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A flexible and resilient thermally conductive and electrically conductive gasket composition and its preparation method

The technology of a conductive gasket and a composition is applied in the field of a flexible and resilient thermally conductive and conductive gasket composition and its preparation field, and can solve the problems of poor resilience of the thermally conductive gasket, large volume resistivity, poor heat dissipation reliability, and the like, Achieve the effect of improving resilience, improving thermal conductivity, and reducing volume resistivity

Active Publication Date: 2019-10-29
DONGGUAN NYSTEIN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional thermal interface materials are generally insulating, regardless of conductivity, and the volume resistivity is greater than 1Ω.cm, such as the thermally conductive materials disclosed in patents CN101151326A, CN101942122A and CN102051049A
Traditional conductive materials do not have high thermal conductivity. In order to improve the thermal conductivity, the amount of metal filler is increased, and the hardness is also increased. In order to maintain low hardness, a soft and low-crosslinking polymer material is used, so that the thermal pad is resilient. become worse
Thermal pads need a certain degree of resilience, because electronic products work repeatedly and shut down, components will expand with heat and contract with cold, and the thermal interface gap will shrink and increase repeatedly. When the temperature is high and the gap shrinks, the thermal pad is compressed. When the shutdown temperature decreases, the gap increases. If the gasket cannot rebound, there will be a gap between the thermal pad and the chip or heat sink. The gap will gradually increase, and the reliability of heat dissipation will become worse and worse.

Method used

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  • A flexible and resilient thermally conductive and electrically conductive gasket composition and its preparation method
  • A flexible and resilient thermally conductive and electrically conductive gasket composition and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0033] According to the above preparation method, add 100 parts of polyether amine JEFFAMINE® D2000, 2.5 parts of titanate dispersant TCA-KTTO, 1 part of antioxidant Irganox1010 into the kneader and vacuumize and mix evenly, add 50 microns of nickel coating 450 parts of aluminum powder, then add 100 parts of 300-mesh conductive and thermally conductive elastic micropowder and mix evenly, and finally add 6 parts of cyclocarbonate curing agent TMP Tri-C5 and vacuumize and stir evenly to obtain thermally conductive paste. Then, the conductive and thermally conductive slurry is rolled into sheets, and placed in a constant temperature oven at 80° C. for 1-5 hours to be vulcanized to obtain a thermally and electrically conductive composite material.

specific Embodiment 2

[0035] According to the above preparation method, add 100 parts of polyether amine JEFFAMINE® XJT-509 (T-3000), 1.9 parts of titanate dispersant TCA-KTTO, and 1.5 parts of antioxidant Irganox1010 into the kneader and mix evenly under vacuum, add 550 parts of 65-micron silver-coated copper powder, then add 200 parts of 500-mesh conductive and thermally conductive elastic micropowder and mix evenly, and finally add 25 parts of cyclocarbonate curing agent PPO-Bis-C5 and vacuumize and stir evenly to obtain thermally conductive paste. Then the conductive and thermally conductive paste was rolled into sheets, and placed in a constant temperature oven at 80° C. for 2 hours to be vulcanized to obtain a thermally and electrically conductive composite material.

specific Embodiment 3

[0037] According to the above preparation method, add 100 parts of polyetheramine JEFFAMINE® D2000, titanate dispersant TCA-KTTO, antioxidant Irganox1010 1 part to the kneader and mix evenly under vacuum, add 470 parts of 60 micron nickel-coated copper powder , then add 200 parts of conductive and thermally conductive elastic micropowder and mix evenly, and finally add 6 parts of cyclocarbonate curing agent TMP Tri-C5 and vacuumize and stir evenly to obtain thermally conductive paste. Then the conductive and thermally conductive paste was rolled into sheets, and placed in a constant temperature oven at 80° C. for 2 hours to be vulcanized to obtain a thermally and electrically conductive composite material.

[0038] In the traditional process of preparing flexible conductive and thermal composite materials, the steps and components are as follows:

[0039] Add 100 parts of 2000 molecular weight polyether polyol D2000 in the kneader, titanate dispersant TCA-KTTO, antioxidant Irg...

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Abstract

The invention provides a flexible resilient thermal-conductive electric-conductive gasket composition. The composition is made from 100 parts of polyetheramine, 5-125 parts of cyclic carbonate, 0.5-5 parts of anti-oxidant 1010, 2-10 parts of a titanate coupling agent, 100-300 parts of elastic micro-powder, and 300-900 parts of thermal-conductive electric-conductive powder. The invention further provides a preparation method of the composition. A thermal-conductive electric-conductive gasket processed and moulded from the composition is applied to a power electronic component and an electronic module heat dissipation system, and can dissipate heat and conduct static electricity away. After sulfuration, the gasket has the hardness of Shore 00 in a range of 40-60, the heat conductivity coefficient more than 2W / m*K, and specific resistance less than 0.1 ohm-cm, and is excellent in resilience. The gasket can be closely attached between a chip and a cooling fin for a long time, causes no gap because thermal expansion and contraction, and ensures the reliability of heat dissipation.

Description

technical field [0001] The invention relates to a heat dissipation system applied to power electronic components and electronic modules, in particular to a thermal interface material. Background technique [0002] With the development of electronic components and electronic modules towards high integration and miniature size, the calorific value is increasing, and the problems of slow operation and crash caused by temperature rise are increasing. Optimizing heat dissipation design becomes more and more important. . In the heat dissipation system design, the heat generated by chips and modules is conducted and released to the external environment through heat pipes, heat sinks, and metal casings. Thermal interface materials are applied to the joints of chips, heat pipes, heat sinks, and casings to fill tiny gaps , Optimize the heat dissipation channel to help reduce the operating temperature of chips and modules. Thermal interface materials include thermal pads, thermal pas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08L71/00C08K13/04C08K5/134C08K3/08C08K9/10C08K7/06C08K7/00C09K5/14
CPCC08K2201/007C08L71/00C08L2201/04C09K5/14C08L83/04C08K13/04C08K5/1345C08K5/10C08K3/08C08K9/10C08K7/06C08K7/00
Inventor 杨小王蒙肇奎
Owner DONGGUAN NYSTEIN ELECTRONICS MATERIALS CO LTD