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Algan/gan ultraviolet detector based on oblique zno nanowire array modulation and its preparation method

An ultraviolet detector and nanowire array technology, which is applied in sustainable manufacturing/processing, semiconductor device, final product manufacturing, etc., can solve problems such as affecting the regulation of ZnO nanowires, small mismatch degree, and difficulty in depleting 2DEG.

Active Publication Date: 2018-08-31
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional AlGaN / GaN HEMT devices use epitaxial layers and GaN polar planes, and the mismatch between the ZnO lattice structure and GaN is small. However, whether depositing a ZnO seed layer on the gate or directly growing ZnO on the gate Growth of ZnO nanowire arrays perpendicular to the gate plane; and the 2DEG (two-dimensional electron gas) generated at the AlGaN / GaN heterojunction interface on the polar plane is due to the GaN polarization effect, and the polar plane will bring Sta The gram effect makes it difficult to deplete 2DEG, which affects the regulation of ZnO nanowires on the concentration of 2DEG, and then affects the sensitivity to ultraviolet light detection.

Method used

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  • Algan/gan ultraviolet detector based on oblique zno nanowire array modulation and its preparation method
  • Algan/gan ultraviolet detector based on oblique zno nanowire array modulation and its preparation method
  • Algan/gan ultraviolet detector based on oblique zno nanowire array modulation and its preparation method

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preparation example Construction

[0058] The present invention provides a preparation method of the ultraviolet detector described in the above scheme, comprising the following steps:

[0059] Provide gateless AlGaN / GaN high electron mobility transistors;

[0060] mixing zinc salt, hexamethylenetetramine and water to obtain a precursor solution;

[0061] The upper surface of the gateless AlGaN / GaN high electron mobility transistor is immersed in the precursor solution to carry out hydrothermal reaction.

[0062] The invention prepares gateless AlGaN / GaN high electron mobility transistor. The present invention has no special requirements on the preparation method of the gateless AlGaN / GaN high electron mobility transistor, and can be prepared by methods well known to those skilled in the art. In a specific embodiment of the present invention, the preparation method of the gateless AlGaN / GaN high electron mobility transistor preferably includes the following steps:

[0063] (1) Deposit an AlN nucleation layer...

Embodiment 1

[0083] Al on the m-plane by metal-organic chemical vapor deposition (MOCVD) 2 o 3 A 150nm AlN nucleation layer was grown on the substrate, as Figure 1 ~ Figure 2 shown;

[0084] A 2 μm thick semipolar surface (11-22) GaN buffer layer is deposited on the surface of the AlN nucleation layer by MOCVD, such as image 3 shown;

[0085] A 25nm-thick semipolar (11-22) GaN channel layer is grown on the surface of the GaN buffer layer by MOCVD, such as Figure 4 shown;

[0086] 20nm thick Al was grown on the surface of the GaN channel layer by MOCVD 0.25 Ga 0.75 N barrier layers, such as Figure 5 shown;

[0087] Al 0.25 Ga 0.75 A 2nm-thick semipolar plane (11-22) GaN cap layer is grown on the surface of the N barrier layer to obtain a semipolar AlGaN / GaN epitaxial wafer, such as Figure 6 shown;

[0088] Photolithography is carried out on the semi-polar AlGaN / GaN epitaxial wafer, and the active area pattern is prepared by spinning glue, pre-baking, exposure, post-baking, ...

Embodiment 2

[0097] m surface Al 2 o 3 As the substrate, use the method in Example 1 to prepare a gateless AlGaN / GaN high electron mobility transistor, control the thickness of the AlN nucleation layer to 140nm, the thickness of the GaN buffer layer to 1.5μm, the thickness of the GaN channel layer to 20nm, and the thickness of the AlGaN The thickness of the barrier layer is 15nm, the thickness of the GaN cap layer is 1.5nm, and the source electrode and drain electrode are consistent with the embodiment 1;

[0098] Growth of oblique ZnO nanowire arrays in the gate region by hydrothermal method: Zinc nitrate hexahydrate (Zn(NO 3 ) 2 ·6H 2 (2) 10mmol and hexamethylenetetramine (HMTA) 20mmol are dissolved in 1L deionized water, stir evenly, as the precursor solution of ZnO nanowire growth; Get 30ml precursor solution and put into hydrothermal reaction kettle, again without Place the upper surface of the AlGaN / GaN high electron mobility transistor with the gate facing down, suspend it in th...

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Abstract

The invention provides an AlGaN / GaN ultraviolet detector based on oblique ZnO nanowire array modulation, including a gateless AlGaN / GaN high electron mobility transistor and an oblique ZnO nanowire array grown in a gate region of the gateless AlGaN / GaN high electron mobility transistor. A GaN epitaxial layer in the gateless AlGaN / GaN high electron mobility transistor is a GaN layer of a semi-polar surface (11-22). The GaN epitaxial layer includes a GaN buffer layer, a GaN channel layer and a GaN cap layer. The GaN channel layer is located on an upper surface of the GaN buffer layer. The plane included angle between the oblique ZnO nanowire array and the gate region is between 30 and 35 DEG. Through obliquely growing the ZnO nanowire array in the gate region of the gateless AlGaN / GaN high electron mobility transistor, the detection efficiency of the detector is improved, and real-time, accurate and efficient detection of ultraviolet light intensity is realized.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an AlGaN / GaN ultraviolet detector based on oblique ZnO nanowire array modulation and a preparation method thereof. Background technique [0002] Ultraviolet light has a non-negligible impact on both the ecosystem and human beings, which requires real-time and accurate monitoring of ultraviolet light. In the rapidly developing information age, multi-node detection in the emerging Internet of Things technology has an increasing demand for ultraviolet detectors, and higher and higher requirements are placed on the sensitivity and miniaturization of devices. [0003] ZnO is a direct bandgap semiconductor with a bandgap width of 3.37eV. It has high exciton binding energy and is an excellent material for ultraviolet detectors. At present, ZnO materials applied to ultraviolet detectors include ZnO thin films, single ZnO nanowires, and vertical ZnO nanowire arrays. [0004] The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/112H01L31/0352H01L31/18
CPCH01L31/035227H01L31/1129H01L31/18Y02P70/50
Inventor 高志远赵立欢薛晓玮张洁邹德恕
Owner BEIJING UNIV OF TECH
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