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A kind of easy-release photosensitive resin for 3D printing and preparation method thereof

A photosensitive resin, 3D printing technology, applied in the direction of additive processing, etc., can solve the problem of poor release ability, achieve the effect of improving release ability, improving printing accuracy and quality, and reducing scattering

Active Publication Date: 2019-01-08
殷若瑜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to overcome the shortcoming of the poor release ability of the current photosensitive resin for 3D printing, and provide an easy-release photosensitive resin for 3D printing and its preparation method

Method used

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  • A kind of easy-release photosensitive resin for 3D printing and preparation method thereof
  • A kind of easy-release photosensitive resin for 3D printing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Add 200 grams of 1,3-bis(3-glycidyl etheroxypropyl)tetramethyl to a 500-milliliter four-neck flask equipped with a 200-milliliter constant-pressure dropping funnel, a mechanical stirring and condensing device, and a temperature control device. base disiloxane (commercially available product, CASNO.126-80-7), heating while stirring. At the same time, 75.6 grams of acrylic acid, 1.38 grams of triethanolamine and 0.55 grams of p-tert-butylphenol were added to a 200 ml beaker, stirred evenly and then transferred to the above-mentioned constant pressure funnel. When the temperature in the flask rose to 70°C, the mixed solution of acrylic acid was added dropwise, and the dropwise addition was completed within 90 minutes. Then heat up to 90°C to continue the reaction, and regularly monitor the acid value of the system. After 6 hours of reaction, it is found that the acid value of the system remains unchanged, indicating that the reaction has been basically completed. After vac...

Embodiment 2

[0037] Add 200 grams of 1,3-bis(3-glycidyl etheroxypropyl)tetramethyl to a 500-milliliter four-neck flask equipped with a 200-milliliter constant-pressure dropping funnel, a mechanical stirring and condensing device, and a temperature control device. base disiloxane and heat with stirring. At the same time, 79.6 g of acrylic acid, 2.80 g of N,N-dimethylaniline and 0.70 g of p-hydroxyanisole were added into a 200 ml beaker, stirred evenly and then transferred to the above-mentioned constant pressure funnel. When the temperature in the flask rose to 80°C, the mixed solution of acrylic acid was added dropwise, and the dropwise addition was completed within 70 minutes. Then heat up to 95°C to continue the reaction, and regularly monitor the acid value of the system. After 4 hours of reaction, it is found that the acid value of the system remains unchanged, indicating that the reaction has been basically completed. After vacuum pumping to further remove the remaining acrylic acid i...

Embodiment 3

[0039] Add 200 grams of 1,3-bis(3-glycidyl etheroxypropyl)tetramethyl to a 500-milliliter four-neck flask equipped with a 200-milliliter constant-pressure dropping funnel, a mechanical stirring and condensing device, and a temperature control device. base disiloxane and heat with stirring. At the same time, 99.8 grams of methacrylic acid, 3.00 grams of triphenylphosphine and 0.75 grams of hydroquinone were added to a 200 ml beaker, stirred evenly and then transferred to the above-mentioned constant pressure funnel. When the temperature in the flask rose to 85°C, the mixed solution of methacrylic acid was added dropwise, and the dropwise addition was completed within 60 minutes. Then heat up to 100°C to continue the reaction, and regularly monitor the acid value of the system. After 3 hours of reaction, it is found that the acid value of the system remains unchanged, indicating that the reaction has been basically completed. , the reaction was stopped, the temperature was lowe...

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Abstract

The invention relates to a 3D printing material and aims at providing easy-to-release photosensitive resin for 3D printing and a preparation method thereof. The photosensitive resin is prepared from the following raw materials in parts by weight: 20-40 parts of a silicon-containing acrylated epoxy prepolymer, 40-60 parts of an acrylic ester prepolymer, 20-40 parts of a reactive diluent, 2-5 parts of a photoinitiator and 0-2 parts of an assistant, wherein the total parts by weight of the silicon-containing acrylated epoxy prepolymer, the acrylic ester prepolymer and the reactive diluent is 100. The release capability of a cured material is improved, the release step in the printing process can be smoothly carried out, the pull force of a stepper motor in the release process is reduced, the stability of a machine is improved, the service life of the stepper motor is prolonged, a special release film does not need to be used in addition, the manufacturing cost of 3D printing is reduced and the printing accuracy and quality are improved. The 3D printing material has the advantages of low viscosity, faint odor, low VOC content, adjustable toughness and excellent heat resistance, the cured material has good toughness and the softness of printed articles can be finally adjusted.

Description

technical field [0001] The invention relates to the field of new materials for 3D printing, in particular to the field of photosensitive resins, in particular to an easy-release photosensitive resin for 3D printing and a preparation method thereof. Background technique [0002] Photocuring refers to the process of rapid polymerization of liquid photosensitive resin to form solid products under the action of ultraviolet light. It has the advantages of energy saving, environmental protection and high efficiency. It has been widely used in the fields of coatings, adhesives and inks. Stereo Lithography Apparatus (SLA) 3D printing is a new application with great commercial value. SLA light-curing rapid prototyping is the earliest rapid prototyping technology. It is based on the principle of layered manufacturing and layer-by-layer superposition, and uses photosensitive resin as a raw material to obtain the required physical prototype. [0003] According to different application ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/10C08F283/00C08F230/08C08F2/48B33Y70/00
CPCB33Y70/00C08F2/48C08F283/008C08F283/105C08F230/08
Inventor 闵玉勤洪佳丽黄伟王浩仁
Owner 殷若瑜