Conductive plugging slurry and preparation method and application thereof

A technology of conductive paste and conductive plug, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. Short, poor flexibility and other problems, to achieve the effect of good stability, stable conductivity, stable dispersion system

Active Publication Date: 2018-06-15
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, to provide a conductive plug hole slurry and its preparation method, to solve the problem of short storage period of the existing conductive plug hole slurry, conductivity stability, high temperature resistance, heat resistance Technical problems such as unsatisfactory performance and poor flexibility

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  • Conductive plugging slurry and preparation method and application thereof
  • Conductive plugging slurry and preparation method and application thereof
  • Conductive plugging slurry and preparation method and application thereof

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preparation example Construction

[0033]On the basis of the above-mentioned conductive plugging paste, the embodiment of the present invention also provides a preparation method of the above-mentioned conductive plugging paste. The process flow of the preparation method of the conductive plug hole slurry is as follows: figure 2 As shown, it includes the following steps:

[0034] Step S01. Measure the components of the conductive plug hole slurry according to the proportion: measure each component according to the components contained in the conductive plug hole slurry and the content of the components described above;

[0035] Step S02. Prepare graphene conductive paste: mix measured graphene, additives and a part of resin components to form graphene conductive paste;

[0036] Step S03. Prepare metal powder conductive paste: mix the measured metal conductive powder, another part of resin and curing agent to form metal powder conductive paste;

[0037] Step S04. Mixing the graphene conductive paste and the m...

Embodiment 1

[0044] This embodiment provides a conductive plug hole paste. The conductive plug hole slurry includes the following mass percentage components:

[0045] Bisphenol A type epoxy resin (China Taiwan Nanya NPEL-128) 6%, bisphenol F type epoxy resin (China Taiwan Nanya NPEL-170) 13%, curing agent (Japan Ajinomoto PN-40, imidazoles) 1%, graphene (the sixth element SE1231) 3%, silver-coated copper powder (SPC-313 of Japan Co., Ltd.) 70%, wetting and dispersing agent (Deqian 903) 1%, diethylene glycol butyl ether (Dow )6%.

[0046] Its preparation method comprises the following steps:

[0047] S11. Stir and mix the graphene, bisphenol F epoxy resin, and wetting and dispersing agent, and then enter the sand mill for grinding and dispersing until the fineness is less than 10 μm, which is the graphene conductive paste;

[0048] S12. Stir and mix silver-coated copper powder, bisphenol A epoxy resin, and latent curing agent, and perform stirring and defoaming treatment in a revolution ...

Embodiment 2

[0051] This embodiment provides a conductive plug hole paste. The conductive plug hole slurry includes the following mass percentage components:

[0052] Novolac epoxy resin (China Taiwan Changchun PNE177) 6%, bisphenol F type epoxy resin (China Taiwan South Asia NPEL-170) 13%, curing agent (OMICURE DDA, dicyandiamide) 1%, graphene (sixth Element SE1231) 3%, silver-coated copper powder (Japan Co., Ltd. SPC-313) 70%, wetting and dispersing agent (Deqian 903) 1%, diethylene glycol butyl ether (Dow) 6%.

[0053] Its preparation method comprises the following steps:

[0054] S11. Stir and mix the graphene, bisphenol F epoxy resin, and wetting and dispersing agent, and then enter the sand mill for grinding and dispersing until the fineness is less than 10 μm, which is the graphene conductive paste;

[0055] S12. Stir and mix silver-coated copper powder, phenolic epoxy resin, and latent curing agent, and perform stirring and defoaming treatment in a revolution and rotation mixer, ...

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Abstract

The invention discloses a conductive plugging slurry and a preparation method and application thereof. The conductive plugging slurry comprises the following components in mass percentage: 0.5 to 5% of graphene, 50 to 80% of metal conductive powder, 10 to 30% of resin, 1 to 5% of curing agents, 0.1 to 3% of auxiliaries, and 1 to 10% of solvents. In addition, the preparation method includes: preparing a graphene conductive slurry; preparing a metal powder conductive slurry, and mixing the graphene conductive slurry and the metal powder conductive slurry. The conductive plugging slurry has the uniform and stable slurry dispersion system; and the storage time is long. After solidification, the formed conductive plugging solidified film has stable conductivity, high-temperature-resistant and heat-resistant characteristics, and high stability; and a breaking phenomenon is avoided.

Description

technical field [0001] The invention belongs to the technical field of conductive materials, and in particular relates to a conductive plug hole slurry and its preparation method and application. Background technique [0002] As electronic products tend to be more multi-functional and miniaturized, circuit boards such as printed circuit boards (PCB) are also developing towards multi-layer, laminated and high-density. This type of circuit board realizes the electrical interconnection between layers through a large number of micro-holes. The traditional process is to deposit copper in the inner wall of the microhole, then use ordinary non-conductive plugging resin to plug the hole, and finally perform copper plating on the surface of the plugging resin. This process is complex and not environmentally friendly (the process contains copper sinking and copper plating processes, which produce a large amount of wastewater pollution and heavy metal pollution, etc.). Furthermore, s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/24H01B13/00
CPCH01B1/22H01B1/24H01B13/00
Inventor 姜宗清胡军辉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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