Manufacturing method of modified teflon copper-clad plate

A technology of polytetrafluoroethylene and its manufacturing method, which is applied in the field of copper clad laminates, can solve the problems of changes in dielectric properties and high thermal expansion coefficient, achieve good dimensional stability, overcome the braiding effect, and improve mechanical properties

Active Publication Date: 2018-06-22
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The above two methods have improved the performance of PTFE copper-clad laminates to a certain extent, but they still cannot solve the problems of changes in dielectric properties and high thermal expansion coefficients at the same time.

Method used

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  • Manufacturing method of modified teflon copper-clad plate
  • Manufacturing method of modified teflon copper-clad plate
  • Manufacturing method of modified teflon copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 1. Recipe

[0041]

[0042] 2. Steps

[0043] (1) Polytetrafluoroethylene modification: 100g of sodium-naphthalene-treated polytetrafluoroethylene powder, 10g of acrylic acid, 100g of absolute ethanol, and 600g of zirconia balls (diameter 1mm) were placed in a stirring ball mill at 10 to 20 °C for 24 hours of wet grinding (stirring speed 650r / min), washed and dried to obtain modified polytetrafluoroethylene.

[0044] (2) Filler modification: 30g of silica, 1.5g of silane coupling agent, 45g of absolute ethanol, and 180g of zirconia balls (1mm in diameter) were placed in a stirring ball mill for wet grinding at room temperature for 24 hours (stirring speed 650r / min) after washing and drying to obtain modified fillers.

[0045] (3) Disperse the modified polytetrafluoroethylene and the modified filler in 100 g of kerosene, and stir at a high speed for 4 hours to obtain a mixed slurry.

[0046] (4) Put the copper foil on the coating machine, use a 200 micron roller to...

Embodiment 2

[0048] 1. Recipe

[0049]

[0050] 2. Steps

[0051] (1) Polytetrafluoroethylene modification: 100g of sodium-naphthalene-treated polytetrafluoroethylene powder, 10g of acrylic acid, 100g of absolute ethanol, and 600g of zirconia balls (diameter 1mm) were placed in a stirring ball mill at 10 to 20 °C for 24 hours of wet grinding (stirring speed at 650 / min), then washed and dried to obtain modified polytetrafluoroethylene.

[0052] (2) Filler modification: 30g of silica, 1.5g of silane coupling agent, 45g of absolute ethanol, and 180g of zirconia balls (1mm in diameter) were placed in a stirring ball mill for wet grinding at room temperature for 24h (stirring speed Turn 650 / min) after washing and drying to obtain the modified filler.

[0053] (3) Disperse the modified polytetrafluoroethylene and the modified filler in 100 g of kerosene, and stir at a high speed for 4 hours to obtain a mixed slurry.

[0054] (4) Put the copper foil on the coating machine, use a 200-micron ...

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Abstract

The invention discloses a manufacturing method of a modified teflon copper-clad plate. The method comprises the following steps: (1) modifying sodium-naphthalene treated teflon through a grafting monomer to obtain modified teflon; (2) modifying a filler through a coupling agent to obtain a modified filler; (3) dispersing the modified teflon obtained in the step (1) into kerosene, then adding the modified filler obtained in the step (2), mixing to obtain a slurry; (4) coating the slurry obtained in the step (3) on a copper foil, and pressing to obtain the modified teflon copper-clad plate. Thepressed copper-clad plate does not contain a glass fabric and effectively avoids the effect of glass weaving; the pressed teflon copper-clad plate has the advantages of stable dielectric property, lowcoefficient of thermal expansion, good size stability and the like.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, in particular to a preparation method of modified polytetrafluoroethylene copper clad laminates. Background technique [0002] With the rapid development of social informatization, the high speed of information processing and the significant increase in the amount of information processing, mobile communications such as mobile phones and car phones used in the high-frequency field of 800MHz to Gigabit are becoming more and more widespread. In order to achieve the increase in the number of channels, the goal of high performance and multi-function, as well as large-scale electronic computers, electronic switches, microwave strip antennas, satellite communication equipment, etc. operating in the high-frequency and even microwave fields, substrate materials for printed circuit boards put forward higher requirements. [0003] As a high-frequency printed board substrate material, copper ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06C08L51/00C08K9/06C08K3/36C08F259/08C08F220/06
CPCB32B37/06B32B37/10C08F259/08C08K3/36C08K9/06C08F220/06C08L51/003
Inventor 马晓飞韩梦娜卢悦群李强
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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