Composite additive of thick-specification copper foil and production and preparing process of composite additive
A compound additive and preparation technology, applied in the electrolysis process, electroforming, etc., can solve the problem of reducing the roughness of the rough surface, and achieve the effects of reducing the roughness of the rough surface, uniform electrocrystallization particles, and good thermal and electrical conductivity
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Embodiment 1
[0026] This embodiment discloses a composite additive for producing thick-gauge copper foil. The additive in this embodiment uses the following components:
[0027] The content of DPS dimethyl-dithioformamide sodium sulfonate is: 0.06g / L, and the consumption is: 0.5g / KAh; g / KAh; AEO fatty amine polyoxyethylene plating solution content: 0.1g / L, consumption: 20ml / KAh; macromolecular mass gelatin content: 1g / L, consumption: 200ml / KAh; hydrochloric acid content: : 12ppm, the consumption is: 35ml / KA, and the composite mixed additive flow rate is 200mL / min.
[0028] The process flow of composite additives in the process of depositing copper foil is as follows:
[0029] Take the electrolytic solution with copper content of 70g / L, sulfuric acid content of 100g / L, chloride ion of 30ppm, and temperature of 40°C, and then add the composite additive to the electrolytic solution so that the electrolytic solution has a flow rate of 45m 3 / h, current density 5000A / m 2 Electrodeposition wa...
Embodiment 2
[0035] This embodiment discloses a composite additive for producing thick-gauge copper foil. The additive in this embodiment uses the following components:
[0036] C8H17SO3K sodium perfluorooctane sulfonate content: 0.008g / L, consumption: 0.10g / KAh; M2-mercaptobenzimidazole content: 0.20g / L, consumption: 0.10g / KAh; PPNI hexylbenzyl Ammonium salt bath content is: 0.12g / L, and consumption is: 9ml / KAh, and macromolecular mass gelatin content is: 1.25g / L, and consumption is: 280ml / KAh; Hydrochloric acid content is: 15ppm, and consumption is: : 45ml / KAh, the composite mixed additive flow rate is 150-250mL / min.
[0037] The process flow of composite additives in the process of depositing copper foil is as follows:
[0038] The copper content in the electrolyte is 90g / L, the sulfuric acid content is 120g / L, the chloride ion is 30ppm, and the temperature is 50°C. Add organic mixed additives to the electrolyte so that the flow rate of the electrolyte is 60m 3 / h, current density 750...
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