Manufacturing method of molybdenum rotating target material for sputtering deposition

Abstract

The invention discloses a manufacturing method of a molybdenum rotating target material for sputtering deposition. The method includes the steps that high-purity molybdenum powder is evenly filled into a tubular mold, and then is prepared into a tubular powder molybdenum billet by means of extrusion forming; the tubular powder molybdenum billet is put into a cold isostatic press to be pressed, and a molybdenum billet is obtained after isostatic pressing compaction is completed; the formed molybdenum billet is put into a vacuum sintering furnace to be sintered, the sintered molybdenum billet is put into the sintering furnace, hydrogen is connected in for protection, and the molybdenum billet is taken out for repeated hammer forging after heating and heat preservation are completed; the forged molybdenum billet is put into a vacuum annealing furnace for annealing, and then the molybdenum billet is cooled to an indoor temperature along with the furnace; and after the annealed molybdenum billet is machined, the molybdenum rotating target material can be obtained. The molybdenum rotating target material obtained through the method has the characteristics that the relative density is high, machinability is good, the inner grain structure of the target material is uniform and small and tissue defects are avoided.

Description

technical field [0001] The invention relates to a sputtering target manufacturing technology, in particular to a method for manufacturing a molybdenum rotary target for sputtering coating. Background technique [0002] Molybdenum has high melting point, high electrical conductivity, low specific impedance, good corrosion resistance and good environmental performance. In the electronics industry, molybdenum sputtering targets are mainly used for flat-panel displays, electrode and wiring materials for thin-film solar cells, and barrier layer materials for semiconductors. With the rapid development of the flat panel display industry and the photovoltaic industry, the demand for molybdenum sputtering targets is increasing. [0003] In order to improve the utilization rate of the target, a tubular rotating target is usually used, so that the target utilization rate can be increased from 30% to 50% of the planar target to 80% of the rotating target. At present, the most commonly ...

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Problems solved by technology

[0003] In order to improve the utilization rate of the target, a tubular rotating target is usually used, so that the target utilization rate can be increased from 30% to 50% of the planar target to 80% of the rotating target. At present, the most commonly used process for forming molybdenum target is traditional powder Metallurgy, the target produced by this process has insufficient density and relatively coarse grains. During use, it is easy to cause problems such as target particle splashing and uneven plating, which will affect the quality and yield of downstream products.

[0004] So far, due to the limitations of equipment and technology, there is no professional company specializing in the production of molybdenum sputtering targets in China. The molybdenum sputtering targets required by the existing domestic LCD panel production lines still need to be imported from abroad.