Prepreg composition with low dielectric constant, copper-clad plate and method for manufacturing same

A composition and prepreg technology, applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve the problems of substrate dielectric performance degradation and achieve low dielectric constant, dielectric loss, and thermal expansion coefficient Low, effect of improving dispersion and compatibility

Active Publication Date: 2018-04-27
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polybutadiene resin and maleic anhydride-grafted copolymer are used to prepare high-frequency circuit substrates. The adhesion between the obtained material and copper foil is improved, but due to the addition of polar maleic anhydride to modify Properties, the dielectric properties of the substrate are reduced

Method used

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  • Prepreg composition with low dielectric constant, copper-clad plate and method for manufacturing same
  • Prepreg composition with low dielectric constant, copper-clad plate and method for manufacturing same
  • Prepreg composition with low dielectric constant, copper-clad plate and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Mix 72 parts by weight of ricon100, 28 parts by weight of D1116, 20 parts by weight of LCT, 100 parts by weight of FB-35, and 6.8 parts of DCP, adjust to a suitable viscosity with xylene solvent, stir and mix evenly to make the filler uniform Dispersed in the resin, the prepared glue. Use 1080 glass fiber cloth to impregnate the above glue solution, and then dry to remove the solvent to obtain a non-sticky prepreg. Lay four prepregs together, cover both sides with copper foil with a thickness of 1 oz, and perform temperature program curing in a press with a curing pressure of 60Kg / cm 2 , the curing temperature was 170°C for 2h, and then heated to 270°C and cured for 1h to make a circuit substrate. The wireless data are shown in Table 2.

Embodiment 2

[0040] Embodiments 2, 3, and 4 have the same manufacturing process as that of Embodiment 1, and the ratio of materials is changed as shown in Table 2.

[0041] 3. Comparative example and test example

[0042] The manufacturing process is the same as that of Example 1, except that the thermosetting liquid crystal resin LCT is removed, and the material ratio is shown in Table 2. The physical properties of the circuit substrates prepared according to the above-mentioned different ingredients were analyzed, and the results are shown in Table 2.

[0043] Table 2

[0044]

[0045]

[0046] From the results of physical property data in Table 2, it can be seen that compared with the comparative examples, the dielectric constant and dielectric loss of the circuit substrate materials produced in Examples 1, 2, 3, and 4 are lower, and the high-frequency performance is good. Due to the addition of the thermosetting liquid crystal resin, the cross-linking density of the material is...

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Abstract

The invention provides a prepreg composition with a low dielectric constant, a copper-clad plate and a method for manufacturing the same. The prepreg composition with the low dielectric constant for the copper-clad plate comprises thermoset resin, fillers, curing agents and reinforcement fibers. The copper-clad plate which is a copper-clad laminated plate made of the prepreg composition comprisesa plurality of stacked prepregs and copper foils. The corresponding copper foils cover the single surface or double surfaces of each prepreg by means of compression. The prepreg composition, the copper-clad plate and the method have the advantage that the copper-clad plate has a low dielectric constant and a low thermal expansion coefficient and is low in dielectric loss.

Description

technical field [0001] The invention relates to a composition, in particular to a low-dielectric prepreg composition, a copper clad laminate and a manufacturing method thereof. Background technique [0002] The advancement of modern information technology has brought digital circuits into the stage of high-speed information processing and high-frequency signal transmission. Therefore, on the basis of meeting the needs of traditional design and manufacturing, higher requirements are put forward for the performance of microwave dielectric circuit substrate materials, especially It is a low dielectric copper clad laminate for high frequency. Dielectric constant and dielectric loss are key screening parameters that circuit designers first consider. For a long time, those skilled in the art have conducted in-depth research on high-frequency low-dielectric copper clad laminates. [0003] US5571609A discloses a polybutadiene, polyisoprene resin and unsaturated polyolefin compositi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L47/00C08L51/00C08L53/00C08K7/14B32B15/14B32B15/20B32B17/04B32B17/06B32B37/10B32B37/06B32B38/00
CPCB32B5/02B32B15/14B32B15/20B32B17/061B32B37/06B32B37/10B32B38/00B32B2038/0076B32B2262/101C08L47/00C08L2201/08C08L2203/20C08L2205/03C08L51/00C08K7/14C08L53/00
Inventor 韩梦娜马晓飞卢悦群李强
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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