A Wire Bonding Method Based on Rapid Local Electrodeposition

Abstract

The invention relates to a wire bonding method based on rapid local electrodeposition, which belongs to the technical field of wire connection. The method is as follows: select the new lead material to be bonded and modify it; place the lead material on the surface of the pad through the micro-nano operation platform to ensure good contact between the lead and the surface of the pad; select local electrodeposition The caliber of the precision pipetting dripping tube and the type of anode metal in the dripping tube ensure good contact between the probe at the cathode end of the electroplating and the pad; a metal coating that completely covers the lead material is formed on the surface of the pad by a local electrodeposition method; all soldering is completed After electrodeposition and wire bonding on the pad surface, the overall device is cleaned. Compared with the traditional wire bonding process, the present invention can realize reliable wire bonding of new lead materials. The whole bonding process does not require heating connection, no thermal damage and mechanical damage, simple process flow, fast bonding speed, and is suitable for various The pad material and the connection layer metal have a wide range of options, etc.

Description

technical field [0001] The invention belongs to the technical field of lead wire connection, and relates to a method for wire bonding in electronic packaging technology, specifically, a method for realizing bonding of a new type of wire material by using an electrodeposition method, so as to realize the bonding of the new type of wire bonding material and welding Novel wire-bonding method for interconnecting disks in the solid state. Background technique [0002] With the continuous development and innovation of electronic packaging technology, IC integration density is getting higher and higher. The use of traditional metal wires in wire bonding technology has brought about high resistance and electromigration problems, which seriously affect the power density and reliability of electronic devices. Use new high-conductivity and high-reliability lead materials (such as carbon-based, carbon-surface-enhanced metal-based, carbon-composite metal-based lead materials, etc.) to re...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the unreliable problem of the existing wire bonding technology, and provide a wire bonding method based on rapid local electrodeposition for wire materials (such as carbon-based, carbon-surface-enhanced metal-based, carbon-composite metal-based lead material, etc.) to the pad for wire bonding

The invention can solve the problem that the interconnection between the lead material and the pad cannot be realized by using methods such as thermocompression bonding, ultrasonic bonding, and thermosonic bonding, and realizes rapid selectivity between the lead material and the pad through the local electrodeposition method Interconnection, the whole bonding process does not require heating connection, no thermal damage and mechanical damage, has the advantages of simple process flow, fast bonding speed, suitable for various pad materials, and a wide range of metal types for the connection layer.

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