Heat-conduction filling material for heat dissipation of electronic components, and preparation method thereof

Abstract

The present invention relates to the technical field of materials, and provides a heat-conduction filling material for the heat dissipation of electronic components, wherein the heat-conduction filling material comprises, by mass, 14-20% of a silicon rubber, 20-40% of a graphene / carbon nano-tube composite material, 30-60% of a metal oxide, 0.1-1% of a coupling agent, and 1-2% of a liquid state metal. According to the present invention, the graphene / carbon nano-tube composite material is selected as the raw material and has the three-dimensional network structure, and through the synergistic effect between the graphene and the carbon nano-tubes, the excellent performances are provided compared to the single use of any one material, wherein the excellent performances comprise good isotropic thermal conductivity, good isotropic electric conductivity, good three-dimensional space micro-pore network and the like; and the limitation problem of the thermal conduction direction due to the single use of the two materials such as graphene and carbon nano-tubes in the prior art is solved.

Description

technical field [0001] The invention relates to the field of material technology, in particular to a heat-conducting gap-filling material and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the scale of integrated circuits has become larger and larger, and electronic components have been integrated into electronic systems for a wide range of applications, including data processing, signal transmission, power supply systems, and so on. [0003] In order for these integrated blocks to operate correctly and stably, the heat generated by each electronic component must be effectively and reliably transferred away from the component. In fact, the surface of heat transfer components is irregular, with a large number of tiny depressions and pores, which can accommodate air, and the thermal conductivity of air is very low. These irregular pores and depressions must be used for thermal conductivity. Material filling ...

AI Technical Summary

Problems solved by technology

[0004] Existing heat-conducting gap-filling materials often only choose either graphene or carbon nanotubes in graphite materials as raw materials to be used in heat-conducting gap-filling materials. However, the two are used alone for thermally conducting gap-filling materials , the thermal conductivity between graphene layers is limited, while carbon nanotubes have excellent thermal conductivity in the axial direction, but the thermal conductivity in the radial direction is limited, so when the two are used alone, the thermal conductivity is not good.