Laser tin welding method and device for rectifier diode assembly parts

Abstract

The invention provides a laser tin welding method for a rectifier diode assembly parts. The method comprises the steps of adopting a laser beam under a positive defocus status for pre-heating an area to be welded; utilizing an automatic wire feeding assembly for feeding a tin wire to a position right above the area to be welded, wherein the laser beam is acted on the tin wire through a negative defocus manner so as to quickly heat and melt the tin wire, and a melted liquid-state tin material drips on a contact surface between a rectifier diode tinning axial lead and a base pin; utilizing an ultrasonic vibrator for vibrating with fixed frequency, continuously soaking the pin and the lead at the welded part through the tin material, and forming a laser tin welding joint after cooling; and adopting the same method for welding the right side. According to the welding method, the strength and the quality of the welding joint are improved. The invention further designs an automatic laser tin welding device, which can be used for implementing the following processes such as automatic feeding and discharging, automatic laser tin welding, product quality detecting, and quality goods and inferior-quality product sorting, so that the automatic diode packaging with high efficiency, high accuracy and high quality can be realized.

Description

technical field [0001] The invention belongs to the technical field of laser applications, and in particular relates to a laser soldering method and device for a rectifier diode assembly; Background technique [0002] With the continuous update and development of information technology, human society has gradually entered the era of intelligent information, and the modern microelectronics manufacturing industry is developing in the direction of miniaturization, intelligence, high integration, high performance and diversification. Therefore, microelectronic packaging technology It will play an increasingly important role in the microelectronics manufacturing industry. [0003] At present, in the soldering process of rectifier diode assemblies, traditional electric soldering iron soldering is usually used to connect the leads of rectifier diodes to the supporting base; however, there are many limitations and disadvantages in this method: 1) Soldering with electric soldering ir...

AI Technical Summary

Problems solved by technology

In addition, for electronic equipment, false welding is a common fault that causes poor contact; false welding is mainly caused by low melting point and poor strength of solder, less solder amount, stress phenomenon on the pins of the workpiece to be welded, and oxide layer or dirt on the surface The solder joints are usually in a connection state with contact resistance due to other factors, resulting in abnormal operation of the circuit and unstable phenomena that appear from time to time, which brings major hidden dangers to the debugging, use and maintenance of the circuit.

Images