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A Wire Bonding Method Based on Rapid Local Electrodeposition

A wire bonding and electrodeposition technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of inability to interconnect wire materials and pads, unreliable wire bonding technology, etc., and achieve fast bonding speed. , Reliable wire bonding, no thermal damage effect

Active Publication Date: 2019-10-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the unreliable problem of the existing wire bonding technology, and provide a wire bonding method based on rapid local electrodeposition for wire materials (such as carbon-based, carbon-surface-enhanced metal-based, carbon-composite metal-based lead material, etc.) to the pad for wire bonding
The invention can solve the problem that the interconnection between the lead material and the pad cannot be realized by using methods such as thermocompression bonding, ultrasonic bonding, and thermosonic bonding, and realizes rapid selectivity between the lead material and the pad through the local electrodeposition method Interconnection, the whole bonding process does not require heating connection, no thermal damage and mechanical damage, has the advantages of simple process flow, fast bonding speed, suitable for various pad materials, and a wide range of metal types for the connection layer.

Method used

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  • A Wire Bonding Method Based on Rapid Local Electrodeposition
  • A Wire Bonding Method Based on Rapid Local Electrodeposition
  • A Wire Bonding Method Based on Rapid Local Electrodeposition

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specific Embodiment approach 1

[0027] Specific implementation mode 1: This implementation mode records a wire bonding method based on rapid local electrodeposition. Using the method of local electrodeposition, the new wire material and pad surface that cannot be used in traditional wire bonding technology are realized. Connection, the specific steps of the method are as follows:

[0028] Step 1: Select the wire material to be bonded;

[0029] Step 2: modifying the surface of the lead material selected in step 1, so that the local electrodeposition solution can wet the surface well;

[0030] Step 3: According to the position requirements, place the lead material after surface modification on the surface of the pad through the micro-nano operation platform, ensure that the two ends of the lead are located at the center of the surface of the pad, and ensure that the two ends of the lead are in good contact with the surface of the pad. s contact;

[0031] Step 4: According to the size of the pad, select the d...

specific Embodiment approach 2

[0034] Specific embodiment 2: A wire bonding method based on rapid local electrodeposition according to specific embodiment 1, wherein the lead material is a carbon-based lead material, a carbon-surface-enhanced metal-based lead material, or a carbon-composite metal-based lead Material,

[0035] The carbon-based lead material is carbon fiber, carbon nanotube fiber or graphene sheet; the carbon surface-enhanced metal-based lead material is a surface-oriented growth carbon nanotube metal lead, a surface-oriented growth graphene metal lead or a surface coating Graphene-coated metal foil; the carbon composite metal-based lead material is a carbon nanotube composite metal lead or a graphene composite metal lead; the metal is one of copper, nickel, gold or aluminum.

specific Embodiment approach 3

[0036] Specific embodiment three: a wire bonding method based on rapid local electrodeposition described in specific embodiment one, in step two, the surface modification includes surfactant adsorption modification, laser and plasma etching modification After modification, the electrodeposition solution can be well spread on the lead material, and the surface wetting angle of the lead material is less than 10°.

[0037] Embodiment 4: A wire bonding method based on rapid local electrodeposition described in Embodiment 1, step 5 is specifically: the electrodeposition solution is dripped on the micro-nano operating platform through a precision pipette Ensure that the pipette tip is not below the electrodeposition solution liquid level on the surface of the pad, and the electrodeposition solution dripped from the pipette should completely cover the junction of the pad and lead wire, and at the same time ensure that the electrodeposition solution The deposition solution area should...

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Abstract

The invention relates to a wire bonding method based on rapid local electrodeposition, which belongs to the technical field of wire connection. The method is as follows: select the new lead material to be bonded and modify it; place the lead material on the surface of the pad through the micro-nano operation platform to ensure good contact between the lead and the surface of the pad; select local electrodeposition The caliber of the precision pipetting dripping tube and the type of anode metal in the dripping tube ensure good contact between the probe at the cathode end of the electroplating and the pad; a metal coating that completely covers the lead material is formed on the surface of the pad by a local electrodeposition method; all soldering is completed After electrodeposition and wire bonding on the pad surface, the overall device is cleaned. Compared with the traditional wire bonding process, the present invention can realize reliable wire bonding of new lead materials. The whole bonding process does not require heating connection, no thermal damage and mechanical damage, simple process flow, fast bonding speed, and is suitable for various The pad material and the connection layer metal have a wide range of options, etc.

Description

technical field [0001] The invention belongs to the technical field of lead wire connection, and relates to a method for wire bonding in electronic packaging technology, specifically, a method for realizing bonding of a new type of wire material by using an electrodeposition method, so as to realize the bonding of the new type of wire bonding material and welding Novel wire-bonding method for interconnecting disks in the solid state. Background technique [0002] With the continuous development and innovation of electronic packaging technology, IC integration density is getting higher and higher. The use of traditional metal wires in wire bonding technology has brought about high resistance and electromigration problems, which seriously affect the power density and reliability of electronic devices. Use new high-conductivity and high-reliability lead materials (such as carbon-based, carbon-surface-enhanced metal-based, carbon-composite metal-based lead materials, etc.) to re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60C25D5/02
CPCH01L24/85C25D5/026H01L2224/8591H01L2224/858H01L2224/85H01L2224/49175H01L2224/45565H01L2224/48472H01L2224/48227
Inventor 郑振王春青孔令超刘威
Owner HARBIN INST OF TECH
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