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Method for preparing regular hexagonal Cu7S4 nanosheet material

A technology of regular hexagonal and nanosheets, which is applied in the field of preparation of regular hexagonal Cu7S4 nanosheet materials, can solve the problems of complex washing process, high toxicity of raw materials, high price, etc., and achieve low reaction temperature, low toxicity and cheap raw materials, The effect of short production cycles

Inactive Publication Date: 2018-09-18
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It can be seen that the process is very complicated, and the raw materials used are highly toxic and expensive
Especially the washing process is complicated, and the chloroform used is easily oxidized by oxygen in the air under light conditions to generate highly toxic phosgene (COCl 2 ), there is a large potential safety hazard, which is not conducive to industrial production

Method used

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  • Method for preparing regular hexagonal Cu7S4 nanosheet material
  • Method for preparing regular hexagonal Cu7S4 nanosheet material
  • Method for preparing regular hexagonal Cu7S4 nanosheet material

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Effect test

Embodiment 1

[0021] The regular hexagonal Cu 7 S 4 The preparation method of nano sheet material, its concrete steps comprise:

[0022] Step 1. Add 2mmol copper source to 6mL triethanolamine and ultrasonically stir evenly (stirring speed is 250rpm, ultrasonic treatment frequency is 40KHz) to completely dissolve the raw material, and then heat to 60°C for 10min to obtain a copper precursor solution; the copper source is copper nitrate;

[0023] Step 2. Add 1mmol of sulfur source to 36mL of oleic acid and dissolve it with ultrasonic stirring (stirring speed is 250rpm, ultrasonic treatment frequency is 40KHz) to prepare sulfur precursor solution; wherein the sulfur source is sodium thiosulfate, copper and sulfur in the copper source The molar ratio of sulfur in the source is 1:1; the volume ratio of triethanolamine in step 1 and oleic acid in step 2 is 1:6;

[0024] Step 3. Inject the sulfur precursor solution obtained in step 2 into the copper precursor solution obtained in step 1, heat t...

Embodiment 2

[0028] The regular hexagonal Cu 7 S 4 The preparation method of nano sheet material, its concrete steps comprise:

[0029]Step 1. Add 2mmol copper source to 6mL triethanolamine and ultrasonically stir evenly (stirring speed is 250rpm, ultrasonic treatment frequency is 40KHz) to completely dissolve the raw material, and then heat to 60°C for 10min to obtain a copper precursor solution; the copper source is copper nitrate;

[0030] Step 2. Add 2mmol of sulfur source to 36mL of oleic acid and ultrasonically stir and dissolve (stirring speed is 250rpm, ultrasonic treatment frequency is 40KHz) to prepare a sulfur precursor solution; the sulfur source is sodium thiosulfate, copper and sulfur in the copper source The molar ratio of sulfur in the source is 1:2; the volume ratio of triethanolamine in step 1 and oleic acid in step 2 is 1:6;

[0031] Step 3. Inject the sulfur precursor solution obtained in step 2 into the copper precursor solution obtained in step 1, heat to 60° C. fo...

Embodiment 3

[0035] The regular hexagonal Cu 7 S 4 The preparation method of nano sheet material, its concrete steps comprise:

[0036] Step 1. Add 2mmol copper source to 6mL triethanolamine and ultrasonically stir evenly (stirring speed is 250rpm, ultrasonic treatment frequency is 40KHz) to completely dissolve the raw material, and then heat to 60°C for 10min to obtain a copper precursor solution; the copper source is copper nitrate;

[0037] Step 2. Add 3mmol of sulfur source to 36mL of oleic acid and ultrasonically stir and dissolve (stirring speed is 250rpm, ultrasonic treatment frequency is 40KHz) to prepare a sulfur precursor solution; the sulfur source is sodium thiosulfate, and the copper and sulfur in the copper source are The molar ratio of sulfur in the source is 1:3; the volume ratio of triethanolamine in step 1 and oleic acid in step 2 is 1:6;

[0038] Step 3. Inject the sulfur precursor solution obtained in step 2 into the copper precursor solution obtained in step 1, heat...

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Abstract

The invention relates to a method for preparing a regular hexagonal Cu7S4 nanosheet material, and belongs to the technical field of nano materials. A Cu7S4 nano material is prepared by a liquid phaseassisted solvothermal method, copper and sulfur precursor solutions are separately prepared, the copper and sulfur precursor solutions are mixed for complexing to form a copper sulfur compound precursor solution, the copper sulfur compound precursor solution is transferred to a reaction vessel to fully react to obtain a monodisperse Cu7S4 product, an organic solvent is separated to obtain a pure Cu7S4 product, and the pure Cu7S4 product is finally dried to obtain a regular hexagonal Cu7S4 nanosheet product with a uniform size. The method is novel, simple, well-controllable and low-cost, and opens up a new path for the industrial production of Cu7S4 nanocrystalline materials.

Description

technical field [0001] The invention relates to a regular hexagonal Cu 7 S 4 The invention discloses a method for preparing nano sheet materials, belonging to the technical field of nano materials. Background technique [0002] Copper sulfide semiconductor nanomaterials are an important transition metal sulfide and also an important P-type semiconductor nanomaterial. Due to quantum size effects, surface effects and macroscopic quantum tunneling effects, copper sulfide nanocrystal materials have properties that bulk materials cannot Compared with photoelectric characteristics, catalytic ability, high conductivity and high-energy capacitance characteristics, it has broad application prospects in solar photoelectric conversion, lithium-ion batteries, degradation of organic pollutants, photothermal, dye-sensitized battery counter electrodes, supercapacitors, etc. . [0003] Copper sulfide has a complex structure and various chemical valence states, while Cu 7 S 4 It is one ...

Claims

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Application Information

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IPC IPC(8): C01G3/12B82Y30/00B82Y40/00
CPCB82Y30/00B82Y40/00C01G3/12C01P2004/22
Inventor 朱艳卢勇孙淑红沈韬
Owner KUNMING UNIV OF SCI & TECH