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Light-cured high-heat-conduction packaging adhesive with infrared window property and preparation method of light-cured high-heat-conduction packaging adhesive

An infrared window, light curing technology, applied in the direction of polymer adhesive additives, modified epoxy resin adhesives, non-polymer adhesive additives, etc. Insulation and thermal conductivity, and the selectivity of infrared reflection of the encapsulant are less concerned, to achieve the effect of good sealing, strong temperature shock resistance, and high thermal conductivity

Inactive Publication Date: 2017-05-31
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are many types of encapsulants currently on the market, but most of these products only consider the bonding strength, insulation and thermal conductivity of the encapsulant and the base material, and less attention has been paid to whether the encapsulant has infrared reflection selectivity, and there are basically no relevant reports

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] This embodiment provides a photocurable high thermal conductivity packaging adhesive with infrared window characteristics, and a preparation method of the photocurable high thermal conductivity packaging glue with infrared window characteristics.

[0023] The light-curable high thermal conductivity encapsulant with infrared window properties is composed of three components in the following mass percentages: 50% organic phase, 25% thermal conductive material, and 25% infrared window material.

[0024] Wherein, the organic phase includes the following components in mass percentage: 85% photocurable resin (bisphenol A epoxy acrylic resin), 5% photoinitiator (2-isopropylthioxanthone), 7% Photoactive monomer (dipentaerythritol hexaacrylate), 1.5% defoamer (hydrophobic modified silica), 1.5% dispersant (BYK-204).

[0025] Wherein, the thermal conductive material is AlN with a particle size of 1.5 μm.

[0026] Among them, the infrared window material is CoFe with a particle s...

Embodiment 2

[0032] This embodiment provides a photocurable high thermal conductivity packaging adhesive with infrared window characteristics, and a preparation method of the photocurable high thermal conductivity packaging glue with infrared window characteristics.

[0033] The light-curable high thermal conductivity encapsulant with infrared window properties is composed of three components in the following mass percentages: 65% organic phase, 15% thermal conductive material, and 20% infrared window material.

[0034] Wherein, the organic phase includes the following components in mass percentage: 85% photocurable resin (o-cresol novolac epoxy acrylic resin), 4% photoinitiator (2,4,6-trimethylbenzoyl- Diphenylphosphine oxide), 8% photoactive monomer (ethoxylated trimethylolpropane triacrylate), 1% defoamer (hydrophobically modified silica), 2% dispersant (BYK- 204).

[0035] Wherein, the thermally conductive material is SiC with a particle size of 1 μm.

[0036] Among them, the infrare...

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Abstract

The invention relates to the technical field of conductive paste, in particular to a light-cured high-heat-conduction packaging adhesive with an infrared window property and a preparation method of the light-cured high-heat-conduction packaging adhesive. The light-cured high-heat-conduction packaging adhesive provided by the invention has an ultraviolet light curing property, is short in curing time and adjustable in toughness, and further has a selective infrared radiation property, the infrared radiation rate of the packaging adhesive at a wave band of 8-14[mu] m is greater than 0.9, and packaging adhesive has a high heat conduction coefficient, that is, greater than 9N / m*k. The packaging adhesive provided by the invention has good binding force with metals, polymer membranes and ceramics, and is good in sealing property, wide in use temperature range and good in temperature impact resistance, and the adhesive force of the packaging adhesive is greater than 9N / mm<2>.

Description

technical field [0001] The invention relates to the technical field of conductive paste, in particular to a photocurable high thermal conductivity packaging adhesive with infrared window characteristics and a preparation method thereof. Background technique [0002] Encapsulation glue is usually used as thermal insulation material for electronic components. It is usually composed of resin, additives and functional additives. It is a paste-like substance prepared by stirring and dispersing, three-roll rolling or sand milling. It is stored at room temperature. When used, it is coated on the surface of components, and then cured at a certain temperature. It is usually required that the encapsulant has the characteristics of high bonding strength with the substrate, high insulation, and excellent thermal conductivity. [0003] There are many types of encapsulants currently on the market, but most of these products only consider the bonding strength, insulation and thermal condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10C09J11/04C09J11/08C09J11/06
CPCC08K2201/003C08L2201/08C09J11/04C09J11/06C09J11/08C09J163/10C08L91/00C08K13/06C08K9/00C08K3/36C08K2003/2227C08K2003/222C08K2003/2296C08K2003/385C08K3/34C08K2003/2241C08K3/24
Inventor 蒋国辉苏冠贤
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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