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Method for improving sulfuration resistant and UV resistant performances of organosilicon material for LED packaging

An LED packaging and silicone technology, applied in coatings, electrical components, circuits, etc., can solve the problems of poor high and low temperature resistance, poor aging resistance, blackening of silver layer, etc., and achieve good adhesion and vulcanization resistance. good effect

Inactive Publication Date: 2017-05-31
深圳市佑明光电有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The packaging materials currently used in LEDs include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials, among which epoxy resin and silicone materials are used as the main packaging materials, and the internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, so it quickly replaces epoxy resin. It is widely used in the field of LED packaging, but silicone materials, especially low-refractive-index silicone materials, cause oxygen and moisture permeability due to low cross-linking density. Under the action of sulfur-containing gases, they will partially penetrate the packaging material. Because the interface is non-adhesive, it is easy to generate silver sulfide, which leads to blackening of the silver layer. In addition, after uv irradiation, the luminous flux drops rapidly

Method used

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  • Method for improving sulfuration resistant and UV resistant performances of organosilicon material for LED packaging
  • Method for improving sulfuration resistant and UV resistant performances of organosilicon material for LED packaging
  • Method for improving sulfuration resistant and UV resistant performances of organosilicon material for LED packaging

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Effect test

Embodiment 1

[0023] A method for improving the sulfuration-resistant and UV-resistant performance of organic silicon materials for LED packaging, comprising the steps of:

[0024] 1) Clean the surface of the LED bracket;

[0025] 2) Prepare the coating: uniformly mix 25 parts of hydrogen-containing silicone resin and 75 parts of solvent anhydrous ether to obtain a coating;

[0026] 3) uniformly spray the coating obtained in step 2) onto the surface of the chip;

[0027] 4) Uniform electron beam irradiation is carried out to the chip surface obtained in step 3), the electron beam is 500mW, and the irradiation time is 5 seconds, so that the coating is cured to form a dense silicon dioxide structure;

[0028] 5) Finally, remove the excess coating, apply the silicone material for encapsulation, and cure and shape.

Embodiment 2

[0030] A method for improving the sulfuration-resistant and UV-resistant performance of organic silicon materials for LED packaging, comprising the steps of:

[0031] 1) Clean the surface of the LED bracket;

[0032] 2) Prepare the coating: uniformly mix 23 parts of hydrogen-containing silicone resin and 77 parts of solvent anhydrous n-heptane to obtain a coating;

[0033] 3) uniformly spray the coating obtained in step 2) onto the surface of the chip;

[0034] 4) Uniform electron beam irradiation is carried out to the chip surface obtained in step 3), the electron beam is 700mW, and the irradiation time is 4 seconds, so that the coating is cured to form a dense silicon dioxide structure;

[0035] 5) Finally, remove the excess coating, apply the silicone material for encapsulation, and cure and shape.

Embodiment 3

[0037] A method for improving the sulfuration-resistant and UV-resistant performance of organic silicon materials for LED packaging, comprising the steps of:

[0038] 1) Clean the surface of the LED bracket;

[0039] 2) Prepare the coating: uniformly mix 20 parts of hydrogen-containing silicone resin and 80 parts of solvent anhydrous acetone to obtain a coating;

[0040] 3) uniformly spray the coating obtained in step 2) onto the surface of the chip;

[0041] 4) Uniform electron beam irradiation is carried out to the chip surface obtained in step 3), the electron beam is 1000mW, and the irradiation time is 3 seconds, so that the coating is cured to form a dense silicon dioxide structure;

[0042] 5) Finally, remove the excess coating, apply the silicone material for encapsulation, and cure and shape.

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Abstract

The invention relates to a method for improving sulfuration resistant and UV resistant performances of an organosilicon material for LED packaging. The method comprises the following steps: cleaning the surface of an LED support; preparing a coating; uniformly mixing hydrogen silicone containing resin and a solvent, wherein the weight percentage of the hydrogen silicone containing resin is 20 wt% to 25 wt%; uniformly spraying the obtained coating to a chip surface; carrying out uniform electron beam irradiation on the obtained chip surface, so that the coating is cured to form a compact silicon dioxide structure; and then removing unnecessary coating, applying the organosilicon material for LED packaging, and carrying out curing molding. The method has the beneficial effects that a packaged LED prepared and obtained by using the method disclosed by the invention overcomes the disadvantages that a traditional organosilicon material is permeable for air and moisture after being packaged and a part of the traditional organosilicon material can penetrate through a packaging material under the effect of sulfurous gas, so that the sulfuration resistance is high; after long-term ultraviolet (UV) irradiation, the stability of luminous flux can also be maintained; and the caking property of a silver layer and a silica gel interface is good, so that silver sulfide is unlikely to generate.

Description

technical field [0001] The invention relates to a method for improving the sulfuration resistance and UV resistance of organic silicon materials used for LED packaging, and belongs to the technical field of LED packaging. Background technique [0002] The packaging materials currently used in LEDs include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials, among which epoxy resin and silicone materials are used as the main packaging materials, and the internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, so it quickly replaces epoxy resin. It is widely used in the field of LED packaging, but silicone materials, especially low-refractive-index silicone materials, cause oxygen and moisture permeab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56C09D183/05
CPCH01L33/56C09D183/04H01L2933/005
Inventor 吴军吴学坚陈维
Owner 深圳市佑明光电有限公司
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