Powder metallurgy preparation method of high volume fraction SiCp/Al alloy composite

A high volume fraction, composite material technology, applied in the field of the preparation of alloy composite materials, can solve the problems of difficult to prepare large size, shape devices or products, large interface reactivity, increase the interface thermal resistance of composite materials, etc., to achieve excellent mechanical and Thermophysical properties, uniform distribution of SiCp, effect of uniform microstructure

Active Publication Date: 2017-09-19
HEFEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, people often use special sintering processes such as hot pressing to prepare high-density SiCp / Al alloy composites with high volume fraction (CN102676883B, CN103194630A), but this method requires high equipment and increases process costs; it is difficult to prepare large-sized, Devices or products with complex shapes; and the performance of the high volume fraction SiCp / Al alloy composite material prepared by this method is also lower than that of the high volume fraction SiCp / Al alloy composite material of similar composition prepared by the pressureless infiltration process
The main reason is that in order to improve the density of hot-pressed high-volume fraction SiCp / Al alloy composites, two or more SiC powders with different thicknesses are usually gradated, and the added fine SiCp is easy to agglomerate, increasing the interface of the composite material. Thermal resistance, and the interface reactivity with the Al alloy matrix is ​​greater, forming Al 4 C 3 and other reaction products, significantly reducing the mechanical and thermophysical properties of SiCp / Al alloy composites, and restricting the development of powder metallurgy preparation technology for high volume fraction SiCp / Al alloy composites

Method used

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  • Powder metallurgy preparation method of high volume fraction SiCp/Al alloy composite
  • Powder metallurgy preparation method of high volume fraction SiCp/Al alloy composite
  • Powder metallurgy preparation method of high volume fraction SiCp/Al alloy composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: 50vol% SiCp / 6061Al composite material, sintered under normal pressure at 680°C

[0023] (1) Elutriation: ultrasonically treat the commercially available SiC powder in deionized water for 10 minutes, then let it stand for 10 minutes, pour out the deionized water together with the fine SiC particles suspended in it, and repeat the elutriation for 3-5 times. Until the deionized water is completely clarified; the SiC powder after elutriation is kept and dried at 150°C for 12 hours for later use, and the average particle diameter of the SiCp powder after elutriation (d 50 ) is 20 μm;

[0024] (2) Ingredients: mix the SiCp powder after washing with the commercially available average particle size (d 50 ) is 25 μm Al alloy powder according to the volume ratio of 1:1;

[0025] (3) Mixing: The mixing of SiCp powder and Al alloy powder is carried out on a double-shaft drum mixer, and ZrO with a diameter of 5mm is added. 2 The ball is used as the mixing medium, the b...

Embodiment 2

[0030] Example 2: 50vol% SiCp / 6061Al composite material, sintered under normal pressure at 660°C

[0031] The preparation process of this embodiment is the same as that of Embodiment 1, except that the sintering temperature in step (5) is 660° C., and other processes and parameters remain unchanged.

Embodiment 3

[0032] Example 3: 50vol% SiCp / 6061Al composite material, sintered at 700°C under normal pressure

[0033] The preparation process of this embodiment is the same as that of Embodiment 1, except that the sintering temperature in step (5) is 700° C., and other processes and parameters remain unchanged.

[0034] Such as Figure 1-3As shown, the SiCp in the atmospheric pressure sintered 50vol% SiCp / Al alloy composite material is evenly distributed in the Al alloy matrix without agglomeration phenomenon, and the composite material has low porosity and high density. SiCp in the 50vol% SiCp / Al alloy composite material sintered at 680 ° C in Example 1 is most tightly combined with the Al alloy matrix, without pores ( figure 1 ). However, in 50vol% SiCp / Al alloy composites sintered at lower or higher temperatures than 680°C (Example 2, 3), there are fine pores at the Al alloy matrix or its SiCp interface, and the density decreases, and sintering at 700°C The 50vol% SiCp / Al alloy comp...

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Abstract

The invention discloses a powder metallurgy preparation method of a high volume fraction SiCp/Al alloy composite. SiC powder bought from the market is elutriated for removing fine SiC particles in the SiC powder, the elutriated SiC powder with the mean particle size being 10-30 micrometers is blended with Al alloy powder with the mean particle size being 5-20 micrometers, a double-shaft drum is used for mixing, 400-600MPa one-direction pressing is carried out in a steel mould, and atmospheric pressure sintering is carried out at 660-720 DEG C under high-purity N2 atmosphere protection. The density of the 50vol% SiCp/Al alloy composite prepared in such way can reach 98.5%, the flexural strength reaches 495MPa, the heat conductivity reaches 153W/(m.K), and the thermal expansion coefficient is as low as 8.1*10<-6>/K. The comprehensive performance of the high volume fraction SiCp/Al alloy composite exceeds that of a similar-component SiCp/Al alloy composite prepared by a cast infiltration or hot pressing method, and the high volume fraction SiCp/Al alloy composite can be used as a high-performance electronic packaging material.

Description

technical field [0001] The invention relates to a preparation method of an alloy composite material, in particular to a powder metallurgy preparation method of a high volume fraction SiCp / Al alloy composite material, and belongs to the field of new materials and its preparation technology. Background technique [0002] High volume fraction SiCp / Al alloy composite material has the advantages of high thermal conductivity and low thermal expansion coefficient, which can well meet the requirements of high heat dissipation of packaging materials, low thermal expansion coefficient mismatch and reliability of semiconductors due to the rapid development of integrated circuits and power electronic devices. Therefore, it has become an ideal new electronic packaging material. At the same time, due to its excellent mechanical properties, such as high specific strength, specific stiffness and low density, it also has broad application prospects in special precision instruments, aerospace...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C1/10C22C21/00C22C32/00
CPCC22C1/05C22C21/00C22C32/0063
Inventor 汤文明茅学志王斌昊吴玉程
Owner HEFEI UNIV OF TECH
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