A kind of flexible heat dissipation film and its manufacturing method and composite flexible heat dissipation film

A heat-dissipating film and a technology for its production method are applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., which can solve the problems of unbendable tensile strength and easy breakage, and achieve good flexibility, The effect of high tensile strength
CN107564874BActive Publication Date: 2019-08-23硕阳科技股份公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
硕阳科技股份公司
Publication Date
2019-08-23

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Abstract

The invention relates to a flexible thin heat radiation film and a manufacturing method thereof, and a composite flexible thin heat radiation film. The flexible thin heat radiation film comprises a foam metal substrate layer and modified grapheme slurry layers arranged at the upper side and the lower side of the foam metal substrate layer. At least part of modified grapheme slurries in the modified grapheme slurry layers permeates the foam metal substrate layer. The thickness of the flexible thin heat radiation film is 5 microns to 500 microns. The metal for manufacturing the foam metal substrate layer is at least one of copper, nickel, silver, and aluminum; and the modified grapheme slurry layers are slurry layers containing special materials formed by grapheme, nanocrystalline metal, metallic oxide and metal nitride. In addition, the manufacturing method for the flexible thin heat radiation film includes: a foam metal substrate layer is coated with modified grapheme slurry layers byusing a coating process; and drying or film plating for forming and rolling are carried out successively to form a flexible thin heat radiation film. The flexible thin heat radiation film has advantages of high tensile strength and good high-temperature-resistant and cooling performances and can be used for manufacturing an ultra-thin cooling sheet or a folded heat radiation device.
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Description

technical field

[0001] The invention relates to a manufacturing method of a flexible heat dissipation film. Background technique

[0002] With the gradual development of electronic device products to the field of high integration and high computing, the power dissipation has doubled, and heat dissipation has become an urgent problem to be solved. For a long time, the heat dissipation effect of traditional heat sinks such as copper and aluminum has been widely accepted. However, metal materials have many problems such as difficult processing, energy consumption, excessive density, electrical conductivity, easy deformation, and difficult recycling of waste materials. In recent years, graphite heat dissipation films with high thermal conductivity have gradually occupied the market for heat dissipation of electronic devices. At present, graphite heat dissipation film has been widely used in communication industry, medical equipment, SONY / DELL / Samsung notebook, ZTE mobile phone,...

Claims

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