A kind of flexible heat dissipation film and its manufacturing method and composite flexible heat dissipation film

A heat-dissipating film and a technology for its production method are applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., which can solve the problems of unbendable tensile strength and easy breakage, and achieve good flexibility, The effect of high tensile strength

Active Publication Date: 2019-08-23
硕阳科技股份公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although graphene heat dissipation film has a wide range of application markets in various fields, there are problems in use such as unbendable molding, low tensile strength, and easy cracking.

Method used

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  • A kind of flexible heat dissipation film and its manufacturing method and composite flexible heat dissipation film
  • A kind of flexible heat dissipation film and its manufacturing method and composite flexible heat dissipation film
  • A kind of flexible heat dissipation film and its manufacturing method and composite flexible heat dissipation film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Material selection: The metal foam base material is nickel foam base material, which adopts a coil with a thickness of 1.0mm and a width of 200mm. %, bulk density is 0.45g / cm 3 The coating material is selected to contain 0.2% nano-copper, 0.3% acrylic resin binder, 1.5% graphene, and a modified graphene slurry composed of 98% solvent.

[0029] Use attached figure 2 The process shown produces a flexible heat dissipation film coil, wherein the coating material is coated on the surface of the substrate by dip coating. The specific production steps are as follows:

[0030] 1. System feed roller dip coating and low temperature vacuum drying

[0031] The foamed nickel substrate 8 enters the three-roll mixed dip coating system 4 through the substrate unwinding system 1 isotensively, and the surface of the foamed nickel substrate 8 is dip-coated with a coating containing 0.1% nano-copper-modified graphene slurry. material; and then dried by the low-temperature vacuum dryin...

Embodiment 2

[0036] Material selection: The metal foam base material is nickel foam base material, which adopts a coil with a thickness of 0.1mm and a width of 1800mm. %, bulk density is 0.5g / cm 3 ;Choose copper-modified graphene material and nickel electroplating solution for compounding, and the compounding content is controlled between 0.5% and 0.8%. The electroplating solution consists of: nickel sulfate 250g / L, nickel chloride 30g / L, boric acid 30g / L , copper modified graphene 0.55g / L, sodium lauryl sulfate 0.03g / L, 1,4-butynediol 0.8g / L, PH=5.0, T=45℃), dispersant (CMC) The mass concentration is 2g / L.

[0037] Use attached image 3 The shown process produces a flexible heat dissipation film coil, wherein the coating material is coated on the surface of the substrate by electroplating. The specific production steps are as follows:

[0038]1. System feed and process flow

[0039] The substrate 27 is isotonically introduced into the electroplating system 22 via the substrate unwind...

Embodiment 3

[0045] Material selection: Foam metal base material is copper foam base material, which adopts a coil with a thickness of 1.0mm and a width of 200mm. %, bulk density is 0.45g / cm 3 ; Coating material selection containing 0.1% nano-copper modified graphene slurry.

[0046] Use attached Figure 4 The process shown produces a flexible heat dissipation film coil, wherein the coating material is coated on the surface of the substrate by dip coating. The specific production steps are as follows:

[0047] 1. System feeding and high vacuum

[0048] The foamed copper substrate 38 enters the three-roller mixed dip coating system 32 through the substrate unwinding system 31 isotensively, and the surface of the foamed nickel substrate 38 is dip-coated with a coating containing 0.1% nano-copper modified graphene slurry. Material 37; then dried by a low-temperature vacuum drying system 35 to obtain an orderly arranged nanometer-sized network three-dimensional structure layer, wherein the...

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Abstract

The invention relates to a flexible thin heat radiation film and a manufacturing method thereof, and a composite flexible thin heat radiation film. The flexible thin heat radiation film comprises a foam metal substrate layer and modified grapheme slurry layers arranged at the upper side and the lower side of the foam metal substrate layer. At least part of modified grapheme slurries in the modified grapheme slurry layers permeates the foam metal substrate layer. The thickness of the flexible thin heat radiation film is 5 microns to 500 microns. The metal for manufacturing the foam metal substrate layer is at least one of copper, nickel, silver, and aluminum; and the modified grapheme slurry layers are slurry layers containing special materials formed by grapheme, nanocrystalline metal, metallic oxide and metal nitride. In addition, the manufacturing method for the flexible thin heat radiation film includes: a foam metal substrate layer is coated with modified grapheme slurry layers byusing a coating process; and drying or film plating for forming and rolling are carried out successively to form a flexible thin heat radiation film. The flexible thin heat radiation film has advantages of high tensile strength and good high-temperature-resistant and cooling performances and can be used for manufacturing an ultra-thin cooling sheet or a folded heat radiation device.

Description

technical field [0001] The invention relates to a manufacturing method of a flexible heat dissipation film. Background technique [0002] With the gradual development of electronic device products to the field of high integration and high computing, the power dissipation has doubled, and heat dissipation has become an urgent problem to be solved. For a long time, the heat dissipation effect of traditional heat sinks such as copper and aluminum has been widely accepted. However, metal materials have many problems such as difficult processing, energy consumption, excessive density, electrical conductivity, easy deformation, and difficult recycling of waste materials. In recent years, graphite heat dissipation films with high thermal conductivity have gradually occupied the market for heat dissipation of electronic devices. At present, graphite heat dissipation film has been widely used in communication industry, medical equipment, SONY / DELL / Samsung notebook, ZTE mobile phone,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L21/48
Inventor 兰育辉荣辉雷志涛徐鹏
Owner 硕阳科技股份公司
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