CPCB23K1/005
Inventor 彭勇张悬郑修军张宏马鸿斌关超帅张军伟薛德胜
Owner LANZHOU UNIVERSITY