PMDA type bisphenol A tetramine branched polyimide resin film and a preparing method thereof

A technology of polyimide resin and polyamic acid resin, which is applied in the field of polyimide film and its preparation, can solve the problem that it is difficult to obtain high molecular weight polyimide resin, the comprehensive performance of film products is reduced, and the cost of film products is reduced. Advanced problems, to achieve the effect of excellent dimensional stability, significant comprehensive performance superiority, excellent electrical properties and optical properties

Inactive Publication Date: 2017-05-10
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Its disadvantages are: (1) the raw material 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer is extremely expensive, resulting in very high cost of film products, which seriously hinders its further application; ( 2) Due to the low reactivity of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer and aromatic dibasic primary amine, it is difficult to prepare high molecular weight polyimide resin, Therefore, the overall performance of its film products is greatly reduced, especially its mechanical properties.
At present about PMDA type bisphenol A tetramine branched polyimide resin film and preparation method thereof, there is no published document or patent report yet

Method used

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  • PMDA type bisphenol A tetramine branched polyimide resin film and a preparing method thereof
  • PMDA type bisphenol A tetramine branched polyimide resin film and a preparing method thereof
  • PMDA type bisphenol A tetramine branched polyimide resin film and a preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 160.0 grams (0.8 moles) of 4,4'-diaminodiphenyl ether (44ODA), 44.8 grams (0.2 moles) of 2-(4-aminophenyl)-5-aminobenzimidazole (APABI) and 1275 grams of N -Methyl-2-pyrrolidone (NMP) was added to the polymerization bottle, stirred at room temperature, and after it was completely dissolved, cooled in an ice-water bath to below 5°C, 220.2 grams (1.01 moles) of pyromellitic dianhydride (PMDA) was added, and stirred. After reacting at 5° C. for 1 hour, 1700 g of a homogeneous, transparent and viscous PMDA polyamic acid resin solution was obtained, which was designated as PMDA-PAA-1. The Brookfield CAP2000+ vertebral plate viscometer was used to measure the viscosity, and the performance data are shown in Table 1.

Embodiment 2

[0037] 146.0 grams (0.5 moles) of 1,4-bis(4-aminophenoxy)benzene (144BAPB), 54.0 grams (0.5 moles) of m-phenylenediamine (MPDA), 1000 grams of N,N-dimethylacetamide (DMAc) and 720 grams of N-methyl-2-pyrrolidone (NMP) were added to the polymerization bottle, stirred at room temperature, after they were completely dissolved, cooled in an ice-water bath to below 5°C, and 228.9 grams (1.05 moles) of pyromellitic acid di anhydride (PMDA), stirred, and reacted at 8° C. for 3 hours to obtain 2148.9 grams of a homogeneous, transparent, viscous PMDA-type polyamic acid resin solution, which was designated as PMDA-PAA-2. The Brookfield CAP2000+ vertebral plate viscometer was used to measure the viscosity, and the performance data are shown in Table 1.

Embodiment 3

[0039] Add 200.0 g (1.0 mole) of 4,4'-diaminodiphenyl ether (DADPE) and 2600 g of N-methyl-2-pyrrolidone (NMP) into the polymerization bottle, stir at room temperature, and cool in an ice-water bath after completely dissolving To below 5°C, add 235.4 grams (1.08 moles) of pyromellitic dianhydride (PMDA), stir, and react at 10°C for 6 hours to obtain 3035.4 grams of homogeneous, transparent, viscous PMDA-type polyamic acid resin solution , denoted as PMDA-PAA-3. The Brookfield CAP2000+ vertebral plate viscometer was used to measure the viscosity, and the performance data are shown in Table 1.

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Abstract

The invention relates to PMDA type bisphenol A tetramine branched polyimide resin film and a preparing method thereof. The mass ratio of BDAPP and PMDA type linear polyamide acid resin in raw materials of the film is 1:100-800. The preparing method includes mixing an aromatic primary diamine and a strong-polarity aprotic organic solvent, stirring the mixture at room temperature, cooling the mixture to 5 DGE C or below, adding PMDA into the mixture, stirring the mixture, reacting the mixture at 5-10 DGE C for 1-6 h to obtain a PMDA type polyamide acid resin solution, mixing the resin solution with the BDAPP at room temperature, stirring the mixture, forming film, heating the product to raise the temperature to perform dehydration thermal imidization, cooling the product and stripping the film. According to the method, reaction conditions are mild, operation is simple, the cost is low, and the method is environmentally friendly and can achieve industrial large-scale production. The film can be applied in high-tech fields, such as flexible solar cells, space telescopes, large motor main insulation, electromagnetic wire wrapping electrically-insulating materials and flexible copper-clad plates.

Description

technical field [0001] The invention belongs to the field of polyimide film and its preparation, in particular to a PMDA type bisphenol A tetramine branched polyimide resin film and its preparation method. Background technique [0002] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, printing High-tech fields such as circuit boards, wires and cables, motor main insulation, shipping, aerospace, lasers, and optoelectronics. [0003] However, traditional polyimide films, such as the KAPTON film produced by the American DUPONT company and the domestic H film, have a molecular structure of pyromellitic dianhydride, that is, the main monomer raw material is pyromellitic acid di anhydride and 4,4'-diaminodiphenyl ether. [0004] NASA (NASA) plans to launc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18
CPCC08L79/08C08G73/1071C08J5/18C08J2379/08
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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