Base material motion type device and method for preparing nano coating through plasma discharge

Abstract

The invention discloses a base material motion type device and method for preparing a nano coating through plasma discharge, and belongs to the technical field of plasmas. The device comprises electrodes, a vacuum exhaust device, a gas pipeline and a base material fixing device; and the method comprises the following steps that the base material fixing device can do motions in the space formed by the electrodes under the driving of a moving mechanism, and monomer steam is introduced into a reaction chamber to carry out plasma chemical vapor deposition, wherein the deposition process comprises a pretreatment stage and a coating stage, the plasma discharge mode in the pretreatment stage is high-power continuous discharge and the plasma discharge mode in the coating stage is small-power continuous discharge. In the preparation process of the coating, the movement characteristic of the base material and the plasma discharge energy are combined and linked; the base material does motions while the plasma discharge occurs, so that the coating deposition efficiency is improved, and the uniformity and compactness of the thickness of the coating are improved; and the coating prepared by the method has the characteristics of being waterproof, moisture-proof, and anti-fungus, and has acid solvent resistance, alkaline solvent resistance, acid salt mist resistance, alkaline salt mist resistance and the like.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, and in particular relates to a device and a method for preparing a nano-coating by plasma discharge. Background technique [0002] Corrosive environments are the most common cause of damage to electronic devices. Corrosion of solid materials in electronic devices, reduction of conductor / semiconductor insulation, and fault phenomena such as short circuit, open circuit or poor contact caused by environmental corrosion. At present, in the products of high-tech industries such as national defense and aerospace, the proportion of electronic components is increasing, and the requirements for moisture-proof, mildew-proof and corrosion resistance of electronic products are becoming more and more stringent. In the field of communication, with the continuous advancement of technology, the continuous increase of communication frequency, the heat dissipation of communication equipme...

AI Technical Summary

Problems solved by technology

[0012] The British P2i company has developed a polymer nano-coating based on a specific small duty cycle pulse discharge method using chemical vapor deposition technology. The preparation process based on the specific small duty cycle pulse discharge method cannot achieve chemical The effective coordination and control of the bond length, bond energy, molecular weight of the material and the energy provided by the different groups in the raw materials, the scratch resistance and durability of the prepared coating are not ideal

It is also due to the performance limitation of the coating that the current coating can only form a lyophobic nano-coating on electronic and electrical equipment, and the corrosion resistance to the environment cannot be effectively solved.

Moreover, the dense protective coating prepared based on a specific small duty cycle pulse discharge method has a fatal disadvantage: from a microscopic point of view, the small power density in the coating process is not conducive to the formation of a dense structure, and even cannot form a stable film. Structure; from a macro point of view, a small power density is not conducive to the large rate growth of the coating, and the efficiency is low in actual production, which limits its application

[0013] In the existing plasma chemical vapor deposition coating preparation process, the substrate is fixed, and the movement state of the substrate has no correlation with the discharge energy of the plasma; the static substrate in the chamber is treated by the continuous discharge method, The activated chain scission in the monomer is generally combined into a film through simple stacking under the action of continuous discharge, and the resulting coating generally has a loose structure, or even a high degree of powderization, which is not conducive to the formation of a microscopic dense structure of the coating. Therefore, the coating's Waterproof, moisture-proof, corrosion-resistant, solvent-resistant and other protective properties are poor

[0014] Due to the regional differences in plasma density and chemical raw material density in the reaction chamber, the static substrate will also lead to slow coating deposition in some areas, low production efficiency, and there are also large differences in uniformity and compactness.

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