High-strength and high-heat-conduction three-dimensional graphene heat dissipating material and preparation method thereof

Abstract

The invention relates to a high-strength and high-heat-conduction three-dimensional graphene heat dissipating material and a preparation method thereof and aims at solving the problems of orientation arrangement and density of a graphene heat dissipating material so as to prepare the three-dimensional heat dissipating material with ultrahigh heat conductivity. The method comprises the following steps: preparing a graphene oxide dispersion liquid; carrying out high orientation treatment on graphene oxide; carrying out freeze drying to obtain graphene oxide foam; carrying out hydrazine hydrate reduction to obtain grapheme foam; putting the graphene foam into a die for carrying out premolding and hot pressed sintering to obtain the high-strength and high-heat-conduction three-dimensional graphene heat dissipating material. According to the graphene heat dissipating material prepared by the preparation method disclosed by the invention, the thickness is in centimeter size; in addition, the heights of graphene sheets are arranged in an orientated manner, and the difficult problems of orientation and compactness of a graphene heat dissipating film are solved; the heat conductivity of the graphene heat dissipating material can reach 1800W / (m.K); besides, the graphene heat dissipating material has high strength and a good processing property, and is expected to thoroughly solve the difficult problem of heat dissipation.

Description

technical field [0001] The invention relates to the field of high thermal conductivity materials, in particular to a three-dimensional graphene heat dissipation material with high strength and high thermal conductivity and a construction method thereof. Background technique [0002] The miniaturization and high integration of integrated circuits have led to a continuous increase in the assembly density of electronic components. While providing powerful functions, it has also led to a sharp increase in its power consumption and heat generation. High temperatures will have a detrimental effect on the stability, reliability and life of electronic components. Mithal's research results show (Mithal et al. Design of experimental based evaluation of thermal performance of a flichipelectronic assembly [C]. ASME EEP Proceedings. New York: ASME, 1996, 18: 109–115.), the temperature of electronic components is normal If the working temperature is lowered by 1°C, the failure rate can b...

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Problems solved by technology

[0005] In order to solve the above-mentioned current graphene heat dissipation film with the increase in thickness, its compactness is difficult to guarantee, and the large gap between layers causes the increase of phonon scattering between layers, resulting in a sharp decrease in its thermal conductivity. The problems existing in graphene heat dissipation materials are as follows: It is impossible to achieve high thermal conductivity and large thickness (three-dimensional block) at the same time, that is, it is impossible to obtain large heat flux, and the orientation of graphene sheets prepared by the prior art is low, and the thermal resistance of the interface is large, which leads to the direction of the extension layer. To solve problems such as low thermal conductivity, the present invention provides a method for constructing a high-strength and high-thermal-conduction three-dimensional graphene heat dissipation material, which is specifically carried out in accordance with the following steps:

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