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Manufacturing method of direct-light-type LED backlight

A technology for an LED backlight source and a manufacturing method, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of low light conversion efficiency, high production cost, and complicated manufacturing process of quantum dot light-emitting devices, and achieve high light conversion efficiency. , the effect of high excitation efficiency and low production cost

Inactive Publication Date: 2017-05-31
HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention lies in that the quantum dot light-emitting devices in the prior art have technical bottlenecks such as complex manufacturing process, low light conversion efficiency, and high production cost, thus proposing a simple manufacturing process, high light conversion efficiency, and low cost Manufacturing method of low-cost direct-lit LED backlight

Method used

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  • Manufacturing method of direct-light-type LED backlight
  • Manufacturing method of direct-light-type LED backlight
  • Manufacturing method of direct-light-type LED backlight

Examples

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Embodiment 1

[0029] This embodiment provides a method for manufacturing a direct-lit LED backlight, the method comprising the following steps:

[0030] a. Weigh 0.02g of CdTe and ZnSe quantum dot phosphors with an emission wavelength of 620nm, of which 0.01g of CdTe quantum dot phosphors, and weigh 0.013g of PbZrO with an emission peak wavelength of 545nm 3 The green light quantum dot phosphor is uniformly mixed with the three quantum dot phosphors to obtain a mixed phosphor, and the quantum dot phosphor is in powder form;

[0031] b. Weigh 9.9g of epoxy photocurable glue and add it into the mixed fluorescent powder, then carry out vacuum stirring, and stir evenly to obtain quantum dot fluorescent glue;

[0032] c. Coating the quantum dot fluorescent glue on the inner surface of the LED lens. In this embodiment, the coating thickness of the quantum dot fluorescent glue is 5 μm, and the LED lens is placed in an ultraviolet curing furnace. Irradiate with 230nm ultraviolet light for 3s to cu...

Embodiment 2

[0037] This embodiment provides a method for manufacturing a direct-lit LED backlight, the method comprising the following steps:

[0038]a. Weigh 0.04g of red light BaTiO with a light emitting wavelength of 628nm 3 Quantum dot phosphor, and weigh 0.012g of AgInS with the peak wavelength of emitted light at 455nm 2 Blue light quantum dot phosphor powder and 0.028g GaS green light quantum dot phosphor powder with emission wavelength of 539nm, three kinds of quantum dot phosphor powders are mixed evenly to obtain mixed phosphor powder, and the quantum dot phosphor powder is solvent dispersed;

[0039] b. Weigh 0.08g of silicone-based light-curable glue and add it to the mixed fluorescent powder, then carry out vacuum stirring, and stir evenly to obtain quantum dot fluorescent glue;

[0040] c. Coating the quantum dot fluorescent glue on the outer surface of the LED lens. In this embodiment, the coating thickness of the quantum dot fluorescent glue is 500 μm, and the LED lens is...

Embodiment 3

[0045] This embodiment provides a method for manufacturing a direct-lit LED backlight, the method comprising the following steps:

[0046] a. Weigh 0.54g of fluoride red phosphor powder with emission wavelength of 632nm, and weigh 0.012g of GaAs and GaN green light quantum dot phosphor powder with emission peak wavelength of 535nm, and mix the three phosphors evenly to obtain mixed fluorescence powder, the quantum dot fluorescent powder is powder;

[0047] b. Weigh 1.31g of polyurethane light-curable glue and add it into the mixed fluorescent powder, then carry out vacuum stirring, and stir evenly to obtain quantum dot fluorescent glue;

[0048] c. Coating the quantum dot fluorescent glue on the outer surface of the LED lens. In this embodiment, the coating thickness of the quantum dot fluorescent glue is 180 μm, and the LED lens is placed in an ultraviolet curing furnace. Irradiate with 365nm ultraviolet light for 50s to cure the quantum dot fluorescent glue;

[0049] d. Th...

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Abstract

The present invention discloses a manufacturing method of a direct-light-type LED backlight. The method comprises: mixing mixed phosphors including quantum dot fluorescent powder with photocuring glue to obtain quantum dot fluorescent glue, coating the quantum dot fluorescent glue at the surface of a LED lens in the LED backlight, and coating a photocuring glue protective layer at the surface of the fluorescent glue after the fluorescent glue is solidified. The manufacturing method of direct-light-type LED backlight is simple in manufacturing technology, and the half-wave width of the quantum dot fluorescent glue made of quantum dot materials is small so as to greatly improve the color gamut value of the LED backlight, the color gamut value of the direct-light-type LED backlight can reach above 97% of NTSC, and the light conversion efficiency of a light source obtained through the technology is high, and the production cost is low. The photocuring glue protective layer can effectively reduce the erosion of moisture and oxygen for the quantum dot materials, can prevent the quantum dot materials from directly contacting a luminous chip, and is not liable to high-temperature influence of the luminous chip so as to improve the reliability of the LED light source.

Description

technical field [0001] The invention belongs to the technical field of LED backlight sources, and relates to a method for manufacturing an LED backlight source, in particular to a method for manufacturing a direct-type LED backlight source. Background technique [0002] Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. [0003] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. At present, the commonly used LED backlight usually adopts the form of blue light chip to excite YAG...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/54H01L33/58
CPCH01L2224/48091H01L2924/181H01L33/58H01L33/504H01L33/505H01L33/507H01L33/54H01L2933/0041H01L2933/005H01L2933/0058
Inventor 张志宽高丹鹏邢其彬周世官王旭改
Owner HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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