Manufacturing method of polyimide with low dielectric coefficient, polyimide film and application thereof

A polyimide film, polyimide technology, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problem of poor tensile strength and elongation, unfavorable development of high-frequency substrates, Tear resistance, bending resistance, transparency and dimensional stability are not good, to achieve the effect of good tear resistance

Active Publication Date: 2017-10-24
THINFLEX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the polyimide film produced by this conventional technology has a porous structure, which makes its mechanical strength (such as tensile strength or elongation) poor, which is not conducive to the development of high-frequency substrates.
In

Method used

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  • Manufacturing method of polyimide with low dielectric coefficient, polyimide film and application thereof
  • Manufacturing method of polyimide with low dielectric coefficient, polyimide film and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] First, 2.4 parts by weight of polytetrafluoroethylene (average particle diameter of 9 μm; a-1-1) and 0.1 parts by weight of a dispersant (model BYK-164; manufactured by BYK Additives & Instruments; a-3) were dissolved in 3.3 parts by weight part of butyl acetate (a-2), and stirred at a stirring rate of 30 Hz for 2 hours to form a fluorine-containing polymer dispersion (A). In addition, 4,4'-diaminodiphenyl ether (B-1), 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl (B-2) and p-diphenylamine (B -3) Dissolve 24.6 parts by weight of N-methylpyrrolidone (C-1) and 55.4 parts by weight of dimethylacetamide (C-2) at a weight ratio of about 1:3:5, and stir evenly for 2 hours. The fluorine-containing polymer dispersion (A) and the above-mentioned aromatic diamine-containing solution are mixed to form a first mixture. After that, 10.3 parts by weight of 3,3',4,4'-biphenyltetracarboxylic dianhydride (D-1) was divided into three times and added to the first mixture every 4 hours, t...

Embodiment 2 to 4 and comparative example 1 to 3

[0061] Examples 2 to 4 and Comparative Examples 1 to 3 are carried out using the same manufacturing method as Example 1, the difference is that the process conditions and / or the content of the ingredients used are changed, which are listed in Table 1, No further details here.

[0062] Evaluation method

[0063] 1. Coefficient of Linear Thermal Expansion (CTE)

[0064] The coefficient of linear thermal expansion referred to herein is to measure the dimensional change of the polyimide films of Examples 1 to 4 and Comparative Examples 1 to 3 in a specific temperature range. The above test is carried out with a thermomechanical analyzer (model: DMA7e; brand: PerkinElmer) between 50°C and 500°C. The detailed test method is as follows: a polyimide film with a length of 25mm and a width of 13mm, Under a nitrogen atmosphere, the temperature was raised at a rate of about 20°C / min. Repeat the above steps twice to obtain the value for the second time, and calculate the average linear ...

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Abstract

The invention provides a method, which comprises the following steps of providing fluorine-containing high molecular dispersion liquid (A) and aromatic diamine (B) dissolved in a first solvent (C), wherein the fluorine-containing high molecular dispersion liquid (A) contains fluorine-containing high molecular polymers (a-1), a second solvent (a-2) and dispersing agents (a-3); mixing the fluorine-containing high molecular dispersion liquid (A) and aromatic diamine (B) to form a first mixture; adding aromatic tetracarboxylic dianhydride (D) into the first mixture so as to form a polyamide acid solution; performing the solvent removal step and the heating step on the polyamide acid solution so as to prepare the polyimide. The prepared polyimide film has a low dielectric coefficient and a low loss factor.

Description

technical field [0001] The present invention relates to a method for producing polyimide with low dielectric constant, polyimide film and its application, and in particular to a fluorine-containing polymer with a specific average particle size to produce polyimide Method for imide and polyimide membranes. The prepared polyimide and polyimide film have low dielectric properties. Background technique [0002] With the development of technology and product demand, the size of flexible printed circuit boards is becoming thinner and smaller. In response to the high frequency of wireless networks and communication products, high-frequency substrates with fast transmission speeds are the focus of current industry development. [0003] At present, the commonly used copper-clad laminates are mostly glue-free polyimide copper-clad laminates. Adhesive-free polyimide copper clad laminate is directly formed polyimide layer on the copper foil of copper clad laminate, so there is no adhe...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L27/18C08G73/10C08J5/18B32B15/08B32B15/20
CPCB32B15/08B32B15/20B32B2250/02B32B2307/412B32B2307/54B32B2307/5825B32B2307/734C08G73/1039C08G73/1071C08J5/18C08L79/08C08L2201/10C08L2203/16C08L27/18
Inventor 丘建华林佳慧吴俊明黄黎明黎伯谦
Owner THINFLEX CORP
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