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Multipurpose Compound Flux Paste

A soldering paste, multi-purpose technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of difficult to guarantee the quality of welding, cumbersome welding process, etc., to achieve good dry resistance, suitable for wide effect

Inactive Publication Date: 2019-02-26
深圳市百佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual use, in order to improve the soldering performance and improve the soldering effect, it is often necessary to use soldering paste; however, due to the different liquidus lines of different soldering pastes, when it is necessary to use different soldering pastes for soldering, it is often necessary to use different soldering pastes. Soldering paste, which makes the soldering process very cumbersome, and it is difficult to guarantee the quality of soldering with the same soldering paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] A multi-purpose composite soldering paste, comprising the following components in parts by weight: 1 part of sebacic acid, 2 parts of adipic acid, 0.3 part of succinic acid, 0.5 part of itaconic acid, 0.3 part of diphenylguanidine hydrobromide Parts, benzotriazole: 0.7 parts; Rosin: 56 parts; Diethylene glycol octyl ether: 70 parts; Hydrogenated castor oil: 5.5 parts; Polyol ester oleate: 0.8 parts.

[0055] Preparation method: according to the above-mentioned components and proportions, heat and melt each component, stir, mix evenly, cool, grind, and stand still to obtain the finished product.

[0056] In this embodiment, benzotriazole can be replaced by di-tert-butyl-p-cresol or triethanolamine; rosin can be replaced by perhydrogenated rosin, 604 gum rosin or lead-free 125 rosin; diethylene glycol octyl ether can be ethylene glycol butyl ether , propylene glycol phenyl ether, hexanediol, hexyldecanol, polyoxyethylene octylphenol ether or dipropylene glycol dimethyl et...

Embodiment 2

[0058] A multi-purpose composite soldering paste, comprising the following components in parts by weight: 1 part of sebacic acid, 2 parts of adipic acid, 0.3 part of succinic acid, 0.5 part of itaconic acid, 0.3 part of diphenylguanidine hydrobromide Parts, benzotriazole: 0.7 parts; Rosin: 56 parts; Diethylene glycol octyl ether: 70 parts; Hydrogenated castor oil: 5.5 parts; Polyol ester oleate: 0.8 parts, Succinic anhydride 1 part, 0.5 parts of glutaric acid, 0.3 parts of cetyltrimethylammonium bromide, and 0.3 parts of diethylamine hydrobromide.

[0059] Preparation method: according to the above-mentioned components and proportions, heat and melt each component, stir, mix evenly, cool, grind, and stand still to obtain the finished product.

[0060] In this embodiment, benzotriazole can be replaced by di-tert-butyl-p-cresol or triethanolamine; rosin can be replaced by perhydrogenated rosin, 604 gum rosin or lead-free 125 rosin; diethylene glycol octyl ether can be ethylene g...

Embodiment 3

[0062] A multi-purpose composite soldering paste, comprising the following components in parts by weight: 4 parts of sebacic acid, 6 parts of adipic acid, 0.8 part of succinic acid, 1 part of itaconic acid, 0.8 parts of diphenylguanidine hydrobromide Parts, benzotriazole: 2.2 parts; Rosin: 88 parts; Diethylene glycol octyl ether: 125 parts; Hydrogenated castor oil: 15 parts; Polyol ester oleate: 2.3 parts, Succinic anhydride 2 parts, 1 part of glutaric acid, 0.8 part of cetyltrimethylammonium bromide, and 0.8 part of diethylamine hydrobromide.

[0063] Preparation method: according to the above-mentioned components and proportions, heat and melt each component, stir, mix evenly, cool, grind, and stand still to obtain the finished product.

[0064] In this embodiment, benzotriazole can be replaced by di-tert-butyl-p-cresol or triethanolamine; rosin can be replaced by perhydrogenated rosin, 604 gum rosin or lead-free 125 rosin; diethylene glycol octyl ether can be ethylene glyco...

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Abstract

The invention belongs to the technical field of welding materials, and provides multipurpose composite flux paste in order to solve the technical problems that in the prior art, welding operation is complex and the welding quality is difficult to ensure due to the fact that solder paste usually needs to cooperate with different kinds of flux paste when welding is conducted. The multipurpose composite flux paste comprises, by weight, 4.1-17.2 parts of an activator, 0.7-2.2 parts of a corrosion inhibitor, 56-88 parts of resin, 70-125 parts of a solvent, 5.5-15 parts of a thixotropic agent, and 0.8-2.3 parts of a humectant, specifically, the activator comprises 1-4 parts of sebacic acid, 2-6 parts of adipic acid, 0.3-0.8 part of succinic acid, 0.5-1 part of itaconic acid and 0.3-0.8 part of diphenyl guanidine hydrobromide. The multipurpose composite flux paste can meet the using requirements of solder paste with different components, and accordingly, the defect that existing solder paste needs to be used with the flux paste in a one-to-one matching mode is overcome; and furthermore, the multipurpose composite flux paste is free of skinning and good in dry resistance, a welded surface for smelting is provided with transparent and colorless membranoid substances and does not need to be cleaned, and the surface packaging requirements of various electronic products are met.

Description

technical field [0001] The invention belongs to the technical field of soldering materials, and in particular relates to a multi-purpose composite soldering flux with a wide application range. Background technique [0002] Surface mount technology is currently the most popular technology and process in the electronic assembly industry. In order to prevent the solder paste inside the electronic components from melting during reflow soldering, the solder paste commonly used now mainly uses Pb as the main component. For example, Sn5-Pb92.5-Ag2.5 alloy, the solidus temperature is 287 ° C, the liquidus temperature is 296 ° C; Pb-5Sn alloy, the solidus temperature is 300 ° C, the liquidus temperature is 314 ℃; Sn63Pb37 alloy, liquidus 183 ℃; Sn60Pb40 alloy, liquidus 190 ℃; Sn55Pb45 alloy, liquidus 198 ℃; Sn50Pb50 alloy, liquidus 216 ℃. In actual use, in order to improve the soldering performance and improve the soldering effect, it is often necessary to use soldering paste; howev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362
Inventor 谢艳舞
Owner 深圳市百佳电子有限公司