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Method for changing wettability of liquid drops on surface of high-temperature solid

A high-temperature solid, wettable technology, applied in ion implantation plating, metal material coating process, coating, etc.

Inactive Publication Date: 2017-07-04
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a method for solving the existing high-load and high-efficiency heat transfer requirements in order to solve the existing problems in the prior art. The present invention provides a method for changing the wettability of liquid droplets on the surface of high-temperature solids. The method of coordinating the microstructure and chemical composition of the solid interface and changing the physical and chemical properties of the working droplets is relatively simple, economical and environmentally friendly, and has good practicability

Method used

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  • Method for changing wettability of liquid drops on surface of high-temperature solid
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  • Method for changing wettability of liquid drops on surface of high-temperature solid

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Embodiment 1

[0060] In this embodiment, the working liquid droplet uses a surfactant sodium dodecylsulfonate SDS solution, and the base material is a smooth silicon wafer.

[0061] The first step is the selection of working droplets;

[0062] In the first step, the surfactant sodium dodecylsulfonate SDS solution is selected as the working droplet, and the configuration is 0mol / L, 1.0×10 -3 mol / L, 4.0×10 -3 mol / L, 9.0×10 -3 mol / L, 1.0×10- 2 mol / L aqueous solution of sodium dodecylsulfonate.

[0063] The second step is the cleaning of the silicon wafer;

[0064] The second step is further specifically immersing the smooth silicon wafer (P-type, crystal orientation 100) in acetone and ethanol for 15 minutes, followed by rinsing with water, and then immersing in a solution with a volume ratio of 98% sulfuric acid and hydrogen peroxide at a volume ratio of 3:1. , heated at 80°C for 30 minutes, took it out and washed it with a large amount of water, at this time the silicon wafer is hydroph...

Embodiment 2

[0071] In this embodiment, the working droplets use SiO 2 Nanofluid, the base material is silicon nanowire structure.

[0072] The first step is the selection of working droplets;

[0073] The first step selects SiO 2 Nanofluids as working droplets. Prepare nanofluids of 0g / L, 0.05g / L, 0.1g / L, 0.2g / L, and 0.3g / L, but place them in 100mL volumetric flasks for future use. Due to the small size effect of nanoparticles, agglomeration is easy to occur, so ultrasonic dispersion should be carried out in an ultrasonic machine during the preparation process, and the ultrasonic time is 10h. Ultrasonic dispersion should be carried out in the ultrasonic machine before the next use to avoid the agglomeration of nanoparticles and affect the experimental results

[0074] The second step is the cleaning of the silicon wafer;

[0075] Soak a smooth silicon wafer (type P, crystal orientation 100) in acetone and ethanol for 15 minutes, rinse with water, then immerse in a solution of 98% sul...

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Abstract

The invention provides a method for changing wettability of liquid drops on the surface of a high-temperature solid, accordingly, regulation and control over the form of the liquid drops on the surface of the high-temperature solid can be achieved, the heat transfer efficiency is effectively improved, and the heat transfer technology is enhanced. The method is economical, simple and friendly to the environment.

Description

technical field [0001] The invention relates to a method for changing the wettability of droplets on a high-temperature solid surface, which can effectively improve heat transfer efficiency, strengthen heat transfer technology, and save energy utilization. Background technique [0002] The process of liquid droplets hitting the high-temperature solid surface is closely related to many industrial processes, such as combustion in internal combustion engines, spray cooling, inkjet printing, plasma sputtering, etc. The mechanism of action between the impacting liquid droplets and the solid wall directly determines the heat transfer implementation effect of the above process. Therefore, strengthening the heat transfer efficiency between solid and liquid has important positive significance for adapting to the new direction of energy saving and environmental protection in today's economic development. [0003] We know that in the solid-liquid heat transfer process, the cooling liq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/12C23C14/24C23C14/02
CPCC23C14/021C23C14/12C23C14/24
Inventor 王景明张佩佩彭宝绪
Owner BEIHANG UNIV
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