Composite Source Field Plate Current Aperture Heterojunction Field Effect Transistor
A technology of heterojunction field effect and source field plate, which is applied in the field of microelectronics, can solve the problems that the field plate structure cannot effectively modulate the electric field distribution in the device, and the performance of the device has not been improved, so as to avoid the problem of process complexity and improve breakdown voltage, easy-to-achieve effects
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Embodiment 1
[0067] Embodiment 1: Fabrication of a composite source field plate current aperture heterojunction field effect transistor with SiN as the passivation layer and 2 floating field plates.
[0068] Step 1. Epitaxy n on GaN substrate 1 - Type GaN, forming a GaN drift layer 2, such as image 3 a.
[0069] Use n + Type GaN is used as the GaN substrate 1, using metal organic chemical vapor deposition technology, and the epitaxial doping concentration on the GaN substrate 1 is 1×10 15 cm -3 N - Type GaN semiconductor material to form a GaN drift layer 2, where:
[0070] The process conditions used for epitaxy are: temperature is 950℃, pressure is 40 Torr, and SiH 4 As the doping source, the hydrogen flow rate is 4000 sccm, the ammonia flow rate is 4000 sccm, and the gallium source flow rate is 100 μmol / min.
[0071] Step 2. Epitaxy n-type GaN on the GaN drift layer 2 to form the aperture layer 3, such as image 3 b.
[0072] Using metal organic chemical vapor deposition technology, the epitaxia...
Embodiment 2
[0130] Example 2: Making passivation layer as SiO 2 , And the number of floating field plates is 2 composite source field plate current aperture heterojunction field effect transistor.
[0131] Step 1. Epitaxy n on GaN substrate 1 - Type GaN, forming a GaN drift layer 2, such as image 3 a
[0132] At a temperature of 950℃, a pressure of 40 Torr, and SiH 4 As the doping source, the hydrogen flow rate is 4000 sccm, the ammonia flow rate is 4000 sccm, and the gallium source flow rate is 100 μmol / min. + The type GaN material is used as the GaN substrate 1, using metal organic chemical vapor deposition technology, and the epitaxial doping concentration on the GaN substrate 1 is 5.5×10 16 cm -3 N - Type GaN material to complete the production of the GaN drift layer 2.
[0133] Step 2. Epitaxy n-type GaN on the GaN drift layer 2 to form the aperture layer 3, such as image 3 b.
[0134] At a temperature of 1000°C, a pressure of 45 Torr, and SiH 4 As the doping source, the hydrogen flow rate ...
Embodiment 3
[0177] Embodiment 3: Fabrication of a composite source field plate current aperture heterojunction field effect transistor whose passivation layer is SiN and the number of floating field plates is 3.
[0178] Step A. Use a temperature of 950℃, a pressure of 40 Torr, and SiH 4 As the doping source, the hydrogen flow rate is 4000 sccm, the ammonia flow rate is 4000 sccm, and the gallium source flow rate is 100 μmol / min. + Type GaN material is used as the GaN substrate 1, using metal organic chemical vapor deposition technology, and the epitaxial doping concentration on the GaN substrate is 1×10 18 cm -3 N - Type GaN material to make GaN drift layer 2, such as image 3 a.
[0179] Step B. Use a temperature of 950℃, a pressure of 40 Torr, and SiH 4 As the doping source, the hydrogen flow rate is 4000 sccm, the ammonia flow rate is 4000 sccm, and the gallium source flow rate is 100 μmol / min. Using metal organic chemical vapor deposition technology, the epitaxial thickness on the GaN drift...
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