Water-soluble conductive nano-metal carbon paste and conductive nano-metal carbon film liner tube

Abstract

The invention provides water-soluble conductive nano-metal carbon paste. According to the water-soluble conductive nano-metal carbon paste, a water-soluble conductive nanometal carbon solution is prepared from a mixture of nano non-ferrous metal powder, such as copper powder, aluminum powder and tin powder, which has the particle size range of 15-60 nm and good electrical conductivity and a water-soluble naometal solution with the concentration being 0.1-10 g / L, and a mixture of nano conductive carbon black with the particle size being 100-1000 nm and a water-soluble nano conductive carbon black solution with the concentration being 10-50 g / L according to the proportion of 1:100, and then nano-metal powder particles are dispersed and embedded into carbon black particles through grinding of a grinding machine, so that the water-soluble conductive nano-metal carbon paste is formed. The water-soluble conductive nano-metal carbon paste has the advantages that the water-soluble conductive nano-metal carbon paste provides a conductive nano-metal carbon film which is superior to a conductive carbon film formed by carbon black or graphite for surface metallization of the hole wall of a glass fiber layer of a PCB, the black hole preparation process is simplified, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of nano-metal products, in particular to a water-soluble conductive nano-metal carbon paste and a conductive nano-metal carbon film liner in a PCB hole metallization process. Background technique [0002] In the process of PCB board manufacturing, the interconnection of wires between layers of double-sided or multi-layer PCB boards is realized by the technology of metallizing the through holes of wires between layers of PCB boards. [0003] The metallization process technology of PCB interlayer conductor through hole has experienced the development process of electroless copper plating process technology, black hole process technology and black shadow process technology. Since the black hole process technology and the black shadow process technology have overcome the defects of the electroless copper plating technology in terms of environmental protection, safety, quality, cost, efficiency, etc., they have b...

AI Technical Summary

Problems solved by technology

[0010] 2, a black hole

[0014] 4. Secondary black hole

[0016] 5. Microetching

[0022] Although the black hole process technology and the black shadow process technology overcome the defects of the electroless copper plating technology, they also have different defects, especially in the double-sided PCB board and PCB thick plate hole metallization process, due to the black hole The process technology uses carbon black as the conductive medium. Limited by the low conductivity of the carbon black material, when the conductive carbon film is formed on the hole wall of the glass fiber board of the PCB board and then electroplated with copper, the penetration plating ability is not enough, so it can only be used locally In the field of thin or flexible boards; while the black shadow process uses graphite as the medium, although the conductivity is better than carbon black, but because the graphite particle size is larger (> 1000 nanometers), it is easy to form residual ink on the hole wall of the copper clad layer of the PCB. Cause subsequent reliability defects; and the common defect of the two is that the manufacturing process is long, that is, secondary cleaning and secondary black hole processes are required, and the production efficiency is low

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