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Polyamide hot-melt adhesive

A polyamide hot-melt adhesive and polyamino ether technology, which is applied in adhesives, adhesive additives, polymer adhesive additives, etc., can solve problems such as poor toughness, low-temperature brittleness, low melt viscosity, etc., and achieve low-temperature Good flexibility and adhesion, good flexibility, and the effect of reducing processing costs

Inactive Publication Date: 2017-02-22
东莞市舜天实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of product has disadvantages such as poor toughness, brittleness at low temperature, low melt viscosity and difficult molding, etc., so it must be modified to meet the requirements of the back cover.

Method used

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  • Polyamide hot-melt adhesive
  • Polyamide hot-melt adhesive
  • Polyamide hot-melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Polyamide hot melt adhesive, including the following components by weight percentage:

[0022]

[0023]

[0024] Preferably, the content of ethyl acrylate in the ethylene ethyl acrylate copolymer is 15 wt%, based on the weight of the ethylene ethyl acrylate copolymer.

[0025] Preferably, the weight average molecular weight of the ethylene ethyl acrylate copolymer is 8000-40000.

[0026] Preferably, the polyamine ether is D230.

Embodiment 2

[0028] Polyamide hot melt adhesive, including the following components by weight percentage:

[0029]

[0030] Preferably, the content of ethyl acrylate in the ethylene ethyl acrylate copolymer is 18 wt%, based on the weight of the ethylene ethyl acrylate copolymer.

[0031] Preferably, the weight average molecular weight of the ethylene ethyl acrylate copolymer is 8000-40000.

[0032] Preferably, the polyamine ether is D230.

Embodiment 3

[0034] Polyamide hot melt adhesive, including the following components by weight percentage:

[0035]

[0036] Preferably, the content of ethyl acrylate in the ethylene ethyl acrylate copolymer is 17 wt%, based on the weight of the ethylene ethyl acrylate copolymer.

[0037] Preferably, the weight average molecular weight of the ethylene ethyl acrylate copolymer is 8000-40000.

[0038] Preferably, the polyamine ether is D230.

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Abstract

The invention relates to the technical field of hot-melt adhesives, particularly a polyamide hot-melt adhesive. The polyamide hot-melt adhesive comprises the following components in percentage by weight: 30-45% of dimer acid, 15-20% of caprolactam, 10-15% of adipic acid, 5-20% of hexamethylenediamine, 5-10% of ammonium diacetate, 1-3% of polyetheramine and 10-20% of ethylene-acrylic acid copolymer. Compared with the prior art, the polyamide hot-melt adhesive is prepared by the following steps: carrying out polymerization reaction on the acids and amines to form amides, granulating to form granules, adding the high-melt-index ethylene-acrylic acid copolymer, extruding to obtain a strip, and rolling to obtain the finished product. The ethylene-acrylic acid copolymer performs the toughening function. The product has favorable flexibility, heat stability and processibility; the Shore hardness is 75, the softening point is 185 DEG C, the low temperature resistance is -45 DEG C, the peel strength reaches 6.5 N / mm, and the elongation percentage is up to 620%; and the product has favorable low-temperature flexibility and adhesion, is especially suitable for various lasting adhesive applicators to implement automatic adhesive application, has favorable processability, and greatly lowers the processing cost of shoes.

Description

Technical field [0001] The invention relates to the technical field of hot melt adhesives, in particular to polyamide hot melt adhesives. Background technique [0002] China is the world's largest producer of footwear, with an annual output of 7-8 billion pairs of shoes. Adhesives are used in many processes in shoemaking. The last is to use hot melt glue to firmly bond the upper and the insole. The middle and rear last are mainly made of polyamide hot melt adhesive. The strip of glue passes through the hose of the automatic gluing machine, and the glue is applied between the middle and back of the shoe upper and the insole, and the bonding operation is completed within a few seconds. Polyamide rear rubber for shoes requires good comprehensive properties, including high softening point, good bonding strength and low temperature flexibility, fast curing, moderate hardness (Shore hardness greater than 40) and moderate melt viscosity. At present, the back rubber used in the shoe in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/08C09J177/00C09J123/08C09J11/08C08G69/34C08G69/36
CPCC09J177/08C08G69/34C08G69/36C08L2201/08C08L2205/03C09J11/08C09J177/00C08L23/0869
Inventor 冷先勇
Owner 东莞市舜天实业有限公司
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