High-strength and high-heat-conduction three-dimensional graphene heat dissipating material and preparation method thereof

A technology of heat dissipation material and graphene dispersion, applied in the field of high thermal conductivity materials, can solve the problems of increased phonon scattering, large interface thermal resistance, large heat flux, etc. rate effect

Active Publication Date: 2017-07-21
哈尔滨烯创新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the above-mentioned current graphene heat dissipation film with the increase in thickness, its compactness is difficult to guarantee, and the large gap between layers causes the increase of phonon scattering between layers, resulting in a sharp decrease in its thermal conductivity. The problems existing in graphene heat dissipation materials are as follows: It is impossible to achieve high thermal conductivity and large thickness (three-dimensional block) at the same time, th...

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  • High-strength and high-heat-conduction three-dimensional graphene heat dissipating material and preparation method thereof
  • High-strength and high-heat-conduction three-dimensional graphene heat dissipating material and preparation method thereof
  • High-strength and high-heat-conduction three-dimensional graphene heat dissipating material and preparation method thereof

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Embodiment 1

[0031] The construction method of the high-strength and high-thermal conductivity three-dimensional graphene heat dissipation material described in this embodiment is specifically carried out according to the following steps:

[0032] 1) Preparation of graphene oxide dispersion: disperse single-layer graphene oxide powder with a size of 20 to 30 microns in deionized water, and perform ultrasonic treatment for 60 minutes at a frequency of 10KHz to form a uniform solution with a concentration of 0.1 mg / mL graphene oxide dispersion;

[0033] 2) High orientation treatment of graphene oxide: put the graphene oxide dispersion into a metal mold (cuboid mold of 100×100×50mm; the surrounding of the mold is made of pure copper, hollow structure), and then use liquid nitrogen to treat the surrounding metal The frame is cooled, and the flow rate of liquid nitrogen is 0.5L / min;

[0034] 3) freeze-drying: put the mixture of graphene oxide and water prepared in step 2) into a freeze dryer and...

Embodiment 2

[0041] The construction method of the high-strength and high-thermal conductivity three-dimensional graphene heat dissipation material described in this embodiment is specifically carried out according to the following steps:

[0042] 1) Preparation of graphene oxide dispersion: disperse single-layer graphene oxide powder with a size of 20 to 30 microns in deionized water, and perform ultrasonic treatment for 30 minutes at a frequency of 100KHz to form a uniform solution and obtain a concentration of 5mg / mL of graphene oxide dispersion;

[0043] 2) Highly oriented treatment of graphene oxide: put the graphene oxide dispersion into a metal mold (100×100×50mm cuboid mold; the surrounding of the mold is made of pure copper, hollow structure), and then use liquid nitrogen to treat the surrounding metal The frame is cooled, and the rate of passing liquid nitrogen is 0.5L / min;

[0044] 3) freeze-drying: put the mixture of graphene oxide and water prepared in step 2) into a freeze ...

Embodiment 3

[0050] The construction method of the high-strength and high-thermal conductivity three-dimensional graphene heat dissipation material described in this embodiment is specifically carried out according to the following steps:

[0051] 1) Preparation of graphene oxide dispersion: disperse single-layer graphene oxide powder with a size of 20 to 30 microns in deionized water, and perform ultrasonic treatment for 45 minutes at a frequency of 50KHz to form a uniform solution and obtain a concentration of 3mg / mL of graphene oxide dispersion;

[0052] 2) High orientation treatment of graphene oxide: Put the graphene oxide dispersion liquid into a metal mold (cuboid mold of 100×100×50mm; the surrounding of the mold is made of pure copper, hollow structure), and then pass through the air inlet hole on the mold Pass liquid nitrogen to cool the surrounding metal frame;

[0053] 3) Freeze-drying: put the mixture of graphene oxide and water prepared in step 2) into a freeze dryer and dry...

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Abstract

The invention relates to a high-strength and high-heat-conduction three-dimensional graphene heat dissipating material and a preparation method thereof and aims at solving the problems of orientation arrangement and density of a graphene heat dissipating material so as to prepare the three-dimensional heat dissipating material with ultrahigh heat conductivity. The method comprises the following steps: preparing a graphene oxide dispersion liquid; carrying out high orientation treatment on graphene oxide; carrying out freeze drying to obtain graphene oxide foam; carrying out hydrazine hydrate reduction to obtain grapheme foam; putting the graphene foam into a die for carrying out premolding and hot pressed sintering to obtain the high-strength and high-heat-conduction three-dimensional graphene heat dissipating material. According to the graphene heat dissipating material prepared by the preparation method disclosed by the invention, the thickness is in centimeter size; in addition, the heights of graphene sheets are arranged in an orientated manner, and the difficult problems of orientation and compactness of a graphene heat dissipating film are solved; the heat conductivity of the graphene heat dissipating material can reach 1800W/(m.K); besides, the graphene heat dissipating material has high strength and a good processing property, and is expected to thoroughly solve the difficult problem of heat dissipation.

Description

technical field [0001] The invention relates to the field of high thermal conductivity materials, in particular to a three-dimensional graphene heat dissipation material with high strength and high thermal conductivity and a construction method thereof. Background technique [0002] The miniaturization and high integration of integrated circuits have led to a continuous increase in the assembly density of electronic components. While providing powerful functions, it has also led to a sharp increase in its power consumption and heat generation. High temperatures will have a detrimental effect on the stability, reliability and life of electronic components. Mithal's research results show (Mithal et al. Design of experimental based evaluation of thermal performance of a flichipelectronic assembly [C]. ASME EEP Proceedings. New York: ASME, 1996, 18: 109–115.), the temperature of electronic components is normal If the working temperature is lowered by 1°C, the failure rate can b...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 李宜彬孙贤贤赫晓东徐帆林在山彭庆宇
Owner 哈尔滨烯创新材料有限公司
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