Technology and apparatus for producing aluminum alloy substrate printed circuit board

Abstract

The invention discloses a technology and an apparatus for producing an aluminum alloy substrate printed circuit board. The production technology comprises the following steps: performing arc sprayingto form an aluminum coating, used as a primer layer, on the surface of an aluminum alloy substrate; spraying a ceramic coating on the aluminum coating by using a plasma spraying method; performing vacuum infiltration to complete the pore sealing of the ceramic coating; spraying a water-soluble ceramic coating on the surface of the ceramic coating, and baking the water-soluble ceramic coating to form a ceramic film layer on the ceramic surface to complete the production of a ceramic insulation layer; and arranging wires on the ceramic insulation layer through using laser. The production apparatus comprises a driving belt, a first heating furnace, an arc spraying device, a plasma spraying device, a vacuum furnace, a water-soluble ceramic spraying device, a second heating furnace and a laser.The technology and the apparatus realize the production of the aluminum alloy substrate ceramic circuit board having the advantages of high heat dissipation performance, excellent electrical performance, good electromagnetic shielding performance, flexible processing modes and large-scale production, have a high stability and a high reliability, can be used in harsh environments, and improve theapplication range of the aluminum alloy circuit board.

Description

technical field [0001] The invention relates to the field of aluminum alloy substrate printed circuit boards, in particular to a preparation process and equipment for aluminum alloy substrate printed circuit boards. Background technique [0002] As electronic products become more functional, lighter in weight, and smaller in size, this requires higher and higher assembly density and integration of components on printed boards, resulting in higher and higher power consumption per unit area. The larger the value, the higher the heat dissipation requirements of the PCB substrate. The poor heat dissipation of the substrate will lead to overheating of components on the printed circuit board, thereby reducing the reliability of electronic products. [0003] A metal-based PCB consists of a metal base layer, an insulating layer, and a conductive layer. Since a thin insulating layer is coated on the metal substrate, its heat dissipation efficiency is greatly improved. Secondly, th...

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Problems solved by technology

Not only has the characteristics of easy forming, bending and punching of organic plastic-based circuit boards, but also this type of circuit board does not undergo any thermal changes at 400 ° C. It is a very promising material, but glass ceramic materials overcome Although the problem of glass softening at high temperature is solved, it encounters the problem of poor wettability with the metal substrate, which is an insurmountable bottleneck in the manufacture of glass-type aluminum alloy PCBs.

[0006] As mentioned above, the insulation layer of several aluminum alloy substrate PCB circuit boards is difficult to comprehensively design, high degree of freedom, convenient processing, mass production, low manufacturing cost and high heat resistance, ion migration resistance and high breakdown strength, etc. Features, there are problems such as poor stability and reliability, which cause the performance of electronic products to decline and reduce the quality of products

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