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A kind of low modulus and low water absorption photothermal double solid adhesive and preparation method thereof

A technology with low water absorption and low modulus, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of large curing shrinkage of acrylic resin, difficulty in fully curing, and performance degradation, etc., to achieve low Modulus of elasticity, good sealing protection, and the effect of improving strength

Active Publication Date: 2020-07-10
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Acrylic resin has been widely used due to its fast curing speed, environmental friendliness, low energy consumption, and no solvent volatilization, and has been rapidly promoted in various industries. However, acrylic resin has large curing shrinkage, large stress, low strength, and poor weather resistance. The shading part is not easy to fully cure, resulting in greatly reduced performance and other shortcomings

Method used

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  • A kind of low modulus and low water absorption photothermal double solid adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Self-made polyurethane modified episulfide resin is carried out according to the following steps:

[0063] Dissolve 150 parts of KSCN with 75 parts of distilled water and 150 parts of ethanol, then dissolve 180 parts of bisphenol A epoxy resin in 150 parts of ethanol and pour them into a three-necked flask to mix the two solutions evenly. Put it into the microwave synthesis reactor, connect the condenser, the rotation speed is 1000r / min, the temperature is 45°C, the microwave power is 100w, and the time is 60min. After the reaction starts, add 3 parts of NH 4 CL, 2 parts LiClO 4 , 2 parts of trimethylthiophosphine. After the time is over, the mixed solution is washed and separated with toluene and deionized water. After washing for 3-5 times, it is allowed to stand for stratification. 4 Dry for 24 hours, then filter, and use a rotary evaporator to distill off the solvent to obtain an episulfide resin. Take 100 parts of episulfide resin, 30 parts of isocyanate-termina...

Embodiment 2

[0068] Self-made polyurethane modified episulfide resin is carried out according to the following steps:

[0069] Dissolve 125 parts of KSCN in a three-necked flask with 60 parts of distilled water and 120 parts of ethanol, then dissolve 160 parts of bisphenol F epoxy resin in 100 parts of ethanol and pour them into the three-necked flask to mix the two solutions evenly. Put it into the microwave synthesis reactor, connect the condenser, adjust the rotation speed to 1200r / min, set the temperature to 45°C, microwave power to 120w, time 60min, add 3 parts of NH 4 CL, 1.5 parts LiClO 4 , 1.5 parts of trimethylphosphine. After the time is over, pour the mixed solution into a separatory funnel, wash with toluene and deionized water for 3-5 times, then let it stand for stratification, separate the upper layer, and wash it with anhydrous MgSO 4 Dry for 24 hours, then filter, and use a rotary evaporator to distill off the solvent to obtain an episulfide resin. Take 100 parts of epi...

Embodiment 3

[0074] Self-made polyurethane modified episulfide resin is carried out according to the following steps:

[0075] Dissolve 168 parts of KSCN in a three-necked flask with 75 parts of distilled water and 150 parts of ethanol, then dissolve 230 parts of hydrogenated bisphenol A epoxy resin in 200 parts of ethanol and pour them into the three-necked flask to mix the two solutions evenly. Put it into the microwave synthesis reactor, connect the condenser tube, adjust to 1000r / min, set the temperature to 45°C, microwave power to 100w, time 50min, add 3 parts of NH in sequence after the reaction starts 4 CL, 1.5 parts LiClO 4 , 1.5 parts of trimethylphosphine. After the time is over, pour the mixed solution into a separatory funnel, wash with toluene and deionized water for 3-5 times, then let it stand for stratification, separate the upper layer, and wash it with anhydrous MgSO 4 Dry for 24 hours, then filter, and use a rotary evaporator to distill off the solvent to obtain an epi...

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Abstract

The invention relates to a low-modulus and low-water-absorption photo-thermal double-solid adhesive and a preparation method thereof. The photo-thermal double-solid adhesive is prepared from, by weight, homemade polyurethane modified epithio-resins, modified epoxy acrylic resins, epoxy acrylic resins, mono-functional or bi-functional acrylic monomers, coupling agents, photo-initiators, heat curingagents, peroxide, fillers, viscosity adjusting agents and coloring agents. The photo-thermal double-solid adhesive prepared according to the formula has the advantages of low elasticity modulus (25 DEG C <200MPa), contraction and water absorption and high toughness and bonding strength and solves the problems of crisp texture, easiness in fatigue and poor anti-impact toughness of epoxy / epithio resins and low bonding strength, high contraction and poor weather resistance of acrylic resins.

Description

technical field [0001] The invention relates to a low-modulus low-water-absorbing photothermal dual-cure adhesive and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, electronic and electrical products are constantly developing towards compactness and miniaturization. The ultimate space utilization rate, precise assembly process, and excellent weather-resistant sealing are the constant pursuit of electronic equipment manufacturing. It is also the direction and inevitable result of technological development. . [0003] Epoxy resin is one of the most widely used matrix resins in composite materials at present. It has excellent comprehensive physical properties, such as high mechanical strength, excellent corrosion resistance, low curing shrinkage, high strength, etc., but it also has brittle quality and high hardness. , easy fatigue, poor impact toughness and other shortcomings. [0004] Acrylic resin has been ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J175/04C09J163/10C09J11/04C08G18/58C08G59/17
CPCC08G18/58C08G59/1466C08K2201/014C08L2203/206C08L2205/025C08L2205/03C09J11/04C09J163/00C09J175/04C08L63/10C08K3/36
Inventor 邢云飞李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD