Method and system for performing laser braze welding on diamonds by using double beams

A diamond, double beam technology, applied in laser welding equipment, welding equipment, metal processing and other directions, can solve the problems of poor wettability, diamond thermal damage, time-consuming and long diamond abrasive grains, etc., to avoid aggregation, improve bonding strength, and reduce burning. Loss of oxidation and graphitization effects

Active Publication Date: 2018-03-09
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The manufacturing process of this new technology mainly relies on brazing in the furnace. The long brazing process may cause damage to the diamond abrasive grains and deformation of the tool matrix.
In addition, the size of the brazing furnace also limits the size of the diamond abrasive tool
Using high-frequency induction brazing avoids the limitations of the above process, but it is difficult to control the heating rate and heating range
[0005] Published on August 7, 2013, the invention patent with the announcement number CN 103231064 A "A new method for manufacturing a single-layer diamond grinding wheel brazed with nickel-based brazing material" discloses a method for manufacturing a brazed single-layer diamond grinding wheel. The invention reduces the brazing temperature by adding fine Al powder to the Ni-Cr-based solder, which solves the problems of thermal damage of diamond and deformation of the matrix, but this method does not solve the problem that large-sized grinding wheels cannot be directly brazed
[0006] Published on September 9, 2015, the invention patent "Single-layer high-temperature brazed diamond grinding wheel process" with the announcement number CN 104889518 A discloses a single-layer high-temperature brazed diamond grinding wheel process. The invention first uses gas welding to spray 1mm~ The 1.5mm thick Ni-Cr alloy layer solves the problem of poor wettability between the alloy layer and the metal substrate, but this method still has problems such as difficult control of the temperature rise rate and heating range in induction brazing
However, during the laser brazing diamond experiment, it was found that the diamonds would move together with the molten pool, and finally the diamonds would gather into piles, resulting in serious thermal damage to the diamonds, and the diamonds could not be brazed to the preset position. to the ideal diamond arrangement sequence
In addition, in the general traditional laser brazing diamond process, the laser will be directly projected onto the diamond surface, which increases the possibility of burning, oxidation and graphitization of the diamond surface, resulting in a decrease in the bonding strength between the solder layer and the diamond

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  • Method and system for performing laser braze welding on diamonds by using double beams
  • Method and system for performing laser braze welding on diamonds by using double beams
  • Method and system for performing laser braze welding on diamonds by using double beams

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings and examples.

[0033] In this example, if figure 1 , figure 2 As shown, the embodiment of the present invention provides a method for dual-beam laser brazing of diamond, which includes the following steps.

[0034] Step 1. Provide a substrate 2 for brazing diamond 18. The substrate 2 can be manufactured by machining. A V-shaped groove 15 is milled on the surface of the substrate 2. The included angle α of the V-shaped groove 15 is 45°-90° °. A tungsten wire mesh 19 and a tungsten wire mesh support 3 for supporting the tungsten wire mesh 19 are provided, and the tungsten wire mesh 19 is provided with a plurality of grids for placing diamonds 18 .

[0035] Step 2, derusting and polishing the surface of the substrate 2, and then washing with alcohol, and washing the tungsten wire mesh 19 and the tungsten wire mesh support 3 with alcohol.

[0036] Step 3, providing a we...

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Abstract

The invention discloses a method for performing laser braze welding on diamonds by using double beams. The method comprises the following steps: providing a matrix for performing braze welding on thediamonds and forming a V-shaped groove in the surface of the matrix; coating a brazing material layer for performing braze welding on the diamonds in the V-shaped groove; providing a wolfram wire mesh, arranging a plurality of grids for putting the diamonds in the wolfram wire mesh; putting the wolfram wire mesh above the brazing material; putting the diamonds into the grids of the wolfram wire mesh to ensure that the diamonds and the brazing material layer have certain contact height; symmetrically abreast arranging two laser heads in the welding direction; starting a laser welding system. Byutilizing the double laser beams, the brazing material layer is aslant input from the two sides of the diamonds, and laser braze welding is carried out. The invention also provides a system for performing laser braze welding on the diamonds by utilizing the double beams. According to the method and the system disclosed by the invention, burning loss oxidation and graphitization of the surfaces ofthe diamonds are reduced, the bonding strength between the brazing material layer and the diamonds is improved, the aggregation phenomenon of the diamonds is avoided, and a desired arrangement sequence of the diamonds can be obtained.

Description

technical field [0001] The present invention relates to the field of laser welding, especially a method and system for laser brazing diamond. Background technique [0002] Diamond has the highest hardness, rigidity and excellent wear resistance, corrosion resistance and chemical stability, making diamond widely used in various grinding tools. The superabrasive tools currently used in production are generally made by multi-layer sintering or single-layer electroplating process. The abrasive grains are only mechanically embedded and embedded in the bonding layer, and the holding force is not large. It is easy to cause the abrasive to fall off prematurely due to insufficient holding force, resulting in waste. On the other hand, in the sintered and electroplated tools, the exposed height of the abrasive grains is not large, and the chip space is small. During the grinding process, the adhesion and clogging of the abrasive particles are easy to occur, which reduces the processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/21B23K26/70B24D18/00B23K101/20
CPCB23K26/21B23K26/70B23K2101/20B24D18/00
Inventor 张明军谢志州唐昆毛聪张健胡宏伟胡永乐
Owner CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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