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Preparing method of molybdenum tantalum alloy sputtering target material for plane displayer

A flat-panel display and sputtering target technology, which is applied in sputtering coating, metal material coating process, vacuum evaporation coating, etc., can solve the problem of large deformation of the target body, powder purity limit, and product qualification rate Low-level problems, to achieve the effect of less cost investment, guaranteed purity, and excellent comprehensive performance

Active Publication Date: 2018-04-17
丰联科光电(洛阳)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention is prepared by hot isostatic pressing method, which can obtain fine and uniform grain size and improve the strength and toughness, but the target body has a large amount of deformation during the processing process, the product qualification rate is low, and the cost is high , and the invention does not limit the purity of the powder, and does not perform vacuum treatment on the powder, etc., the produced target contains more impurities and has a lower purity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for preparing molybdenum-tantalum alloy sputtering target material for flat panel display, including the following steps:

[0034] 1) Powder selection: screen molybdenum powder and tantalum powder with a purity greater than or equal to 99.95%, put the molybdenum powder and tantalum powder into a vacuum furnace respectively for vacuum pre-sintering, the vacuum degree is less than or equal to 0.01MPa, and the temperature is 1100℃, time is 1h;

[0035] 2) Powder mixing: After the molybdenum powder and tantalum powder obtained in step 1) are sieved through 250 mesh, the Fischer particle size of the molybdenum powder is 3.0-3.5μm, and the Fischer particle size of the tantalum powder is 3.0-3.5μm. The latter molybdenum powder and tantalum powder are mixed according to the weight ratio of molybdenum powder: tantalum powder 80:20, put into a ball mill, and filled with argon gas, the mixing time of the ball mill is 12h, and the molybdenum ball is selected for ball milling in...

Embodiment 2

[0043] A preparation method of molybdenum-tantalum alloy sputtering target material for flat panel display, including the following steps:

[0044] 1) Powder selection: screen molybdenum powder and tantalum powder with a purity greater than or equal to 99.95%, put the molybdenum powder and tantalum powder into a vacuum furnace respectively for vacuum pre-sintering, the vacuum degree is less than or equal to 0.01MPa, and the temperature is 1150℃, time is 1.5h;

[0045] 2) Powder mixing: After sieving the molybdenum powder and tantalum powder obtained in step 1) through 250 meshes, the Fischer particle size of the molybdenum powder is 3.0-3.5μm, and the Fischer particle size of the tantalum powder is 3.0-3.5μm. The latter molybdenum powder and tantalum powder were mixed according to the weight ratio of molybdenum powder: tantalum powder at 82:18, put into a ball mill, and filled with argon gas, the mixing time of the ball mill was 15h, and the molybdenum ball was used for ball millin...

Embodiment 3

[0053] A preparation method of molybdenum-tantalum alloy sputtering target material for flat panel display, including the following steps:

[0054] 1) Powder selection: screen molybdenum powder and tantalum powder with a purity greater than or equal to 99.95%, and put the molybdenum powder and tantalum powder into a vacuum furnace for vacuum pre-sintering. The vacuum degree is less than or equal to 0.01MPa, and the temperature is 1150℃, time is 2h;

[0055] 2) Powder mixing: After sieving the molybdenum powder and tantalum powder obtained in step 1) through 250 mesh, the Fischer particle size of the molybdenum powder is 2.0-2.5μm, and the Fischer particle size of the tantalum powder is 4.0-4.5μm. The latter molybdenum powder and tantalum powder are mixed according to the weight ratio of molybdenum powder: tantalum powder at 84:16, put into a ball mill, and filled with argon gas, the mixing time of the ball mill is 20h, and the molybdenum ball is selected for ball milling in the bal...

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Abstract

The invention discloses a preparing method of a molybdenum tantalum alloy sputtering target material for a plane displayer, and belongs to the technical field of sputtering target materials for planedisplayers. The method comprises following steps of 1, powder selecting; 2, powder mixing; 3, pressing forming; 4, sintering; 5, vacuum heat treatment; 6, rolling; 7, machining and 8 binding packaging. In the preparing process, pollutions are avoided, little resource waste is caused, the cost input is little, and the cost is reduced; in the molybdenum tantalum alloy preparing process, hydrogen absorption embrittlement is prevented, the target material machining performance is improved, the high-density molybdenum tantalum alloy sputtering target material is prepared, the purity of a molybdenumtantalum alloy is ensured, and the high-density molybdenum tantalum alloy target material with the uniform and refined grains can be prepared finally.

Description

Technical field [0001] The invention relates to the technical field of sputtering targets for flat-panel displays, in particular to a method for preparing molybdenum-tantalum alloy sputtering targets for flat-panel displays. Background technique [0002] With the rapid development of the electronics and information industries, the demand for sputtering targets is increasing. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, recording media, flat-panel displays and photovoltaic cells. Because molybdenum has a high melting point, high conductivity, low specific impedance, good corrosion resistance and good environmental performance, molybdenum sputtering targets have been widely used in electronic components and electronic products, such as the currently widely used TFT -LCD (Thin Film Transitor-Liquid Crystal Displays), plasma display screens, thin film solar cells, sensors, semiconductor devices, etc., have broad market pr...

Claims

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Application Information

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IPC IPC(8): C23C14/34C22C1/04C22C27/04
Inventor 孙虎民张雪凤高建杰吕阳阳
Owner 丰联科光电(洛阳)股份有限公司
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